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DM3730CUSA

Texas Instruments

DM3730CUSA by Texas Instruments

The Texas Instruments DM3730CUSA microprocessor features 32-bit architecture, 1.2V supply voltage, and 54MHz clock frequency. Ideal for industrial applications requiring a low-profile package with integrated cache and boundary scan capabilities.

Median Price

$59.350

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 21,210 parts In-Stock

1+ parts

$36.402

100+ parts

$32.357

1k+ parts

$23.792

10k+ parts

-

21,210

$36.402

$32.357

$23.792

-

DigiKey

USA . 65 parts In-Stock

1+ parts

$59.350

100+ parts

$43.710

1k+ parts

$42.619

10k+ parts

-

65

$59.350

$43.710

$42.619

-

Mouser Electronics

USA . 56 parts In-Stock

1+ parts

$59.350

100+ parts

$42.330

1k+ parts

-

10k+ parts

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56

$59.350

$42.330

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,624 parts In-Stock

1+ parts

$34.582

100+ parts

-

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-

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1,624

$34.582

-

-

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Nova Conductors

Japan . 46 parts In-Stock

1+ parts

$41.398

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-

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46

$41.398

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-

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Vyrian

USA . 4,098 parts In-Stock

1+ parts

-

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4,098

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Cyclops Electronics Ltd

UK . 3,000 parts In-Stock

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-

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3,000

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Martec Srl

Italy . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 6,778 parts In-Stock

1+ parts

$30.940

100+ parts

$30.166

1k+ parts

$30.012

10k+ parts

-

6,778

$30.940

$30.166

$30.012

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Ampacity Inc.

Singapore . 6,695 parts In-Stock

1+ parts

$30.940

100+ parts

-

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6,695

$30.940

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Corphita

USA . 1,000 parts In-Stock

1+ parts

$32.762

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-

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1,000

$32.762

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Continental Prestige Electronics

USA . 4,671 parts In-Stock

1+ parts

$41.398

100+ parts

-

1k+ parts

-

10k+ parts

$40.570

4,671

$41.398

-

-

$40.570

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$41.398

100+ parts

-

1k+ parts

$39.328

10k+ parts

$38.500

1,000

$41.398

-

$39.328

$38.500

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$42.226

100+ parts

$42.226

1k+ parts

$42.226

10k+ parts

-

2,000

$42.226

$42.226

$42.226

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Corohmni

South Africa . 52 parts In-Stock

1+ parts

$43.590

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-

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52

$43.590

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Parana Technologies

USA . 804 parts In-Stock

1+ parts

$73.924

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804

$73.924

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ChromeModa Solutions

Germany . 1,066 parts In-Stock

1+ parts

$83.061

100+ parts

$68.110

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-

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1,066

$83.061

$68.110

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IDEA Electronic Components Group

UK . 448 parts In-Stock

1+ parts

$83.061

100+ parts

$78.908

1k+ parts

$74.755

10k+ parts

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448

$83.061

$78.908

$74.755

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Microchip USA

USA . 977 parts In-Stock

1+ parts

$102.856

100+ parts

-

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977

$102.856

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Lixinc

USA . 14,404 parts In-Stock

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14,404

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Argo Parts USA

USA . 3,545 parts In-Stock

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3,545

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DigiPath Technology Company

USA . 2,244 parts In-Stock

1+ parts

-

100+ parts

$74.888

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2,244

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$74.888

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GreenTree Electronics

Israel . 1,350 parts In-Stock

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1,350

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Perfect Parts

USA . 370 parts In-Stock

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370

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Futuretech Components

Singapore . 360 parts In-Stock

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360

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Speed Components Ltd (Excess)

Israel . 10 parts In-Stock

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10

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Overview

Unleash the power of cutting-edge technology with the DM3730CUSA microprocessor by Texas Instruments. This top-quality product offers unparalleled performance and reliability, making it the perfect choice for a wide range of applications. With features like integrated cache, low power mode, and boundary scan, this microprocessor delivers exceptional value and benefits to customers. Trust in Texas Instruments for innovation, quality, and excellence in every product they create. Elevate your projects to new heights with the DM3730CUSA microprocessor today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the microprocessor.

Integrated Cache: YES

Having integrated cache helps in improving the processing speed and efficiency of the microprocessor.

Maximum Supply Voltage: 1.2 V

Operating within a low maximum supply voltage helps in reducing power consumption and heat generation.

On Chip Data RAM Width: 8

Having a wider on chip data RAM width allows for faster data processing and multitasking capabilities.

Address Bus Width: 26

With a wider address bus width, the microprocessor can access more memory locations and perform complex operations efficiently.

Package Shape: SQUARE

The square package shape can offer better thermal management and easier integration into various system designs.

Bit Size: 32

A 32-bit architecture allows for handling larger chunks of data and performing calculations more efficiently.

Power Supplies (V): 1.2,1.8

Having multiple power supply options provides flexibility in different operating environments and power efficiency requirements.

No. of Terminals: 423

The higher number of terminals allows for more connections and functionalities to be supported by the microprocessor.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers compact design, easy mounting, and efficient signal transmission for the microprocessor.

Minimum Supply Voltage: 1.08 V

Operating at a low minimum supply voltage ensures stable performance and energy efficiency.

Maximum Operating Temperature: 105 °C

Being able to operate at high temperatures makes this microprocessor suitable for industrial and harsh environments.

Minimum Operating Temperature: -40 °C

With a wide temperature range, this microprocessor can function in extreme cold conditions as well.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The terminal finish provides good electrical conductivity, corrosion resistance, and solderability for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position enables easier PCB layout and better thermal dissipation.

Maximum Seated Height: 1.4 mm

The low maximum seated height allows for compact system designs and efficient heat dissipation.

RAM Words: 16384

Having a large RAM capacity enables the microprocessor to handle and store more data for processing tasks.

Width: 16 mm

The compact width makes this microprocessor suitable for space-constrained applications.

Boundary Scan: YES

Boundary scan capability helps in testing and diagnosing the microprocessor during production and operation.

External Data Bus Width: 16

With a wider external data bus width, the microprocessor can transfer data faster between external devices.

Maximum Clock Frequency: 54 MHz

Operating at a high clock frequency allows the microprocessor to process instructions quickly and handle high-speed tasks.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures the solder joints are properly formed and reliable during manufacturing.

Length: 16 mm

The compact length of the microprocessor allows for efficient placement in various system designs.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature ranges makes this microprocessor suitable for rugged applications and harsh environments.

Peripheral IC Type: MICROPROCESSOR, RISC

The microprocessor with RISC architecture offers high performance, efficiency, and scalability for diverse computing tasks.

Technology: CMOS

CMOS technology provides low power consumption, high speed, and reliability for the microprocessor.

Terminal Form: BALL

Ball terminal form facilitates easy soldering and reliable connections in the microprocessor.

Maximum Supply Current: 1400 mA

The maximum supply current rating indicates the power consumption capability of the microprocessor under load conditions.

Nominal Supply Voltage: 1.14 V

Operating at a nominal supply voltage ensures stable performance and energy efficiency for the microprocessor.

No. of DMA Channels: 128

Having a high number of DMA channels allows for efficient data transfer and processing tasks in the microprocessor.

Terminal Pitch: 0.65 mm

The compact terminal pitch helps in achieving high-density mounting and efficient signal transmission in the microprocessor.

Format: FLOATING POINT

The floating-point format enables the microprocessor to perform complex mathematical calculations with high precision.

Moisture Sensitivity Level (MSL): 3

The MSL rating of 3 indicates that the microprocessor is suitable for standard moisture exposure levels during handling and assembly.

Speed: 800 rpm

With a high speed rating, this microprocessor can handle processing tasks quickly and efficiently.

Low Power Mode: YES

Having a low power mode option helps in reducing power consumption and extending battery life in portable devices.

Technical Specifications

Microprocessors DM3730CUSA attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

54 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B423

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

128

No. of Terminals:

423

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA423,24X24,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

1.4 mm

Speed:

800 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

1400 mA

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.14 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

16 mm

Peripheral IC Type:

Trade Compliance

DM3730CUSA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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