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DM3730CBCA

Texas Instruments

DM3730CBCA by Texas Instruments

Texas Instruments DM3730CBCA is a 32-bit microprocessor with 1.2V supply, 54MHz clock frequency, and 16384 RAM words. Ideal for industrial applications, it features a RISC architecture, 128 DMA channels, and low power mode for efficient performance in various embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,652 parts In-Stock

1+ parts

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2,652

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Digiode

USA . 1,290 parts In-Stock

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1,290

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 577 parts In-Stock

1+ parts

$7.585

100+ parts

-

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577

$7.585

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AZTECH Wire

Italy . 646 parts In-Stock

1+ parts

$9.868

100+ parts

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646

$9.868

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One Stop Electronics

USA . 1,503 parts In-Stock

1+ parts

$17.000

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1,503

$17.000

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Ampacity Inc.

Singapore . 916 parts In-Stock

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$26.000

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916

$26.000

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Parana Technologies

USA . 1,309 parts In-Stock

1+ parts

$53.833

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1,309

$53.833

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ChromeModa Solutions

Germany . 6,912 parts In-Stock

1+ parts

$60.487

100+ parts

$49.599

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6,912

$60.487

$49.599

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IDEA Electronic Components Group

UK . 1,099 parts In-Stock

1+ parts

$60.487

100+ parts

$57.463

1k+ parts

$54.438

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1,099

$60.487

$57.463

$54.438

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Microchip USA

USA . 2,649 parts In-Stock

1+ parts

$83.310

100+ parts

$81.860

1k+ parts

$81.140

10k+ parts

$80.420

2,649

$83.310

$81.860

$81.140

$80.420

Corphita

USA . 3,600 parts In-Stock

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3,600

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Northwest PG Solutions

USA . 2,286 parts In-Stock

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$7.433

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2,286

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$7.433

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DigiPath Technology Company

USA . 1,740 parts In-Stock

1+ parts

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$54.535

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1,740

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$54.535

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Overview

Unleash the power of cutting-edge technology with the DM3730CBCA microprocessor from Texas Instruments. Designed with top-notch quality and precision, this microprocessor offers unparalleled performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this versatile chip delivers seamless operation and lightning-fast speeds, making it the perfect choice for your next project. Experience the value and efficiency of Texas Instruments' expertise in microprocessors with the DM3730CBCA. Elevate your designs with this innovative solution that sets new standards in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance between durability and cost-effectiveness for the product.

Integrated Cache: YES

Having an integrated cache improves the performance of the microprocessor by reducing memory access times.

Maximum Supply Voltage: 1.2 V

The low maximum supply voltage helps in reducing power consumption and heat generation.

On Chip Data RAM Width: 8

Having a wider data RAM width allows for faster data processing and storage on the chip.

Address Bus Width: 26

A wider address bus width allows for greater memory addressing capability and higher processing speeds.

Package Shape: SQUARE

The square package shape makes it easier for mounting and integrating the microprocessor in various systems.

Bit Size: 32

The 32-bit architecture provides a good balance between performance and compatibility with software applications.

Power Supplies (V): 1.2,1.8

Having multiple power supply options allows for flexibility in different system designs and power requirements.

No. of Terminals: 515

The high number of terminals enables connectivity with a wide range of peripheral devices and components.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style provides a compact form factor and efficient heat dissipation for the microprocessor.

Minimum Supply Voltage: 1.08 V

The low minimum supply voltage ensures stable operation at low power levels, improving energy efficiency.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature range ensures reliable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows for use in extreme conditions without performance degradation.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

This terminal finish provides good conductivity and corrosion resistance for long-term reliability.

Terminal Position: BOTTOM

The bottom terminal position allows for easy soldering and installation on PCBs.

Maximum Seated Height: 1 mm

The low seated height enables compact system designs and improves airflow for cooling.

RAM Words: 16384

The large RAM capacity allows for efficient data storage and processing on the microprocessor.

Width: 14 mm

The compact width of the microprocessor makes it suitable for integration into small form factor devices.

Boundary Scan: YES

Having boundary scan capability allows for easier testing and debugging of the microprocessor during manufacturing.

External Data Bus Width: 16

A wider external data bus width enables faster data transfer between the microprocessor and peripheral devices.

Maximum Clock Frequency: 54 MHz

The high maximum clock frequency allows for high-speed processing and responsiveness in real-time applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable soldering and assembly of the microprocessor on PCBs.

Length: 14 mm

The compact length of the microprocessor complements its width for space-efficient designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh environmental conditions.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC type microprocessor enables efficient and optimized processing of instructions for improved performance.

Technology: CMOS

The CMOS technology provides a good balance between power consumption, speed, and integration capabilities for the microprocessor.

Terminal Form: BALL

The ball terminal form allows for reliable electrical connections and ease of testing during manufacturing.

Maximum Supply Current: 1400 mA

The high maximum supply current ensures stable operation even under peak load conditions.

Nominal Supply Voltage: 1.14 V

The nominal supply voltage provides a baseline for stable and efficient operation of the microprocessor.

No. of DMA Channels: 128

Having a high number of DMA channels enables efficient data transfer and processing for enhanced performance.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting and compact PCB designs.

Format: FLOATING POINT

The floating-point format enables high precision calculations and processing for complex mathematical operations.

Moisture Sensitivity Level (MSL): 3

The MSL rating of 3 indicates moderate moisture sensitivity, suitable for a wide range of manufacturing and operating environments.

Speed: 800 rpm

The high speed capability of the microprocessor allows for quick data processing and real-time responsiveness.

Low Power Mode: YES

Having a low power mode option enables energy-efficient operation for battery-powered devices or applications requiring power saving features.

Technical Specifications

Microprocessors DM3730CBCA attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

54 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B515

JESD-609 Code:

e1

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

128

No. of Terminals:

515

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA515,26X26,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

1 mm

Speed:

800 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

1400 mA

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.14 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

DM3730CBCA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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