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STM32MP157AAD3

STMicroelectronics

STM32MP157AAD3 by STMicroelectronics

STM32MP157AAD3 by STMicroelectronics is a 32-bit microprocessor with integrated cache and 16-bit external data bus width. It operates at a max clock frequency of 64 MHz, suitable for industrial applications requiring low power consumption. With 48 DMA channels and boundary scan support, it offers high performance in a compact square package.

Median Price

$8.130

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 184 parts In-Stock

1+ parts

-

100+ parts

$8.130

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-

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184

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$8.130

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Distributors (In-Stock)

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$17.495

100+ parts

-

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300

$17.495

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Vyrian

USA . 8,940 parts In-Stock

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8,940

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Digiode

USA . 1,395 parts In-Stock

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1,395

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Anansix

USA . 720 parts In-Stock

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720

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Flip Electronics

USA . 50 parts In-Stock

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 14 parts In-Stock

1+ parts

$10.250

100+ parts

-

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14

$10.250

-

-

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Semicontronic

India . 14 parts In-Stock

1+ parts

$10.250

100+ parts

$9.994

1k+ parts

$9.942

10k+ parts

-

14

$10.250

$9.994

$9.942

-

AZTECH Wire

Italy . 554 parts In-Stock

1+ parts

$13.075

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-

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554

$13.075

-

-

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$17.145

100+ parts

-

1k+ parts

$16.459

10k+ parts

-

1,000

$17.145

-

$16.459

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Continental Prestige Electronics

USA . 5,849 parts In-Stock

1+ parts

$17.162

100+ parts

-

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$16.818

5,849

$17.162

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-

$16.818

Vigor

Singapore . 1,141 parts In-Stock

1+ parts

$19.350

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1,141

$19.350

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$24.917

100+ parts

$23.671

1k+ parts

$23.671

10k+ parts

-

2,000

$24.917

$23.671

$23.671

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Microchip USA

USA . 2,006 parts In-Stock

1+ parts

$52.417

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2,006

$52.417

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Corohmni

South Africa . 96 parts In-Stock

1+ parts

$58.013

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96

$58.013

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Aztec Data Supply Inc.

USA . 5,000 parts In-Stock

1+ parts

$59.880

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5,000

$59.880

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IDEA Electronic Components Group

UK . 223 parts In-Stock

1+ parts

$77.336

100+ parts

-

1k+ parts

$69.603

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223

$77.336

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$69.603

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MKK Technologies

India . 269 parts In-Stock

1+ parts

$145.426

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269

$145.426

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DigiPath Technology Company

USA . 269 parts In-Stock

1+ parts

$145.426

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269

$145.426

-

-

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Lixinc

USA . 14,788 parts In-Stock

1+ parts

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14,788

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Argo Parts USA

USA . 3,467 parts In-Stock

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3,467

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iodParts Technologies Inc.

India . 2,619 parts In-Stock

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2,619

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Corphita

USA . 1,684 parts In-Stock

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1,684

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Parana Technologies

USA . 761 parts In-Stock

1+ parts

-

100+ parts

$92.467

1k+ parts

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761

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$92.467

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Overview

Unleash the power of innovation with the STM32MP157AAD3 by STMicroelectronics. This cutting-edge microprocessor offers unmatched quality and reliability, backed by the trusted name of its manufacturer. Ideal for a wide range of applications, this product delivers exceptional value with its integrated cache, high clock frequency, and low power mode. Experience seamless performance and efficiency like never before, making it the ultimate choice for all your advanced technology needs. Upgrade to the STM32MP157AAD3 today and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microprocessor easy to handle and resistant to damage during shipping and installation.

Integrated Cache: YES

Having integrated cache helps improve the overall performance of the microprocessor by allowing for faster access to frequently used data.

Maximum Supply Voltage: 1.25 V

The microprocessor can operate efficiently within a safe voltage range, ensuring stable performance without the risk of damage due to overvoltage.

On Chip Data RAM Width: 8

With a wider on-chip data RAM width, the microprocessor can handle more data simultaneously, leading to improved multitasking capabilities.

Address Bus Width: 16

A wider address bus allows for more efficient memory access, enhancing the overall speed and performance of the microprocessor.

Package Shape: SQUARE

The square package shape helps optimize space utilization and allows for easier integration into various electronic devices.

Bit Size: 32

A larger bit size enables the microprocessor to process data in larger chunks, leading to faster and more efficient computations.

No. of Terminals: 257

Having more terminals allows for greater connectivity options and enhanced compatibility with a wide range of systems and peripherals.

Minimum Supply Voltage: 0.85 V

The microprocessor can operate efficiently even at lower voltages, offering energy savings and improved power efficiency.

Maximum Operating Temperature: 125 °C

The microprocessor can withstand high operating temperatures, making it suitable for industrial applications where temperature fluctuations are common.

Minimum Operating Temperature: -40 °C

The microprocessor can function reliably in cold environments, ensuring consistent performance across a wide range of operating conditions.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy mounting and soldering, simplifying the installation process and ensuring a secure connection.

Maximum Seated Height: 1.2 mm

The low seated height allows for compact design integration, making the microprocessor suitable for space-constrained applications.

RAM Words: 724992

With a large number of RAM words, the microprocessor can store and access a vast amount of data quickly, enabling efficient data processing.

Width: 10 mm

The compact width of the microprocessor makes it easy to fit into tight spaces and enables a smaller form factor for electronic devices.

Boundary Scan: YES

Boundary scan capabilities facilitate efficient testing and debugging of the microprocessor, ensuring reliable performance and easy maintenance.

External Data Bus Width: 16

A wider external data bus allows for faster data transfer between the microprocessor and external devices, enhancing overall system performance.

Maximum Clock Frequency: 64 MHz

The high maximum clock frequency allows the microprocessor to execute instructions rapidly, leading to improved processing speed and system responsiveness.

Length: 10 mm

The compact length of the microprocessor contributes to a smaller footprint, enabling space-saving design options for electronic products.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the microprocessor can operate reliably in harsh environmental conditions typically found in industrial settings.

Peripheral IC Type: MICROPROCESSOR, RISC

The RISC architecture of the microprocessor offers simplified instruction execution and enhanced performance, making it ideal for high-speed computing tasks.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, allowing the microprocessor to operate efficiently while minimizing energy usage.

Terminal Form: BALL

The ball terminal form simplifies the soldering process and enhances electrical connections, ensuring reliable performance and ease of installation.

Maximum Supply Current: 1000 mA

The microprocessor can handle high supply currents, enabling it to power through demanding tasks without risk of overheating or performance degradation.

Nominal Supply Voltage: 0.9 V

The nominal supply voltage provides stable power delivery to the microprocessor, ensuring consistent performance and reliability under varying load conditions.

No. of DMA Channels: 48

Having a high number of DMA channels allows for efficient data transfer and multitasking capabilities, enhancing the overall performance of the microprocessor.

Terminal Pitch: 0.65 mm

The small terminal pitch enables high-density mounting and compact design integration, making the microprocessor suitable for space-constrained applications.

Format: FLOATING POINT

The floating-point format allows for precise numerical calculations and enhanced computational accuracy, making the microprocessor suitable for complex mathematical tasks.

Speed: 650 rpm

With a high speed rating, the microprocessor can quickly execute instructions and handle data-intensive applications, ensuring smooth and efficient operation.

Low Power Mode: YES

The low power mode option enables the microprocessor to conserve energy during idle or low-demand periods, helping to reduce overall power consumption and extend battery life.

Technical Specifications

Microprocessors STM32MP157AAD3 attributes and parameters. Explore more Microprocessors devices from STMicroelectronics

Specs

Address Bus Width:

16

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

64 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B257

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

48

No. of Terminals:

257

On Chip Data RAM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Words:

724992

Maximum Seated Height:

1.2 mm

Speed:

650 rpm

Maximum Supply Current:

1000 mA

Maximum Supply Voltage:

1.25 V

Minimum Supply Voltage:

.85 V

Nominal Supply Voltage:

.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

STM32MP157AAD3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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