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DM3730CUS100NEP

Texas Instruments

DM3730CUS100NEP by Texas Instruments

Texas Instruments DM3730CUS100NEP microprocessor features 32-bit architecture, 26-bit address bus, and integrated cache. Ideal for low power applications with a max clock frequency of 54 MHz. Suitable for mobile devices, automotive systems, and industrial automation due to its compact size and high performance capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,993 parts In-Stock

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3,993

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Digiode

USA . 2,073 parts In-Stock

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2,073

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,427 parts In-Stock

1+ parts

$5.000

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1,427

$5.000

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AZTECH Wire

Italy . 679 parts In-Stock

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$11.154

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679

$11.154

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One Stop Electronics

USA . 1,012 parts In-Stock

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$27.000

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1,012

$27.000

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Semicontronic

India . 823 parts In-Stock

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$30.000

100+ parts

$29.250

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$29.100

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823

$30.000

$29.250

$29.100

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Corohmni

South Africa . 242 parts In-Stock

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$55.650

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242

$55.650

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Parana Technologies

USA . 1,783 parts In-Stock

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$67.869

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1,783

$67.869

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ChromeModa Solutions

Germany . 4,961 parts In-Stock

1+ parts

$76.257

100+ parts

$62.531

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4,961

$76.257

$62.531

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IDEA Electronic Components Group

UK . 1,023 parts In-Stock

1+ parts

$76.257

100+ parts

$72.444

1k+ parts

$68.631

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1,023

$76.257

$72.444

$68.631

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Argo Parts USA

USA . 4,797 parts In-Stock

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4,797

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Corphita

USA . 3,748 parts In-Stock

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3,748

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Continental Prestige Electronics

USA . 1,618 parts In-Stock

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1,618

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DigiPath Technology Company

USA . 658 parts In-Stock

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$68.753

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658

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$68.753

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Bastille Electronics

Australia . 120 parts In-Stock

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120

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Overview

Experience the power and reliability of Texas Instruments with the DM3730CUS100NEP Microprocessor. Crafted with high-quality materials and cutting-edge technology, this device is perfect for a wide range of applications. From smartphones to industrial automation, this microprocessor offers unmatched performance and efficiency. Trust in Texas Instruments for top-of-the-line products that deliver exceptional value and benefits to customers. Elevate your projects with the DM3730CUS100NEP and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the microprocessor easy to handle and install.

Integrated Cache: YES

Having integrated cache helps in improving the performance of the microprocessor by reducing the access time to frequently used data.

Maximum Supply Voltage: 1.2 V

Operating within a low maximum supply voltage helps in reducing power consumption and heat generation.

Address Bus Width: 26

A wider address bus allows for larger memory addressing capabilities, enhancing the overall processing capabilities of the microprocessor.

Bit Size: 32

A 32-bit architecture provides faster data processing and instruction execution compared to lower bit sizes.

No. of Terminals: 423

Having a large number of terminals allows for more connectivity options and functionalities to be integrated with the microprocessor.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature ensures stability and reliability of the microprocessor even under demanding usage conditions.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture enables efficient and faster processing of instructions, making the microprocessor suitable for high-performance computing tasks.

Technology: CMOS

CMOS technology offers lower power consumption and faster switching speeds, making the microprocessor energy-efficient and high performing.

Speed: 1000 rpm

The high speed capability of the microprocessor allows for swift data processing and execution, optimizing overall system performance.

Technical Specifications

Microprocessors DM3730CUS100NEP attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

54 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B423

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

423

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA423,24X24,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

1.4 mm

Speed:

1000 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

37 mA

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.14 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

DM3730CUS100NEP Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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