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MCF5233CVM150

NXP Semiconductors

MCF5233CVM150 by NXP Semiconductors

NXP Semiconductors' MCF5233CVM150 microprocessor features 32-bit architecture, 75 MHz clock frequency, and integrated cache. Ideal for industrial applications requiring low power mode, with a temperature range of -40 to 85 °C and boundary scan capability.

Median Price

$58.882

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

MCF5233CVM150 by NXP Semiconductors
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Farnell

UK . 375 parts In-Stock

1+ parts

$30.150

100+ parts

$23.580

1k+ parts

-

10k+ parts

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375

$30.150

$23.580

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DigiKey

USA . 178 parts In-Stock

1+ parts

$82.890

100+ parts

$61.652

1k+ parts

-

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178

$82.890

$61.652

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EBV Elektronik

Germany . 4,050 parts In-Stock

1+ parts

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4,050

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Avnet

USA . 90 parts In-Stock

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90

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Rochester

USA . 36 parts In-Stock

1+ parts

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100+ parts

$52.340

1k+ parts

$46.830

10k+ parts

$44.070

36

-

$52.340

$46.830

$44.070

Verical

USA . 36 parts In-Stock

1+ parts

-

100+ parts

$65.425

1k+ parts

$58.538

10k+ parts

$55.087

36

-

$65.425

$58.538

$55.087

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 941 parts In-Stock

1+ parts

$46.037

100+ parts

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941

$46.037

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Vyrian

USA . 5,990 parts In-Stock

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5,990

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Anansix

USA . 2,195 parts In-Stock

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2,195

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Nova Conductors

Japan . 500 parts In-Stock

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500

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TME

Poland . 90 parts In-Stock

1+ parts

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100+ parts

$71.310

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90

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$71.310

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Flip Electronics

USA . 81 parts In-Stock

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81

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Sensible Micro Corp

USA . 38 parts In-Stock

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38

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ComSIT Distribution GmbH

Germany . 2 parts In-Stock

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Ampacity Inc.

Singapore . 112 parts In-Stock

1+ parts

$41.190

100+ parts

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112

$41.190

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Corphita

USA . 369 parts In-Stock

1+ parts

$43.614

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369

$43.614

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Vigor

Singapore . 1,257 parts In-Stock

1+ parts

$62.680

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1,257

$62.680

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Modulus Dynamics

Lithuania . 3,667 parts In-Stock

1+ parts

$78.612

100+ parts

$78.612

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$78.612

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3,667

$78.612

$78.612

$78.612

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Corohmni

South Africa . 156 parts In-Stock

1+ parts

$85.159

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156

$85.159

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QUARKTWIN TECHNOLOGY LTD

USA . 26,772 parts In-Stock

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26,772

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UNI Independent Distributors

Spain . 4,744 parts In-Stock

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Continental Prestige Electronics

USA . 4,042 parts In-Stock

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Glotronic Ltd.

UK . 1,800 parts In-Stock

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Argo Parts USA

USA . 1,370 parts In-Stock

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Microchip USA

USA . 1,186 parts In-Stock

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1,186

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Perfect Parts

USA . 183 parts In-Stock

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Overview

Unlock unparalleled performance and reliability with the MCF5233CVM150 by NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers top-notch microprocessors that cater to a wide range of applications. Whether you're looking to enhance your automotive systems, industrial controls, or consumer electronics, this product offers unmatched value and benefits. With integrated cache, low power mode, and a maximum clock frequency of 75 MHz, the MCF5233CVM150 is the perfect solution for your next project. Experience seamless operation and superior quality with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, which is ideal for portable devices.

Integrated Cache: YES

Having an integrated cache improves overall performance and efficiency of the microprocessor.

Surface Mount: YES

Surface mount technology allows for compact placement on circuit boards, saving space in electronic devices.

Maximum Supply Voltage: 1.6 V

This higher supply voltage allows for increased processing power without compromising reliability.

Address Bus Width: 24

A wider address bus width enables the microprocessor to handle larger amounts of memory efficiently.

Package Shape: SQUARE

A square package shape provides equal spacing for terminals, ensuring better connectivity on the circuit board.

Bit Size: 32

A 32-bit microprocessor offers improved performance and compatibility with modern software applications.

No. of Terminals: 256

Having 256 terminals allows for versatile connectivity options and integration with other components.

Package Style (Meter): GRID ARRAY, LOW PROFILE

Grid array and low profile package style offer excellent thermal performance and space-saving benefits in compact devices.

Minimum Supply Voltage: 1.4 V

The lower minimum supply voltage ensures energy efficiency and extends the battery life of portable devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the microprocessor can withstand harsh environmental conditions without overheating.

Minimum Operating Temperature: -40 °C

The wide temperature range allows the microprocessor to operate in both extreme cold and hot environments.

Terminal Finish: TIN SILVER COPPER OVER NICKEL

The terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: BOTTOM

Bottom terminal position simplifies the installation and maintenance process, making it user-friendly.

Maximum Seated Height: 1.6 mm

A low seated height allows for slim and compact designs in electronic devices.

Width: 17 mm

The compact width of the microprocessor makes it suitable for space-constrained applications.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging processes, improving overall system reliability.

External Data Bus Width: 32

A wide external data bus width enables fast data transfer and efficient communication with peripherals.

Maximum Clock Frequency: 75 MHz

The high clock frequency allows for rapid data processing and execution of tasks, enhancing overall system performance.

Maximum Time At Peak Reflow Temperature (s): 40

The microprocessor can withstand peak reflow temperatures for up to 40 seconds, ensuring reliable solder connections.

Peak Reflow Temperature °C: 260

A high peak reflow temperature ensures proper soldering and secure connections during the manufacturing process.

Length: 17 mm

The compact length of the microprocessor allows for versatile placement in various electronic devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh industrial environments.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture provides efficient data processing and reduced power consumption, making it ideal for embedded applications.

Technology: CMOS

CMOS technology offers low power consumption and high-speed performance, essential for modern electronic devices.

Terminal Form: BALL

Ball terminal form allows for easy soldering and reliable connections on the circuit board.

Nominal Supply Voltage: 1.5 V

The nominal supply voltage ensures stable and consistent power delivery to the microprocessor for optimal performance.

Terminal Pitch: 1 mm

A 1 mm terminal pitch provides sufficient spacing for connections, reducing the risk of short circuits and signal interference.

Format: FIXED POINT

Fixed point format simplifies mathematical calculations and enhances precision in data processing applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates that the microprocessor is suitable for reflow soldering processes and normal exposure to moisture.

Speed: 150 rpm

With a high speed rating, the microprocessor can handle complex computational tasks efficiently and quickly.

Low Power Mode: YES

Low power mode allows for energy-efficient operation, extending battery life in portable electronic devices.

Technical Specifications

Microprocessors MCF5233CVM150 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Additional Features:

LOW POWER MODE TAKEN FROM LOW POWER MODE

Address Bus Width:

24

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B256

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

256

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Speed:

150 rpm

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER OVER NICKEL

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

17 mm

Peripheral IC Type:

Trade Compliance

MCF5233CVM150 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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