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AM3517AZCNAC

Texas Instruments

AM3517AZCNAC by Texas Instruments

AM3517AZCNAC by Texas Instruments is a 16-bit microprocessor with integrated cache and surface mount capability. It operates at a max clock frequency of 26 MHz and has a wide temperature range, making it suitable for industrial applications.

Median Price

$28.550

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,179 parts In-Stock

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$28.199

100+ parts

$25.066

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$18.431

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$28.199

$25.066

$18.431

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Element14

Singapore . 90 parts In-Stock

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$28.900

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90

$28.900

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Digiode

USA . 1,251 parts In-Stock

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$26.789

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$26.789

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Nova Conductors

Japan . 42 parts In-Stock

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$32.060

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VNN

France . 16,215 parts In-Stock

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Vyrian

USA . 8,977 parts In-Stock

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Chip Stock

USA . 305 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 1,185 parts In-Stock

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$12.090

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$12.090

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$23.201

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$22.041

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$22.041

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3,000

$23.201

$22.041

$22.041

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Semicontronic

India . 1,814 parts In-Stock

1+ parts

$23.970

100+ parts

$23.371

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$23.251

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1,814

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$23.251

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Ampacity Inc.

Singapore . 1,783 parts In-Stock

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$23.970

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Corphita

USA . 1,398 parts In-Stock

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$25.379

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Corohmni

South Africa . 222 parts In-Stock

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$31.502

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$31.502

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Bastille Electronics

Australia . 450 parts In-Stock

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$32.060

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$30.457

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$28.533

450

$32.060

$30.457

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$28.533

Continental Prestige Electronics

USA . 2,247 parts In-Stock

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$32.060

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$31.419

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$31.419

Parana Technologies

USA . 449 parts In-Stock

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$41.340

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449

$41.340

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DigiPath Technology Company

USA . 1,147 parts In-Stock

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$45.521

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$41.879

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$45.521

$41.879

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ChromeModa Solutions

Germany . 1,154 parts In-Stock

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$46.450

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$38.089

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$46.450

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IDEA Electronic Components Group

UK . 121 parts In-Stock

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$46.450

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$44.128

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$41.805

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121

$46.450

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$41.805

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Lixinc

USA . 14,865 parts In-Stock

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Argo Parts USA

USA . 4,247 parts In-Stock

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Kepictronics

USA . 2,000 parts In-Stock

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Authorized Procurement Solutions

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Futuretech Components

Singapore . 320 parts In-Stock

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ChipstoGo Electronic ltd

UK . 20 parts In-Stock

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Overview

Discover the AM3517AZCNAC by Texas Instruments, a high-quality microprocessor that is sure to impress. With its advanced technology and top-notch manufacturing, Texas Instruments has created a product that offers numerous advantages and benefits. This microprocessor is perfect for a range of applications, thanks to its integrated cache and surface mount capabilities. The value this product brings to customers is unparalleled, with its low power mode and maximum clock frequency of 26 MHz. Experience the power and reliability of the AM3517AZCNAC and take your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and lightweight, making this microprocessor a reliable and high-performance choice.

Integrated Cache: YES

With integrated cache, this microprocessor offers faster data access and improved overall performance, making it suitable for demanding applications that require quick processing.

Surface Mount: YES

The surface mount feature allows for easy installation and efficient space utilization on the PCB, making it ideal for compact and space-constrained electronic devices.

Maximum Supply Voltage: 1.248 V

The microprocessor's maximum supply voltage of 1.248 V ensures efficient power consumption and enhances energy efficiency, making it an excellent choice for applications where power optimization is crucial.

On Chip Data RAM Width: 8

The 8-bit wide on-chip data RAM facilitates efficient data handling and processing, making it suitable for applications that require the manipulation and storage of large amounts of data.

Address Bus Width: 16

The 16-bit address bus width provides a broad addressable memory space, enabling the microprocessor to access and handle larger data sets, making it ideal for memory-intensive applications.

Package Shape: SQUARE

The square package shape allows for straightforward and uniform mounting, ensuring easy integration into various electronic systems, making it a versatile solution for different applications.

Bit Size: 16

With a 16-bit bit size, this microprocessor offers improved computational capabilities and precision, making it a reliable choice for tasks that require complex calculations and accurate results.

Power Supplies (V): 1.2, 1.8, 3.3

The microprocessor's compatibility with multiple power supply voltages (1.2, 1.8, and 3.3 V) allows for flexibility in system design and integration, making it suitable for a wide range of electronic devices.

No. of Terminals: 491

With 491 terminals, this microprocessor offers extensive connectivity options and compatibility with various peripheral devices, ensuring seamless integration into complex electronic systems.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style ensure efficient thermal dissipation, compact design, and ease of assembly, making this microprocessor an excellent choice for space-constrained and thermally sensitive applications.

Technical Specifications

Microprocessors AM3517AZCNAC attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B491

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of Terminals:

491

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA491,25X25,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

65536

Maximum Seated Height:

1.3 mm

Speed:

600 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

1500 mA

Maximum Supply Voltage:

1.248 V

Minimum Supply Voltage:

1.152 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

AM3517AZCNAC Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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