Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Featured manufacturers
STM32MP157AAD3 by STMicroelectronics is a 32-bit microprocessor with integrated cache and 16-bit external data bus width. It operates at a max clock frequency of 64 MHz, suitable for industrial applications requiring low power consumption. With 48 DMA channels and boundary scan support, it offers high performance in a compact square package.
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This material is lightweight and durable, making the microprocessor easy to handle and resistant to damage during shipping and installation.
Having integrated cache helps improve the overall performance of the microprocessor by allowing for faster access to frequently used data.
The microprocessor can operate efficiently within a safe voltage range, ensuring stable performance without the risk of damage due to overvoltage.
With a wider on-chip data RAM width, the microprocessor can handle more data simultaneously, leading to improved multitasking capabilities.
A wider address bus allows for more efficient memory access, enhancing the overall speed and performance of the microprocessor.
The square package shape helps optimize space utilization and allows for easier integration into various electronic devices.
A larger bit size enables the microprocessor to process data in larger chunks, leading to faster and more efficient computations.
Having more terminals allows for greater connectivity options and enhanced compatibility with a wide range of systems and peripherals.
The microprocessor can operate efficiently even at lower voltages, offering energy savings and improved power efficiency.
The microprocessor can withstand high operating temperatures, making it suitable for industrial applications where temperature fluctuations are common.
The microprocessor can function reliably in cold environments, ensuring consistent performance across a wide range of operating conditions.
Bottom terminal position facilitates easy mounting and soldering, simplifying the installation process and ensuring a secure connection.
The low seated height allows for compact design integration, making the microprocessor suitable for space-constrained applications.
With a large number of RAM words, the microprocessor can store and access a vast amount of data quickly, enabling efficient data processing.
The compact width of the microprocessor makes it easy to fit into tight spaces and enables a smaller form factor for electronic devices.
Boundary scan capabilities facilitate efficient testing and debugging of the microprocessor, ensuring reliable performance and easy maintenance.
A wider external data bus allows for faster data transfer between the microprocessor and external devices, enhancing overall system performance.
The high maximum clock frequency allows the microprocessor to execute instructions rapidly, leading to improved processing speed and system responsiveness.
The compact length of the microprocessor contributes to a smaller footprint, enabling space-saving design options for electronic products.
The industrial temperature grade ensures the microprocessor can operate reliably in harsh environmental conditions typically found in industrial settings.
The RISC architecture of the microprocessor offers simplified instruction execution and enhanced performance, making it ideal for high-speed computing tasks.
CMOS technology provides low power consumption and high noise immunity, allowing the microprocessor to operate efficiently while minimizing energy usage.
The ball terminal form simplifies the soldering process and enhances electrical connections, ensuring reliable performance and ease of installation.
The microprocessor can handle high supply currents, enabling it to power through demanding tasks without risk of overheating or performance degradation.
The nominal supply voltage provides stable power delivery to the microprocessor, ensuring consistent performance and reliability under varying load conditions.
Having a high number of DMA channels allows for efficient data transfer and multitasking capabilities, enhancing the overall performance of the microprocessor.
The small terminal pitch enables high-density mounting and compact design integration, making the microprocessor suitable for space-constrained applications.
The floating-point format allows for precise numerical calculations and enhanced computational accuracy, making the microprocessor suitable for complex mathematical tasks.
With a high speed rating, the microprocessor can quickly execute instructions and handle data-intensive applications, ensuring smooth and efficient operation.
The low power mode option enables the microprocessor to conserve energy during idle or low-demand periods, helping to reduce overall power consumption and extend battery life.
Microprocessors STM32MP157AAD3 attributes and parameters. Explore more Microprocessors devices from STMicroelectronics
Address Bus Width:
Bit Size:
Boundary Scan:
Maximum Clock Frequency:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
Length:
Low Power Mode:
No. of DMA Channels:
No. of Terminals:
On Chip Data RAM Width:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
RAM Words:
Maximum Seated Height:
Speed:
Maximum Supply Current:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Temperature Grade:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
STM32MP157AAD3 Peripheral ICs trade compliance attributes, and parameters.
ECCN
3A991.A.2
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
PCN Design/Specification - STM32MP15y Datasheet Chg 7/Feb/2020
PCN Assembly/Origin - Mult Dev A/T Chgs 30/Mar/2023
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
2N2222A
New England Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SS14
Jinan Jingheng Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Calogic
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Drain Current (Abs) (ID): .2 A;
IRLML6401TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Minimum Operating Temperature: -55 Cel; Avalanche Energy Rating (EAS): 33 mJ;
CL31B104KBCNNNC
Samsung Electro-mechanics
Samsung Electro-mechanics CL31B104KBCNNNC is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It features X7R temperature characteristics, -55 to 125 °C operating range, and compact SMT package style. Ideal for applications requiring high reliability in compact electronic devices.
1N4148WS
Rugao Dachang Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
International Devices
BAV99
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Time At Peak Reflow Temperature (s): 30; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
IRLML6402TRPBF
Infineon Technologies
IRLML6402TRPBF by Infineon is a P-CHANNEL FET for SWITCHING applications. It features a 20V DS Breakdown Voltage, 22A IDM, and 0.065 ohm RDS(on). With a small outline package and matte tin finish, it operates in temperatures from -55 to 150 °C.
M39029/56351
Souriau
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Gender: FEMALE; Insertion Tools: M81969/14-10; Tool Settings: M22520/2-10; DIN Conformity: NO;
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358N
Taejin Technology
OPERATIONAL AMPLIFIER; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
EPCS4SI8N
Intel
EPCS4SI8N by Intel is a small outline flash memory with 512Kx8 organization, operating at 3.3V. It features a max clock frequency of 40MHz and endurance of 100k write/erase cycles. Ideal for industrial applications requiring configuration memory with serial interface and low standby current consumption.
Bytesonic Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Terminal Position: DUAL; Minimum Operating Temperature: -55 Cel;
LM107H
Intersil
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Nominal Common Mode Reject Ratio: 96 dB;
ABS06-32.768KHZ-T
Abracon
Abracon's ABS06-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 90000 ohm series resistance, and -40 to 85 °C operating temperature range. Ideal for applications requiring precise timing in compact designs like IoT devices and wearables.
FDC5614P
MSKSEMI SEMICONDUCTOR
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 60 V;
Micropac Industries
Rochester Electronics
MCF5484CVR200
NXP Semiconductors
NXP Semiconductors' MCF5484CVR200 microprocessor features 32-bit architecture, 66.67 MHz clock frequency, and integrated cache. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities. With a package style of grid array and terminal pitch of 1mm, it offers efficient performance in various embedded systems.
ATSAMA5D31A-CFU
Microchip Technology
ATSAMA5D31A-CFU by Microchip Technology is a 32-bit microprocessor with integrated cache and a max clock frequency of 48 MHz. It is commonly used in industrial applications due to its low power mode and temperature grade.
CS80C286-16
Renesas Electronics
CS80C286-16 by Renesas Electronics is a 16 rpm microprocessor with 24-bit address bus width and 16-bit external data bus width. It operates at temperatures b/w 0 to 70 °C, making it suitable for commercial applications requiring low power mode and fixed-point format processing.
DM3730CUS100NEP
Texas Instruments
Texas Instruments DM3730CUS100NEP microprocessor features 32-bit architecture, 26-bit address bus, and integrated cache. Ideal for low power applications with a max clock frequency of 54 MHz. Suitable for mobile devices, automotive systems, and industrial automation due to its compact size and high performance capabilities.
MCIMX6S6AVM08AB
MCIMX6S6AVM08AB by NXP Semiconductors is a 64-bit microprocessor with 16-bit address bus width, 32-bit external data bus width, and max clock frequency of 24 MHz. Ideal for automotive applications due to its low power mode, CMOS technology, and terminal finish of tin silver copper.
Harris Semiconductor
MICROPROCESSOR; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 68; Package Code: QCCJ; Package Shape: SQUARE;
ATSAMA5D36A-CN
Atmel
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;
MCF54453CVP200
MICROPROCESSOR; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;
SAM9X60D5MT-I/4FB
SAM9X60D5MT-I/4FB by Microchip Technology is a MICROPROCESSOR with 16 DMA channels, 50 MHz clock frequency, and 1.8V supply voltage. Ideal for industrial applications, it features a CMOS technology, 233 terminals in a GRID ARRAY package style, and operates b/w -40 to 85 °C temperatures.
AM3357BZCZD30
AM3357BZCZD30 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words and 64 DMA channels. It operates at a max clock frequency of 26 MHz, suitable for industrial applications requiring low power mode and boundary scan capability. The package style is grid array, making it ideal for compact designs with a terminal pitch of 0.8 mm.
RTPXA270C5C520
Marvell Technology
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 356; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
MIMXRT1052DVL6B
The NXP Semiconductors MIMXRT1052DVL6B microprocessor features 32-bit architecture, 24 MHz clock frequency, and 524288 RAM words. Ideal for applications requiring low power mode, it offers 29 serial I/Os and 32 DMA channels for efficient data transfer. With a compact square package style and integrated cache, it is suitable for embedded systems in various industries.
ATSAMA5D35A-CUR
ATSAMA5D35A-CUR by Microchip Technology is a 32-bit microprocessor with 131072 RAM words and 48 MHz max clock frequency. Ideal for industrial applications, it features 39 DMA channels, low power mode, and boundary scan capability. With a package style of grid array and terminal finish of tin silver copper, this processor offers high performance in a compact form factor.
DM3730CBP100
DM3730CBP100 by Texas Instruments is a microprocessor with integrated cache and surface mount capability. It has an address bus width of 26, on-chip data RAM width of 8, and operates at a max clock frequency of 54 MHz. This processor is commonly used in applications requiring high-speed processing and low power consumption.
STM32MP135DAF7
STMicroelectronics
STM32MP135DAF7 by STMicroelectronics is a 32-bit microprocessor with integrated cache and 26-bit address bus width. It operates at a max clock frequency of 48 MHz, suitable for low power applications in various industries like IoT and embedded systems. With a package style of grid array and thin profile, it offers high performance in a compact form factor.
P1013NXE2LFB
Freescale Semiconductor
MICROPROCESSOR; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE;
MCF54415CMJ250
MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
MPC8270CVRMIBA
The NXP Semiconductors MPC8270CVRMIBA is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 266 MHz. It features an external data bus width of 64 bits and is suitable for applications requiring high-speed processing in devices such as networking equipment and industrial control systems.
SPC5200CVR400B
MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 272; Package Code: BGA; Package Shape: SQUARE;
FA80386EXTC33
FA80386EXTC33 by Rochester Electronics is a 32-bit microprocessor with 26-bit address bus width, operating at a max clock frequency of 66 MHz. It features low power mode and boundary scan capabilities, suitable for industrial applications requiring high-speed processing in compact spaces. The package style is flatpack with a low profile and fine pitch design, making it ideal for surface mount installations.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
STM32MP157FAC1
MICROPROCESSOR, RISC;
STM32MP157AAA3
STM32MP157AAA3 by STMicroelectronics is a 32-bit microprocessor with a max clock frequency of 64 MHz. It has 724992 RAM words and operates in an industrial temperature grade range (-40 to 125 °C). This microprocessor is commonly used in applications requiring high-speed processing and reliable performance.
STM32MP157CAA3
MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
STM32MP157CAC3
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
STM32MP157AAC3
STM32MP157AAC3 by STMicroelectronics is a 32-bit microprocessor with 64MHz clock frequency, 1.25V max supply voltage, and 48 DMA channels. Ideal for industrial applications requiring high-speed processing in a compact form factor with low power mode support.
STM32MP157FAA1
STM32MP157DAB1
STM32MP157DAB1 by STMicroelectronics is a 32-bit microprocessor with integrated cache and 16-bit address bus width. It operates at a max clock frequency of 64 MHz, suitable for industrial applications requiring low power consumption. With 48 DMA channels and boundary scan support, it offers high performance in a compact package style.
STM32MP151AAB3
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 354; Package Code: LFBGA; Package Shape: SQUARE; RAM Words: 724992;
STM32MP157FAB1
STM32MP157FAD1
STM32MP151AAC3
STM32MP151AAC3 by STMicroelectronics is a 32-bit microprocessor with integrated cache and 48 MHz clock frequency. It features 361 terminals, 724992 RAM words, and operates b/w -40 to 125 °C. Ideal for low power applications in various industries due to its high-speed processing capabilities.
STM32MP157AAB3
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 354; Package Code: LFBGA; Package Shape: SQUARE;
STM32MP153AAA3
MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
STM32MP153AAB3
STM32MP153AAC3
STM32MP151CAD3
STM32MP135CAF3
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 320; Package Code: TFBGA; Package Shape: SQUARE; Surface Mount: YES;
STM32MP157CAB3
STM32MP151CAC3
Supply Digital Components
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