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AM3505AZERAC

Texas Instruments

AM3505AZERAC by Texas Instruments

AM3505AZERAC by Texas Instruments is a 16-bit microprocessor with integrated cache and 16-bit external data bus width. It operates at a max clock frequency of 26 MHz, suitable for low power mode applications in various electronic devices. The package style is grid array with 484 terminals, making it ideal for compact designs requiring high processing speeds.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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VNN

France . 23,444 parts In-Stock

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Vyrian

USA . 3,953 parts In-Stock

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Digiode

USA . 2,408 parts In-Stock

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Nova Conductors

Japan . 31 parts In-Stock

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One Stop Electronics

USA . 429 parts In-Stock

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$2.000

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429

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Ampacity Inc.

Singapore . 1,203 parts In-Stock

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$8.000

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AZTECH Wire

Italy . 375 parts In-Stock

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Semicontronic

India . 985 parts In-Stock

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$33.000

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$32.175

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$32.010

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Corohmni

South Africa . 473 parts In-Stock

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$43.410

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Parana Technologies

USA . 759 parts In-Stock

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$44.458

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DigiPath Technology Company

USA . 803 parts In-Stock

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$48.954

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$45.038

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ChromeModa Solutions

Germany . 5,623 parts In-Stock

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IDEA Electronic Components Group

UK . 1,446 parts In-Stock

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Continental Prestige Electronics

USA . 5,779 parts In-Stock

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Corphita

USA . 4,709 parts In-Stock

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Argo Parts USA

USA . 4,647 parts In-Stock

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Microchip USA

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Bastille Electronics

Australia . 20 parts In-Stock

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Overview

Experience the exceptional performance and reliability of the AM3505AZERAC by Texas Instruments, a top-tier manufacturer known for quality microprocessors. Ideal for a wide range of applications, this powerful product offers integrated cache, low power mode, and a maximum clock frequency of 26 MHz. With a package body material of plastic/epoxy and terminal finish of tin silver copper, customers can trust in the durability and efficiency of this microprocessor. Upgrade your technology with the AM3505AZERAC and unlock a world of possibilities.

Feature Benefit Bullets

Integrated Cache: YES

Having an integrated cache improves the performance of the microprocessor by reducing the time it takes to access frequently used data.

Maximum Supply Voltage: 1.248 V

The higher maximum supply voltage allows for increased stability and performance of the microprocessor.

Address Bus Width: 16

With a wider address bus width, the microprocessor can access and process larger amounts of memory more efficiently.

Power Supplies: 1.2, 1.8, 3.3 V

Having multiple power supply options allows for flexibility in design and power efficiency based on the application requirements.

Package Style: GRID ARRAY

The grid array package style offers a high terminal count and compact design, making it suitable for high-performance applications with limited space.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a microprocessor with Reduced Instruction Set Computing (RISC) architecture, it enables efficient data processing and execution of complex instructions.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high speed operation, making the microprocessor energy-efficient.

Boundary Scan: YES

The boundary scan feature allows for easy testing and debugging of the microprocessor during the production process, ensuring high quality and reliability.

Maximum Clock Frequency: 26 MHz

The high maximum clock frequency enables fast data processing and execution speeds, making the microprocessor suitable for demanding applications.

Low Power Mode: YES

The low power mode option helps in reducing power consumption during idle or low activity periods, promoting energy efficiency and prolonging battery life.

Technical Specifications

Microprocessors AM3505AZERAC attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

484

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA484,22X22,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.48 mm

Speed:

600 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.248 V

Minimum Supply Voltage:

1.152 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

AM3505AZERAC Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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