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MPC8313VRADDC

NXP Semiconductors

MPC8313VRADDC by NXP Semiconductors

NXP Semiconductors' MPC8313VRADDC microprocessor features 32-bit architecture, integrated cache, and max clock frequency of 66.67 MHz. Ideal for low power applications, it operates b/w 0-105°C with supply voltages ranging from 0.95-3.3V.

Median Price

$39.034

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

MPC8313VRADDC by NXP Semiconductors
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 29 parts In-Stock

1+ parts

$54.530

100+ parts

$36.440

1k+ parts

$36.400

10k+ parts

-

29

$54.530

$36.440

$36.400

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Verical

USA . 480 parts In-Stock

1+ parts

-

100+ parts

$46.976

1k+ parts

$44.519

10k+ parts

$41.947

480

-

$46.976

$44.519

$41.947

Flip Electronics (Authorized)

USA . 55 parts In-Stock

1+ parts

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55

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Avnet

USA . 39 parts In-Stock

1+ parts

-

100+ parts

$31.093

1k+ parts

$30.614

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39

-

$31.093

$30.614

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Rochester

USA . 21 parts In-Stock

1+ parts

-

100+ parts

$26.020

1k+ parts

$23.280

10k+ parts

$21.910

21

-

$26.020

$23.280

$21.910

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,412 parts In-Stock

1+ parts

$27.464

100+ parts

-

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4,412

$27.464

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$38.240

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10

$38.240

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Vyrian

USA . 7,201 parts In-Stock

1+ parts

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7,201

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Flip Electronics

USA . 3,120 parts In-Stock

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3,120

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Anansix

USA . 1,820 parts In-Stock

1+ parts

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1k+ parts

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1,820

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TME

Poland . 505 parts In-Stock

1+ parts

-

100+ parts

$44.360

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505

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$44.360

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LWI Electronics Inc

India . 13 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 389 parts In-Stock

1+ parts

$8.231

100+ parts

-

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389

$8.231

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One Stop Electronics

USA . 37 parts In-Stock

1+ parts

$24.570

100+ parts

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37

$24.570

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Ampacity Inc.

Singapore . 37 parts In-Stock

1+ parts

$24.570

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37

$24.570

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Corphita

USA . 3,493 parts In-Stock

1+ parts

$26.019

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3,493

$26.019

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Continental Prestige Electronics

USA . 5,876 parts In-Stock

1+ parts

$38.240

100+ parts

-

1k+ parts

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10k+ parts

$37.475

5,876

$38.240

-

-

$37.475

Netroflash

USA . 500 parts In-Stock

1+ parts

$38.240

100+ parts

$37.475

1k+ parts

-

10k+ parts

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500

$38.240

$37.475

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Aztec Data Supply Inc.

USA . 4,027 parts In-Stock

1+ parts

$57.634

100+ parts

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4,027

$57.634

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Corohmni

South Africa . 1,060 parts In-Stock

1+ parts

$74.167

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1,060

$74.167

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Microchip USA

USA . 1,109 parts In-Stock

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$83.955

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1,109

$83.955

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Argo Parts USA

USA . 3,996 parts In-Stock

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Perfect Parts

USA . 1,120 parts In-Stock

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UNI Independent Distributors

Spain . 962 parts In-Stock

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Infinite Electronics LLP (Excess)

. 69 parts In-Stock

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69

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Overview

Experience unparalleled performance and reliability with the NXP Semiconductors MPC8313VRADDC microprocessor. Known for its cutting-edge technology and innovative design, NXP Semiconductors has established itself as a leader in the industry. This powerful microprocessor is perfect for a wide range of applications, offering seamless integration, high-speed processing, and low power consumption. Upgrade your system today and unlock endless possibilities with the MPC8313VRADDC by NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microprocessor, ensuring a longer lifespan and reliable performance.

Integrated Cache: YES

Improves processing speed by storing frequently accessed data closer to the processor, reducing data access times.

Maximum Supply Voltage: 1.05 V

Efficient power consumption at a maximum voltage, helping to save energy and reduce heat generation.

Bit Size: 32

Supports a wide range of applications and computations with its 32-bit processing capability.

Technology: CMOS

Uses Complementary Metal-Oxide-Semiconductor technology, known for its low power consumption and high noise immunity.

Technical Specifications

Microprocessors MPC8313VRADDC attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

66.67 MHz

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B516

JESD-609 Code:

e2

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

516

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA516,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1,1.8/2.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.55 mm

Speed:

266 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

27 mm

Peripheral IC Type:

Trade Compliance

MPC8313VRADDC Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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