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T1013NSN7KNA

NXP Semiconductors

T1013NSN7KNA by NXP Semiconductors

The NXP Semiconductors T1013NSN7KNA microprocessor features a 64-bit architecture with integrated cache and 32-bit external data bus width. It operates b/w 0 to 105°C, suitable for various applications requiring low power mode and boundary scan support. With a terminal pitch of 0.8mm and package style in grid array, it offers high performance in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,795 parts In-Stock

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3,795

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Digiode

USA . 1,620 parts In-Stock

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1,620

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Anansix

USA . 770 parts In-Stock

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770

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Nova Conductors

Japan . 93 parts In-Stock

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93

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Distributors (Availability)

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Ampacity Inc.

Singapore . 414 parts In-Stock

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$8.000

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414

$8.000

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AZTECH Wire

Italy . 620 parts In-Stock

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$15.265

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620

$15.265

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One Stop Electronics

USA . 983 parts In-Stock

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$16.000

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983

$16.000

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Aztec Data Supply Inc.

USA . 692 parts In-Stock

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$43.264

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692

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Corohmni

South Africa . 3 parts In-Stock

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$75.489

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3

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UNI Independent Distributors

Spain . 4,861 parts In-Stock

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Continental Prestige Electronics

USA . 4,614 parts In-Stock

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Corphita

USA . 4,178 parts In-Stock

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Argo Parts USA

USA . 3,113 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Advanced Electronics

New Zealand . 36 parts In-Stock

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Overview

Unlock the power of innovation with the T1013NSN7KNA by NXP Semiconductors. This cutting-edge microprocessor boasts top-notch quality and reliability, making it a standout choice for a wide range of applications. With integrated cache and low power mode, this product delivers unparalleled performance and efficiency. Trust in NXP Semiconductors' expertise in semiconductor technology to bring you a product that exceeds expectations. Upgrade your projects with the T1013NSN7KNA and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the microprocessor lightweight and durable, making it suitable for various applications.

Integrated Cache: YES

Having an integrated cache improves the processing speed and efficiency of the microprocessor.

Maximum Supply Voltage: 1.03 V

The maximum supply voltage of 1.03V allows for stable and efficient operation of the microprocessor.

Address Bus Width: 16

A wider address bus width of 16 enables the microprocessor to handle larger amounts of data efficiently.

Package Shape: SQUARE

The square package shape allows for easy integration and placement within electronic devices.

Bit Size: 64

With a bit size of 64, this microprocessor can handle complex calculations and data processing tasks effectively.

No. of Terminals: 525

Having a high number of terminals allows for versatile connectivity options and compatibility with various systems.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array package style with fine pitch enhances the overall performance and reliability of the microprocessor.

Minimum Supply Voltage: 0.97 V

The minimum supply voltage of 0.97V ensures that the microprocessor can operate efficiently while conserving power.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C enables the microprocessor to function reliably in varying environmental conditions.

No. of External Interrupts: 6

Having 6 external interrupts allows the microprocessor to respond quickly to external events or inputs.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, this microprocessor can start up and function effectively in cold environments.

Terminal Position: BOTTOM

The bottom terminal position makes it easier to integrate the microprocessor into circuit boards and other electronic devices.

Maximum Seated Height: 2.07 mm

The low seated height of 2.07mm allows for compact designs and efficient space utilization in electronic devices.

Width: 19 mm

With a width of 19mm, this microprocessor can fit into various electronic devices without taking up too much space.

Boundary Scan: YES

The presence of boundary scan capability enables efficient testing and debugging of the microprocessor during the manufacturing process.

External Data Bus Width: 32

A wider external data bus width of 32 allows for faster data transfer rates and improved overall performance.

Length: 19 mm

With a length of 19mm, this microprocessor can be easily integrated into compact electronic devices.

Peripheral IC Type: MICROPROCESSOR

Being a microprocessor, this product is specifically designed to handle various computational tasks efficiently.

Technology: CMOS

The CMOS technology used in this microprocessor ensures low power consumption and high-speed operation.

Terminal Form: BALL

The ball terminal form provides reliable connections and ease of soldering during the manufacturing process.

Maximum Supply Current: 5 mA

With a maximum supply current of 5mA, this microprocessor operates efficiently while consuming minimal power.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1V ensures stable and consistent performance of the microprocessor.

No. of DMA Channels: 2

Having 2 DMA channels allows for efficient data transfer and management within the microprocessor.

No. of Serial I/Os: 5

The 5 serial I/Os provide flexible connectivity options for external devices and peripherals.

Terminal Pitch: 0.8 mm

With a small terminal pitch of 0.8mm, this microprocessor can be densely packed for space-saving designs.

Format: FIXED POINT

The fixed-point format simplifies mathematical calculations and improves accuracy in data processing tasks.

Speed: 1000 rpm

With a speed of 1000rpm, this microprocessor can handle computational tasks quickly and efficiently.

Low Power Mode: YES

The low power mode feature helps in reducing power consumption when the microprocessor is idle or under low load, contributing to energy efficiency.

Technical Specifications

Microprocessors T1013NSN7KNA attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

16

Bit Size:

64

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B525

Length:

19 mm

Low Power Mode:

YES

No. of DMA Channels:

2

No. of External Interrupts:

6

No. of Serial I/Os:

5

No. of Terminals:

525

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA525,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Maximum Seated Height:

2.07 mm

Speed:

1000 rpm

Maximum Supply Current:

5 mA

Maximum Supply Voltage:

1.03 V

Minimum Supply Voltage:

.97 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

19 mm

Peripheral IC Type:

Trade Compliance

T1013NSN7KNA Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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