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DM3725CBP

Texas Instruments

DM3725CBP by Texas Instruments

The Texas Instruments DM3725CBP microprocessor features a 32-bit architecture with 26-bit address bus width and integrated cache. Operating at up to 54 MHz, it offers low power mode and boundary scan capabilities. Ideal for applications requiring high-speed processing in compact devices.

Median Price

$26.644

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 13,201 parts In-Stock

1+ parts

$27.467

100+ parts

$24.415

1k+ parts

$17.952

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-

13,201

$27.467

$24.415

$17.952

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Rochester

USA . 8 parts In-Stock

1+ parts

-

100+ parts

$25.820

1k+ parts

$23.100

10k+ parts

$21.740

8

-

$25.820

$23.100

$21.740

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,146 parts In-Stock

1+ parts

$23.684

100+ parts

-

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2,146

$23.684

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Vyrian

USA . 1,931 parts In-Stock

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1,931

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ACDS - Activité Composants Distribution Service

France . 10 parts In-Stock

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10

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Distributors (Availability)

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Native Components

USA . 44 parts In-Stock

1+ parts

$1.705

100+ parts

-

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44

$1.705

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Northwest PG Solutions

USA . 123 parts In-Stock

1+ parts

$1.875

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123

$1.875

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AZTECH Wire

Italy . 744 parts In-Stock

1+ parts

$18.450

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744

$18.450

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Corphita

USA . 171 parts In-Stock

1+ parts

$22.437

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171

$22.437

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Corohmni

South Africa . 238 parts In-Stock

1+ parts

$22.742

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238

$22.742

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$39.661

100+ parts

$36.092

1k+ parts

$32.522

10k+ parts

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3,000

$39.661

$36.092

$32.522

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Parana Technologies

USA . 2,184 parts In-Stock

1+ parts

$54.797

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2,184

$54.797

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DigiPath Technology Company

USA . 385 parts In-Stock

1+ parts

$60.339

100+ parts

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385

$60.339

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ChromeModa Solutions

Germany . 2,620 parts In-Stock

1+ parts

$61.570

100+ parts

$50.487

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2,620

$61.570

$50.487

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IDEA Electronic Components Group

UK . 1,287 parts In-Stock

1+ parts

$61.570

100+ parts

$58.492

1k+ parts

$55.413

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1,287

$61.570

$58.492

$55.413

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Microchip USA

USA . 2,206 parts In-Stock

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$64.606

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2,206

$64.606

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QUARKTWIN TECHNOLOGY LTD

USA . 14,928 parts In-Stock

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14,928

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Cyclops Electronics Ltd (Excess)

UK . 10 parts In-Stock

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10

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Overview

Unleash the power of innovation with the Texas Instruments DM3725CBP microprocessor! Designed with cutting-edge technology and superior quality, this device offers unparalleled performance and efficiency for a wide range of applications. Whether you're looking to enhance your embedded systems, streamline industrial processes, or boost multimedia capabilities, this product delivers the reliability and precision you need. Trust in Texas Instruments to provide the highest standard of excellence in microprocessor technology, unlocking endless possibilities for your projects. Upgrade to the DM3725CBP today and experience the next level of performance and value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials ensure durability and reliability in various environmental conditions, making this microprocessor suitable for a wide range of applications.

Integrated Cache: YES

Having an integrated cache helps in improving the overall performance and efficiency of the microprocessor by reducing the access time to frequently used instructions and data.

Maximum Supply Voltage: 1.2 V

Operating at a maximum supply voltage of 1.2 V ensures energy efficiency and helps in minimizing power consumption, making it ideal for low-power applications.

Address Bus Width: 26

With a wide address bus width of 26, this microprocessor can handle large memory address spaces, allowing for efficient data processing and storage capabilities.

Package Shape: SQUARE

The square package shape provides a compact form factor, making it easier to integrate this microprocessor into different electronic devices and systems.

Bit Size: 32

Having a bit size of 32 enables this microprocessor to process data in 32-bit chunks, improving computational efficiency and speed.

Power Supplies (V): 1.2, 1.8

Supporting multiple power supply options of 1.2 V and 1.8 V offers flexibility in design and operation, catering to various voltage requirements of different applications.

No. of Terminals: 515

With a high number of terminals, this microprocessor allows for easy connectivity with other components, peripherals, and interfaces, enhancing its versatility and compatibility.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The advanced package style of grid array with a very thin profile and fine pitch facilitates compact PCB designs, high-density interconnects, and efficient thermal management.

Minimum Supply Voltage: 1.08 V

Operating at a minimum supply voltage of 1.08 V ensures stable performance even with low power supply levels, making it suitable for power-sensitive applications.

Maximum Operating Temperature: 90 °C

Being able to operate at high temperatures up to 90°C ensures reliability and performance in demanding thermal environments, expanding the range of applications where this microprocessor can be used.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures down to 0°C ensures reliable performance in cold environments, making this microprocessor suitable for diverse operating conditions.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The terminal finish of tin, silver, and copper provides excellent conductivity, corrosion resistance, and solderability, ensuring reliable connections and long-term durability.

Terminal Position: BOTTOM

Having the terminals positioned at the bottom simplifies the assembly process, enhances thermal management, and enables efficient PCB layout, contributing to overall ease of integration and reliability.

Maximum Seated Height: 0.71 mm

The compact maximum seated height of 0.71 mm allows for thin and slim device designs, reducing space constraints and enabling sleek and portable electronic products.

RAM Words: 16384

With a large number of RAM words, this microprocessor offers sufficient memory capacity for data storage and processing, supporting complex algorithms and applications.

Width: 12 mm

The moderate width of 12 mm provides a balance between compactness and connectivity, allowing for easy integration into various electronic systems and devices.

Boundary Scan: YES

Having boundary scan capability enables efficient testing, debugging, and diagnosis of the microprocessor, ensuring reliable operation and easier maintenance during product development and production.

External Data Bus Width: 16

With an external data bus width of 16, this microprocessor can efficiently transfer data between external devices and memory, improving overall data throughput and system performance.

Maximum Clock Frequency: 54 MHz

Operating at a maximum clock frequency of 54 MHz allows for high-speed data processing and computation, enabling quick response times and efficient performance in real-time applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures proper soldering and mechanical bonding during assembly, preventing issues like cold solder joints and ensuring long-term reliability.

Length: 12 mm

Having a length of 12 mm provides a compact form factor, facilitating space-efficient designs and enabling the integration of this microprocessor into small electronic devices and systems.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC-based microprocessor with advanced peripheral integration enhances overall system performance, efficiency, and flexibility, making it suitable for a wide range of applications requiring high computational power.

Technology: CMOS

Utilizing CMOS technology offers advantages like low power consumption, high speed, and noise immunity, making this microprocessor energy-efficient, reliable, and suitable for various battery-operated and portable devices.

Terminal Form: BALL

Having terminal balls for connection simplifies the assembly process, improves electrical conductivity, and enhances mechanical strength, ensuring reliable performance and ease of integration in various PCB designs.

Maximum Supply Current: 37 mA

Operating at a maximum supply current of 37 mA ensures low power consumption, making this microprocessor energy-efficient and suitable for battery-powered devices and applications requiring minimal power usage.

Nominal Supply Voltage: 1.14 V

Having a nominal supply voltage of 1.14 V provides a stable operating voltage for efficient performance and reliability, ensuring consistent and optimal functionality in various applications.

No. of DMA Channels: 128

With 128 DMA channels, this microprocessor offers enhanced data transfer capabilities, enabling efficient communication between peripherals and memory, and improving overall system performance.

Terminal Pitch: 0.4 mm

The small terminal pitch of 0.4 mm allows for high-density interconnects, compact PCB layouts, and efficient signal routing, enhancing the overall design flexibility and integration possibilities.

Format: FLOATING POINT

Supporting floating-point format enhances numerical accuracy, computational efficiency, and performance in complex mathematical operations, making this microprocessor ideal for applications requiring high precision and computational power.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates the level of protection against moisture and humidity, ensuring reliability and durability in various environmental conditions and manufacturing processes.

Speed: 800 rpm

Operating at a speed of 800 revolutions per minute (rpm) indicates the processing speed and efficiency of this microprocessor, ensuring quick data access, computation, and response times for demanding applications.

Low Power Mode: YES

The availability of a low power mode enhances energy efficiency and conservation, allowing this microprocessor to operate in power-saving modes when idle or under low processing requirements, extending battery life and reducing overall power consumption.

Technical Specifications

Microprocessors DM3725CBP attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

54 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B515

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

128

No. of Terminals:

515

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA515,28X28,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

.71 mm

Speed:

800 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

37 mA

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.14 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Trade Compliance

DM3725CBP Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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