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P1010NXE5HHA

NXP Semiconductors

P1010NXE5HHA by NXP Semiconductors

The NXP Semiconductors P1010NXE5HHA microprocessor features a 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates at temperatures ranging from -40 to 105°C with a max supply voltage of 1.05V. This microprocessor is designed in a square package style with 425 terminals for surface mount assembly.

Median Price

$80.030

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

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$80.030

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50

$80.030

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Digiode

USA . 3,892 parts In-Stock

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3,892

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Anansix

USA . 1,153 parts In-Stock

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1,153

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Vyrian

USA . 817 parts In-Stock

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817

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Distributors (Availability)

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Semicontronic

India . 1,352 parts In-Stock

1+ parts

$6.000

100+ parts

$5.850

1k+ parts

$5.820

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-

1,352

$6.000

$5.850

$5.820

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AZTECH Wire

Italy . 627 parts In-Stock

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$8.359

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627

$8.359

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Ampacity Inc.

Singapore . 756 parts In-Stock

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$13.000

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756

$13.000

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One Stop Electronics

USA . 1,448 parts In-Stock

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$23.000

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1,448

$23.000

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Corohmni

South Africa . 449 parts In-Stock

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$48.590

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449

$48.590

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Continental Prestige Electronics

USA . 1,767 parts In-Stock

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$76.610

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$75.078

1,767

$76.610

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$75.078

Netroflash

USA . 1,000 parts In-Stock

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$80.030

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1,000

$80.030

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Aztec Data Supply Inc.

USA . 220 parts In-Stock

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$80.730

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220

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Microchip USA

USA . 378 parts In-Stock

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$272.091

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378

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UNI Independent Distributors

Spain . 4,792 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Corphita

USA . 1,145 parts In-Stock

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Vigor

Singapore . 341 parts In-Stock

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341

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Argo Parts USA

USA . 213 parts In-Stock

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213

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Overview

Discover the innovative P1010NXE5HHA microprocessor by NXP Semiconductors, setting a new standard for quality and performance in the industry. This cutting-edge technology offers unmatched value with integrated cache, boundary scan capabilities, and industrial-grade temperature resilience. Ideal for a wide range of applications, this microprocessor guarantees seamless operation and reliability. Elevate your projects with the unparalleled benefits and advantages that the P1010NXE5HHA brings to the table. Experience the next level of efficiency and power with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components of the microprocessor, ensuring a longer lifespan.

Integrated Cache: YES

Having an integrated cache enhances the processing speed and efficiency of the microprocessor, making it suitable for high-performance applications.

Maximum Supply Voltage: 1.05 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making the microprocessor energy-efficient.

Address Bus Width: 16

A wider address bus allows for efficient data transfers and memory addressing, enhancing the overall performance of the microprocessor.

No. of Terminals: 425

Having a large number of terminals allows for multiple connections and peripherals to be supported, making the microprocessor versatile and compatible with various devices.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature indicates that the microprocessor can function effectively in extreme cold environments, offering reliability in diverse conditions.

Peripheral IC Type: MICROPROCESSOR, RISC

The RISC architecture of the microprocessor ensures efficient processing of instructions, making it suitable for applications requiring fast and streamlined performance.

Technical Specifications

Microprocessors P1010NXE5HHA attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

16

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B425

JESD-609 Code:

e2

Length:

19 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Terminals:

425

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA425,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1

Qualification:

Not Qualified

Maximum Seated Height:

1.9 mm

Speed:

800 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver (Sn/Ag)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

19 mm

Peripheral IC Type:

Trade Compliance

P1010NXE5HHA Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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