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DM3725CUSD100

Texas Instruments

DM3725CUSD100 by Texas Instruments

The Texas Instruments DM3725CUSD100 microprocessor features a 32-bit architecture with 26-bit address bus width and integrated cache. Operating at a max clock frequency of 54 MHz, it is suitable for industrial applications requiring low power consumption and high-speed processing. With a terminal pitch of 0.65 mm and peripheral IC type as RISC, this processor offers efficient performance in compact designs.

Median Price

$57.840

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 486 parts In-Stock

1+ parts

$35.707

100+ parts

$31.740

1k+ parts

$23.338

10k+ parts

-

486

$35.707

$31.740

$23.338

-

Mouser Electronics

USA . 338 parts In-Stock

1+ parts

$57.840

100+ parts

$41.470

1k+ parts

-

10k+ parts

-

338

$57.840

$41.470

-

-

DigiKey

USA . 90 parts In-Stock

1+ parts

$63.180

100+ parts

$46.672

1k+ parts

$45.521

10k+ parts

-

90

$63.180

$46.672

$45.521

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,041 parts In-Stock

1+ parts

$33.922

100+ parts

-

1k+ parts

-

10k+ parts

-

1,041

$33.922

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$36.494

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$36.494

-

-

-

Vyrian

USA . 2,280 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,280

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 659 parts In-Stock

1+ parts

$6.838

100+ parts

-

1k+ parts

-

10k+ parts

-

659

$6.838

-

-

-

Parana Technologies

USA . 242 parts In-Stock

1+ parts

$24.122

100+ parts

-

1k+ parts

$24.773

10k+ parts

-

242

$24.122

-

$24.773

-

DigiPath Technology Company

USA . 535 parts In-Stock

1+ parts

$26.561

100+ parts

$24.436

1k+ parts

-

10k+ parts

-

535

$26.561

$24.436

-

-

IDEA Electronic Components Group

UK . 1,803 parts In-Stock

1+ parts

$27.103

100+ parts

$25.748

1k+ parts

$24.393

10k+ parts

-

1,803

$27.103

$25.748

$24.393

-

ChromeModa Solutions

Germany . 1,527 parts In-Stock

1+ parts

$27.103

100+ parts

$22.224

1k+ parts

-

10k+ parts

-

1,527

$27.103

$22.224

-

-

Ampacity Inc.

Singapore . 157 parts In-Stock

1+ parts

$30.350

100+ parts

-

1k+ parts

-

10k+ parts

-

157

$30.350

-

-

-

Semicontronic

India . 118 parts In-Stock

1+ parts

$30.350

100+ parts

$29.591

1k+ parts

$29.440

10k+ parts

-

118

$30.350

$29.591

$29.440

-

Corphita

USA . 3,850 parts In-Stock

1+ parts

$32.136

100+ parts

-

1k+ parts

-

10k+ parts

-

3,850

$32.136

-

-

-

Bastille Electronics

Australia . 300 parts In-Stock

1+ parts

$36.490

100+ parts

$34.666

1k+ parts

-

10k+ parts

$32.476

300

$36.490

$34.666

-

$32.476

Continental Prestige Electronics

USA . 977 parts In-Stock

1+ parts

$36.494

100+ parts

-

1k+ parts

-

10k+ parts

$35.764

977

$36.494

-

-

$35.764

Corohmni

South Africa . 826 parts In-Stock

1+ parts

$39.800

100+ parts

-

1k+ parts

-

10k+ parts

-

826

$39.800

-

-

-

Component Stockers USA

USA . 4,184 parts In-Stock

1+ parts

$41.580

100+ parts

-

1k+ parts

-

10k+ parts

-

4,184

$41.580

-

-

-

Advanced Electronics

New Zealand . 54 parts In-Stock

1+ parts

$46.168

100+ parts

$42.475

1k+ parts

$39.800

10k+ parts

-

54

$46.168

$42.475

$39.800

-

Microchip USA

USA . 1,918 parts In-Stock

1+ parts

$80.120

100+ parts

-

1k+ parts

-

10k+ parts

-

1,918

$80.120

-

-

-

Argo Parts USA

USA . 617 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

617

-

-

-

-

A-Z Elektronik GmbH

Germany . 104 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

104

-

-

-

-

Overview

Unlock the power of cutting-edge technology with the DM3725CUSD100 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unmatched quality and reliability in microprocessors. This versatile product is ideal for a wide range of applications, offering customers exceptional value and benefits. Experience seamless performance, enhanced efficiency, and endless possibilities with the DM3725CUSD100. Elevate your projects to new heights with this innovative solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material ensures durability and protection for the microprocessor, making it suitable for a wide range of applications.

Integrated Cache: YES

Having integrated cache improves the performance and efficiency of the microprocessor by reducing the latency in accessing frequently used data.

Maximum Supply Voltage: 1.2 V

Operating within a maximum supply voltage of 1.2 V helps in ensuring power efficiency and optimal performance of the microprocessor.

Address Bus Width: 26

With a wider address bus width of 26, the microprocessor can handle larger memory address spaces and process data more efficiently.

Package Shape: SQUARE

The square package shape offers a compact form factor, making it easier to integrate the microprocessor into various electronic devices or systems.

Bit Size: 32

Having a larger bit size of 32 allows the microprocessor to handle and process data in larger chunks, improving its overall performance and speed.

Power Supplies (V): 1.2,3.3

Supporting multiple power supply voltages of 1.2 V and 3.3 V offers flexibility in powering the microprocessor according to different system requirements.

No. of Terminals: 423

With a high number of terminals, the microprocessor can connect to various external components and peripherals, enhancing its functionality and versatility.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature of 90°C ensures that the microprocessor can operate reliably in demanding industrial environments.

Speed: 1000 rpm

Operating at a speed of 1000 rpm enables the microprocessor to handle tasks and processes efficiently, making it suitable for high-performance applications.

Technical Specifications

Microprocessors DM3725CUSD100 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

54 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B423

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

128

No. of Terminals:

423

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA423,24X24,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

1.4 mm

Speed:

1000 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

37 mA

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.14 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

16 mm

Peripheral IC Type:

Trade Compliance

DM3725CUSD100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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