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STM32MP135CAF3

STMicroelectronics

STM32MP135CAF3 by STMicroelectronics

STM32MP135CAF3 by STMicroelectronics is a 32-bit microprocessor with 172032 RAM words and 48 MHz clock frequency. It features 56 DMA channels, 10 serial I/Os, and operates in low power mode. Ideal for applications requiring high-speed processing and low power consumption in various industries.

Median Price

$7.350

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 150 parts In-Stock

1+ parts

$4.243

100+ parts

-

1k+ parts

-

10k+ parts

-

150

$4.243

-

-

-

Chip1Stop

Japan . 150 parts In-Stock

1+ parts

$6.000

100+ parts

-

1k+ parts

-

10k+ parts

-

150

$6.000

-

-

-

Newark

USA . 280 parts In-Stock

1+ parts

$7.190

100+ parts

$5.770

1k+ parts

-

10k+ parts

-

280

$7.190

$5.770

-

-

Mouser Electronics

USA . 25 parts In-Stock

1+ parts

$7.350

100+ parts

$5.840

1k+ parts

$5.770

10k+ parts

-

25

$7.350

$5.840

$5.770

-

RS (Exports)

UK . 160 parts In-Stock

1+ parts

$10.325

100+ parts

$8.414

1k+ parts

-

10k+ parts

-

160

$10.325

$8.414

-

-

Element14

Singapore . 149 parts In-Stock

1+ parts

$10.766

100+ parts

$7.689

1k+ parts

$5.984

10k+ parts

-

149

$10.766

$7.689

$5.984

-

Farnell

UK . 149 parts In-Stock

1+ parts

$11.021

100+ parts

$7.377

1k+ parts

$5.858

10k+ parts

-

149

$11.021

$7.377

$5.858

-

Verical

USA . 150 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

150

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,455 parts In-Stock

1+ parts

$4.456

100+ parts

-

1k+ parts

-

10k+ parts

-

4,455

$4.456

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$8.047

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$8.047

-

-

-

Vyrian

USA . 4,440 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,440

-

-

-

-

Anansix

USA . 738 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

738

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 66 parts In-Stock

1+ parts

$3.950

100+ parts

-

1k+ parts

-

10k+ parts

-

66

$3.950

-

-

-

Semicontronic

India . 159 parts In-Stock

1+ parts

$4.210

100+ parts

$4.105

1k+ parts

$4.084

10k+ parts

-

159

$4.210

$4.105

$4.084

-

Corphita

USA . 4,606 parts In-Stock

1+ parts

$4.221

100+ parts

-

1k+ parts

-

10k+ parts

-

4,606

$4.221

-

-

-

Continental Prestige Electronics

USA . 154 parts In-Stock

1+ parts

$6.840

100+ parts

$5.170

1k+ parts

-

10k+ parts

-

154

$6.840

$5.170

-

-

Aranea Global

USA . 100 parts In-Stock

1+ parts

$7.886

100+ parts

-

1k+ parts

$7.571

10k+ parts

-

100

$7.886

-

$7.571

-

Argo Parts USA

USA . 1,322 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,322

-

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-

-

Overview

Experience unmatched performance and reliability with the STM32MP135CAF3 microprocessor by STMicroelectronics. As a trusted leader in the industry, STMicroelectronics delivers cutting-edge technology for a wide range of applications. This high-quality product offers integrated cache, low power mode, and a maximum clock frequency of 48 MHz. With its advanced features and robust design, the STM32MP135CAF3 provides exceptional value and benefits to customers looking for top-of-the-line microprocessors. Upgrade your projects with the best - choose STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Integrated Cache: YES

Having integrated cache improves the performance of the microprocessor by reducing access times to frequently used data.

Maximum Supply Voltage: 1.38 V

The higher maximum supply voltage allows for better performance and stability of the microprocessor.

On Chip Data RAM Width: 8

A wider data RAM width means the microprocessor can handle more data at once, increasing efficiency.

Address Bus Width: 26

A wider address bus width allows the microprocessor to access a larger range of memory locations, improving overall performance.

Package Shape: SQUARE

The square package shape allows for efficient use of space and easy integration into circuit designs.

Bit Size: 32

With a 32-bit architecture, the microprocessor can handle larger chunks of data at once, increasing processing speed and efficiency.

No. of Terminals: 320

Having a large number of terminals allows for connections to various external components, enhancing the versatility of the microprocessor.

Package Style: GRID ARRAY, THIN PROFILE, FINE PITCH

This package style provides a compact design with a high terminal density, making it suitable for space-constrained applications.

Minimum Supply Voltage: 1.21 V

The lower minimum supply voltage helps in reducing power consumption and heat generation, leading to energy efficiency.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures the microprocessor can function reliably in demanding environments without overheating.

Terminal Position: BOTTOM

Having terminals at the bottom facilitates easy PCB mounting and soldering, simplifying the assembly process.

RAM Words: 172032

With a large RAM capacity, the microprocessor can store and access a significant amount of data, improving performance in memory-intensive tasks.

Width: 11 mm

The compact width makes the microprocessor suitable for applications requiring space-efficient designs.

Boundary Scan: YES

Boundary scan support allows for efficient testing and debugging of the microprocessor, enhancing reliability and ease of maintenance.

External Data Bus Width: 16

A wider external data bus width enables faster data transfer between the microprocessor and external devices, enhancing overall system performance.

Maximum Clock Frequency: 48 MHz

The high clock frequency allows for rapid processing of instructions, making the microprocessor suitable for high-performance applications.

Length: 11 mm

The compact length of the microprocessor enables it to fit into tight spaces and small form factor devices.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC-based microprocessor, it offers efficient instruction execution and streamlined processing, ideal for embedded systems and IoT applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable.

Terminal Form: BALL

Ball terminals allow for improved electrical contacts and thermal dissipation, contributing to the overall performance and longevity of the microprocessor.

Maximum Supply Current: 239 mA

The moderate supply current consumption indicates efficient power usage, leading to lower operating costs and reduced heat generation.

Nominal Supply Voltage: 1.25 V

Having a stable nominal supply voltage ensures consistent performance and reliability of the microprocessor under varying load conditions.

No. of DMA Channels: 56

The large number of DMA channels allows for efficient data transfer and processing, enhancing the microprocessor's capability to handle multiple tasks simultaneously.

No. of Serial I/Os: 10

The availability of serial I/Os enables communication with a variety of external devices, expanding the connectivity options of the microprocessor.

Terminal Pitch: 0.5 mm

The narrow terminal pitch facilitates high-density mounting and reduces PCB footprint, enabling compact and lightweight designs.

Format: FIXED POINT

The fixed-point format simplifies arithmetic operations and enhances numerical accuracy, making the microprocessor suitable for applications requiring precise calculations.

Speed: 650 rpm

With a high operating speed of 650 rpm, the microprocessor can deliver fast and responsive performance in time-critical applications.

Low Power Mode: YES

The low power mode feature allows the microprocessor to operate efficiently at reduced power levels, extending battery life and enhancing energy efficiency.

Technical Specifications

Microprocessors STM32MP135CAF3 attributes and parameters. Explore more Microprocessors devices from STMicroelectronics

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

48 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B320

Length:

11 mm

Low Power Mode:

YES

No. of DMA Channels:

56

No. of Serial I/Os:

10

No. of Terminals:

320

On Chip Data RAM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA320,21X21,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

RAM Words:

172032

Maximum Seated Height:

1.2 mm

Speed:

650 rpm

Maximum Supply Current:

239 mA

Maximum Supply Voltage:

1.38 V

Minimum Supply Voltage:

1.21 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

11 mm

Peripheral IC Type:

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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