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TDA4VM88TGBALFR

Texas Instruments

TDA4VM88TGBALFR by Texas Instruments

TDA4VM88TGBALFR by Texas Instruments is a 64-bit microprocessor with integrated cache and 32-bit external data bus width. It operates at a max clock frequency of 27 MHz, making it suitable for industrial applications requiring high-speed processing. With low power mode and boundary scan capabilities, this CMOS technology-based processor offers efficient performance in various embedded systems.

Median Price

$98.620

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 362 parts In-Stock

1+ parts

$98.620

100+ parts

$95.654

1k+ parts

$74.150

10k+ parts

-

362

$98.620

$95.654

$74.150

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DigiKey

USA . 489 parts In-Stock

1+ parts

$174.620

100+ parts

$141.892

1k+ parts

$131.284

10k+ parts

-

489

$174.620

$141.892

$131.284

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Mouser Electronics

USA . 240 parts In-Stock

1+ parts

-

100+ parts

-

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$94.760

10k+ parts

$94.750

240

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-

$94.760

$94.750

Distributors (In-Stock)

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Digiode

USA . 4,070 parts In-Stock

1+ parts

$93.689

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4,070

$93.689

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$110.879

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10

$110.879

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Vyrian

USA . 3,847 parts In-Stock

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3,847

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Chip Stock

USA . 2,575 parts In-Stock

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2,575

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Distributors (Availability)

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Parana Technologies

USA . 1,645 parts In-Stock

1+ parts

$69.649

100+ parts

-

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1,645

$69.649

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Corohmni

South Africa . 396 parts In-Stock

1+ parts

$72.508

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396

$72.508

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ChromeModa Solutions

Germany . 2,410 parts In-Stock

1+ parts

$78.257

100+ parts

$64.171

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2,410

$78.257

$64.171

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IDEA Electronic Components Group

UK . 392 parts In-Stock

1+ parts

$78.257

100+ parts

$74.344

1k+ parts

$70.431

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392

$78.257

$74.344

$70.431

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Ampacity Inc.

Singapore . 119 parts In-Stock

1+ parts

$80.550

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119

$80.550

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Corphita

USA . 741 parts In-Stock

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$88.758

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741

$88.758

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Continental Prestige Electronics

USA . 2,669 parts In-Stock

1+ parts

$110.879

100+ parts

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10k+ parts

$108.661

2,669

$110.879

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$108.661

Microchip USA

USA . 1,397 parts In-Stock

1+ parts

$156.750

100+ parts

$154.020

1k+ parts

$152.660

10k+ parts

$151.300

1,397

$156.750

$154.020

$152.660

$151.300

Lixinc

USA . 6,616 parts In-Stock

1+ parts

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6,616

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Argo Parts USA

USA . 4,428 parts In-Stock

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4,428

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DigiPath Technology Company

USA . 2,270 parts In-Stock

1+ parts

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$70.557

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2,270

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$70.557

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Overview

Experience unparalleled performance and reliability with the TDA4VM88TGBALFR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-of-the-line microprocessors that are versatile and efficient. Ideal for a wide range of applications, this product offers customers exceptional value, benefits, and advantages. Whether you're looking to enhance your system's capabilities or streamline processes, the TDA4VM88TGBALFR is the perfect choice for all your needs. Unlock new possibilities and elevate your projects with this cutting-edge microprocessor from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and cost-effective.

Integrated Cache: YES

Integrated cache enhances the performance and efficiency of the microprocessor.

Maximum Supply Voltage: 0.84 V

Higher maximum supply voltage allows for better performance capabilities.

On Chip Data RAM Width: 8

Wider data RAM width enables faster data processing.

Package Shape: SQUARE

Square package shape allows for efficient space utilization.

Bit Size: 64

64-bit architecture provides high computing power and performance.

No. of Terminals: 827

A higher number of terminals enable connectivity with various components.

Minimum Supply Voltage: 0.76 V

Lower minimum supply voltage helps in reducing power consumption.

Maximum Operating Temperature: 105 °C

High maximum operating temperature ensures reliability even in extreme conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature range allows for use in varying environments.

Terminal Finish: TIN SILVER COPPER

Tin, silver, and copper terminal finish provides good conductivity and reliability.

RAM Words: 9961472

Large RAM capacity allows for efficient storage and retrieval of data.

Width: 24 mm

Compact width size enables easy integration into various systems.

Boundary Scan: YES

Boundary scan feature aids in testing and debugging during development.

External Data Bus Width: 32

Wider external data bus width enhances data transfer speed.

Maximum Clock Frequency: 27 MHz

Higher clock frequency allows for faster processing speeds.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture in the microprocessor enhances performance efficiency.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form provides good connectivity and ease of installation.

Nominal Supply Voltage: 0.8 V

Stable nominal supply voltage ensures consistent performance.

No. of Serial I/Os: 26

Multiple serial I/Os allow for versatile connectivity options.

Terminal Pitch: 0.8 mm

Narrow terminal pitch enables compact design and layout.

Format: FLOATING-POINT

Floating-point format enhances precision in mathematical calculations.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, suitable for most environments.

Speed: 2000 rpm

High speed capability allows for quick data processing and response times.

Low Power Mode: YES

Low power mode feature helps in reducing energy consumption during idle periods.

Technical Specifications

Microprocessors TDA4VM88TGBALFR attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

0

Bit Size:

64

Boundary Scan:

YES

Maximum Clock Frequency:

27 MHz

External Data Bus Width:

32

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B827

JESD-609 Code:

e1

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

1

No. of Serial I/Os:

26

No. of Terminals:

827

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA827,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

RAM Words:

9961472

Maximum Seated Height:

2.8 mm

Speed:

2000 rpm

Maximum Supply Voltage:

.84 V

Minimum Supply Voltage:

.76 V

Nominal Supply Voltage:

.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TDA4VM88TGBALFR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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