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DM3725CBC100

Texas Instruments

DM3725CBC100 by Texas Instruments

The Texas Instruments DM3725CBC100 microprocessor features 32-bit architecture, 26-bit address bus width, and integrated cache. It is ideal for applications requiring high-speed processing with a max clock frequency of 54 MHz. This microprocessor is designed for use in devices that demand low power consumption and efficient data handling.

Median Price

$31.034

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,476 parts In-Stock

1+ parts

$29.110

100+ parts

$28.530

1k+ parts

$27.950

10k+ parts

-

2,476

$29.110

$28.530

$27.950

-

Texas Instruments

USA . 32 parts In-Stock

1+ parts

$32.959

100+ parts

$29.297

1k+ parts

$21.542

10k+ parts

-

32

$32.959

$29.297

$21.542

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,550 parts In-Stock

1+ parts

$31.311

100+ parts

-

1k+ parts

-

10k+ parts

-

4,550

$31.311

-

-

-

Vyrian

USA . 4,313 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,313

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 850 parts In-Stock

1+ parts

$1.432

100+ parts

-

1k+ parts

-

10k+ parts

-

850

$1.432

-

-

-

Northwest PG Solutions

USA . 1,897 parts In-Stock

1+ parts

$1.575

100+ parts

-

1k+ parts

-

10k+ parts

-

1,897

$1.575

-

-

-

AZTECH Wire

Italy . 155 parts In-Stock

1+ parts

$8.550

100+ parts

-

1k+ parts

-

10k+ parts

-

155

$8.550

-

-

-

Component Stockers USA

USA . 9,322 parts In-Stock

1+ parts

$12.940

100+ parts

-

1k+ parts

-

10k+ parts

-

9,322

$12.940

-

-

-

Parana Technologies

USA . 1,846 parts In-Stock

1+ parts

$24.405

100+ parts

-

1k+ parts

$25.079

10k+ parts

-

1,846

$24.405

-

$25.079

-

DigiPath Technology Company

USA . 777 parts In-Stock

1+ parts

$26.873

100+ parts

$24.723

1k+ parts

-

10k+ parts

-

777

$26.873

$24.723

-

-

ChromeModa Solutions

Germany . 3,555 parts In-Stock

1+ parts

$27.421

100+ parts

$22.485

1k+ parts

-

10k+ parts

-

3,555

$27.421

$22.485

-

-

IDEA Electronic Components Group

UK . 2,231 parts In-Stock

1+ parts

$27.421

100+ parts

$26.050

1k+ parts

$24.679

10k+ parts

-

2,231

$27.421

$26.050

$24.679

-

Corphita

USA . 3,775 parts In-Stock

1+ parts

$29.663

100+ parts

-

1k+ parts

-

10k+ parts

-

3,775

$29.663

-

-

-

Microchip USA

USA . 1,898 parts In-Stock

1+ parts

$73.960

100+ parts

$72.670

1k+ parts

$72.030

10k+ parts

$71.380

1,898

$73.960

$72.670

$72.030

$71.380

QUARKTWIN TECHNOLOGY LTD

USA . 14,451 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

14,451

-

-

-

-

Overview

Experience unparalleled performance and reliability with the Texas Instruments DM3725CBC100 microprocessor. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge technology and innovative solutions for a wide range of applications. This high-quality microprocessor offers integrated cache, multiple power supplies, and a wide range of terminal finishes, making it versatile and efficient for various projects. Unlock the full potential of your designs with the DM3725CBC100 and stay ahead of the competition with its superior performance and advanced features.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide good thermal and electrical insulation, making the product durable and reliable.

Integrated Cache: YES

Integrated cache helps in improving the overall performance of the microprocessor by reducing memory latency and increasing data access speeds.

Maximum Supply Voltage: 1.2 V

Operating at a maximum supply voltage of 1.2 V makes the microprocessor energy-efficient and helps in reducing power consumption.

Address Bus Width: 26

With a wider address bus width, the microprocessor can access a larger memory space, which is essential for handling complex computations and tasks efficiently.

Bit Size: 32

A 32-bit microprocessor allows for processing larger chunks of data at once, leading to faster execution of instructions and overall improved performance.

Power Supplies (V): 1.2, 1.8

Having multiple power supply options provides flexibility in different operating scenarios and allows for optimized power management.

No. of Terminals: 515

A higher number of terminals allow for more connectivity options and interactions with external components, enhancing the versatility of the microprocessor.

Minimum Supply Voltage: 1.08 V

Operating at a minimum supply voltage of 1.08 V ensures stable performance even at lower power levels, making the microprocessor suitable for various applications.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature of 90°C, the microprocessor can withstand demanding environmental conditions and maintain consistent performance.

Minimum Operating Temperature: 0 °C

Operating at a minimum temperature of 0°C ensures that the microprocessor can function reliably in colder environments without any issues.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of high-quality terminal finishes like tin, silver, and copper ensures good conductivity and corrosion resistance, increasing the longevity of the microprocessor.

Terminal Position: BOTTOM

Having terminals positioned at the bottom facilitates easy and secure connections with other components or circuit boards, simplifying the installation process.

RAM Words: 16384

With a larger RAM capacity of 16384 words, the microprocessor can store and process more data simultaneously, enabling efficient multitasking and handling of complex algorithms.

Maximum Clock Frequency: 54 MHz

Operating at a maximum clock frequency of 54 MHz allows the microprocessor to execute instructions at a high speed, resulting in improved overall performance.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC (Reduced Instruction Set Computer) microprocessor, it can execute instructions with fewer clock cycles, enhancing processing efficiency and speed.

Terminal Form: BALL

Having terminals in a ball form facilitates reliable soldering and ensures stable electrical connections, contributing to the durability and performance of the microprocessor.

Speed: 1000 rpm

Operating at a speed of 1000 rpm ensures smooth and efficient performance in applications where rotational speed is a critical factor.

Technical Specifications

Microprocessors DM3725CBC100 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

54 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B515

JESD-609 Code:

e1

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

128

No. of Terminals:

515

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA515,26X26,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

1 mm

Speed:

1000 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

37 mA

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.14 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

DM3725CBC100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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