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AM3358BZCZA100

Texas Instruments

AM3358BZCZA100 by Texas Instruments

AM3358BZCZA100 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 64 DMA channels, and 26 MHz clock frequency. Ideal for industrial applications requiring low power mode, it features a max operating temperature of 105°C and boundary scan capability.

Median Price

$19.660

Lifecycle Status

Suppliers In-Stock

26

In-Stock Inventory

1k+

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Future Electronics

Canada . 126 parts In-Stock

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$10.680

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$10.340

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$10.180

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Texas Instruments

USA . 122,589 parts In-Stock

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$16.884

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$14.748

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$10.171

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Farnell

UK . 233 parts In-Stock

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Arrow

USA . 22 parts In-Stock

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Verical

USA . 22 parts In-Stock

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Element14

Singapore . 352 parts In-Stock

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Mouser Electronics

USA . 869 parts In-Stock

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DigiKey

USA . 662 parts In-Stock

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Adafruit Industries

USA . 3,000 parts In-Stock

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$87.683

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$83.299

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Distributors (In-Stock)

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Freelance Electronics

USA . 952 parts In-Stock

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$11.980

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Digiode

USA . 4,255 parts In-Stock

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Maritex

Poland . 168 parts In-Stock

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$10.636

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Nova Conductors

Japan . 450 parts In-Stock

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Vyrian

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Chip Stock

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Bristol Electronics

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Atlantic Semiconductor

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VNN

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LIBRA Elektronik GmbH

Germany . 147 parts In-Stock

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Cyclops Electronics Ltd

UK . 139 parts In-Stock

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Goldney Electronics S.L.

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Italy . 73 parts In-Stock

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Sensible Micro Corp

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ComSIT Distribution GmbH

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Inventory MP

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Prism Electronics

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Semicontronic

India . 32,266 parts In-Stock

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$14.290

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$13.933

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$13.861

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Ampacity Inc.

Singapore . 15,990 parts In-Stock

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Corphita

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Continental Prestige Electronics

USA . 2 parts In-Stock

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Modulus Dynamics

Lithuania . 657 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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Parana Technologies

USA . 484 parts In-Stock

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DigiPath Technology Company

USA . 2,101 parts In-Stock

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ChromeModa Solutions

Germany . 6,275 parts In-Stock

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$32.569

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$26.707

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IDEA Electronic Components Group

UK . 1,083 parts In-Stock

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$32.569

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$30.941

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Corohmni

South Africa . 659 parts In-Stock

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Microchip USA

USA . 906 parts In-Stock

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$63.480

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Advanced Electronics

New Zealand . 6,000 parts In-Stock

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$87.683

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$83.299

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Perfect Parts

USA . 17,454 parts In-Stock

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S.R.D Solutions

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Lixinc

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GreenTree Electronics

Israel . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 8,435 parts In-Stock

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Lucentia Tech

USA . 5,236 parts In-Stock

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$32.482

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$31.819

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$31.819

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$31.819

Alle Elektronik GmbH

Germany . 3,943 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Robosynatics

Brazil . 2,618 parts In-Stock

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$32.482

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$31.819

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$31.819

2,618

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$32.482

$31.819

$31.819

Argo Parts USA

USA . 2,580 parts In-Stock

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Kepictronics

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iodParts Technologies Inc.

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Overview

Discover the cutting-edge AM3358BZCZA100 microprocessor by Texas Instruments, setting new standards in performance and reliability. With a sleek package body material of PLASTIC/EPOXY and integrated cache, this powerhouse is perfect for a wide range of applications. From industrial automation to IoT devices, this processor delivers unparalleled speed and efficiency. Trust in Texas Instruments' reputation for excellence and unlock limitless possibilities with the AM3358BZCZA100. Elevate your projects with this high-quality solution that guarantees optimal performance every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and provides good protection for the microprocessor, ensuring longevity and reliability.

Integrated Cache: YES

Having integrated cache improves the performance of the microprocessor by reducing access times to frequently used data, making it a faster and more efficient choice.

Maximum Supply Voltage: 1.378 V

The maximum supply voltage of 1.378V ensures stable and reliable operation of the microprocessor within safe voltage limits.

On Chip Data RAM Width: 8

With a data RAM width of 8, this microprocessor can handle data processing efficiently and effectively.

Address Bus Width: 28

A wider address bus width of 28 allows the microprocessor to access and communicate with a larger memory space, enhancing its capabilities.

Package Shape: SQUARE

The square package shape helps in efficient and space-saving placement on circuit boards, optimizing the overall design layout.

Bit Size: 32

With a bit size of 32, this microprocessor can process data in 32-bit chunks, providing better performance and precision.

Power Supplies (V): 0.95/1.1

Having multiple power supply options (0.95V and 1.1V) allows for flexibility in power management, catering to different power requirements.

No. of Terminals: 324

The high number of terminals (324) enables seamless connectivity and communication with other components in the system, enhancing compatibility and functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The package style with grid array, low profile, and fine pitch design ensures a compact form factor, ease of mounting, and efficient heat dissipation.

Minimum Supply Voltage: 1.272 V

The minimum supply voltage of 1.272V ensures that the microprocessor operates reliably even under low voltage conditions, enhancing its robustness.

Maximum Operating Temperature: 105 °C

With a maximum operating temperature of 105°C, this microprocessor can perform effectively in high-temperature environments without compromising performance.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C ensures that the microprocessor can function even in extreme cold conditions, making it versatile and suitable for various applications.

Terminal Finish: TIN SILVER COPPER

The terminal finish with a combination of tin, silver, and copper provides excellent conductivity and corrosion resistance, ensuring reliable connections and longevity.

Terminal Position: BOTTOM

Having terminal positions at the bottom simplifies the installation process and facilitates better heat dissipation, enhancing overall performance and reliability.

Maximum Seated Height: 1.4 mm

The maximum seated height of 1.4mm allows for a low-profile design, making it suitable for applications where space constraints are a concern.

RAM Words: 131072

With 131072 RAM words, this microprocessor can store and access a large amount of data efficiently, enabling smooth and uninterrupted operation.

Width: 15 mm

The compact width of 15mm makes this microprocessor ideal for applications requiring a small form factor, without compromising on performance.

Boundary Scan: YES

Having boundary scan capability allows for efficient testing and debugging of the microprocessor, ensuring easier maintenance and faster time-to-market.

External Data Bus Width: 16

With an external data bus width of 16, this microprocessor can interface with external devices and peripherals effectively, enhancing connectivity and functionality.

Maximum Clock Frequency: 26 MHz

The maximum clock frequency of 26 MHz enables fast and responsive operation of the microprocessor, suitable for applications requiring high-speed data processing.

Maximum Time At Peak Reflow Temperature (s): 30

Being able to withstand peak reflow temperature for up to 30 seconds ensures that the microprocessor remains stable and reliable during manufacturing processes.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C indicates the thermal resilience of the microprocessor, ensuring it can endure high-temperature soldering processes without damage.

Length: 15 mm

With a length of 15mm, this microprocessor maintains a compact footprint, making it suitable for space-constrained applications while delivering high performance.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the microprocessor can operate reliably in harsh environmental conditions, making it suitable for industrial applications.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC-based microprocessor, it delivers efficient and streamlined data processing, making it ideal for high-performance computing and embedded systems.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high speed, and noise immunity, making this microprocessor energy-efficient and reliable.

Terminal Form: BALL

With a ball terminal form, this microprocessor facilitates reliable and secure connections, ensuring stable performance and durability.

Maximum Supply Current: 400 mA

The maximum supply current of 400mA indicates the power consumption of the microprocessor, allowing for efficient power management and optimization of energy usage.

Nominal Supply Voltage: 1.325 V

Having a nominal supply voltage of 1.325V ensures stable and consistent power delivery to the microprocessor, contributing to its overall reliability and performance.

No. of DMA Channels: 64

With 64 DMA channels, this microprocessor can support efficient data transfer and processing, enhancing its capabilities in handling multiple tasks simultaneously.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8mm allows for compact and efficient connectivity, enabling high-density PCB layouts and streamlined circuit designs.

Format: FIXED POINT

Being a fixed-point format microprocessor, it offers precise and rapid arithmetic calculations, making it suitable for applications requiring high computational accuracy.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates the microprocessor's resistance to moisture and humidity, ensuring reliable performance in varied environmental conditions.

Speed: 1000 rpm

With a speed of 1000 rpm, this microprocessor delivers fast data processing and response times, suitable for applications requiring rapid information retrieval and computation.

Low Power Mode: YES

The low power mode feature allows the microprocessor to operate efficiently with reduced power consumption, extending battery life and improving energy efficiency.

Technical Specifications

Microprocessors AM3358BZCZA100 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

64

No. of Terminals:

324

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.95/1.1

Qualification:

Not Qualified

RAM Words:

131072

Maximum Seated Height:

1.4 mm

Speed:

1000 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

1.378 V

Minimum Supply Voltage:

1.272 V

Nominal Supply Voltage:

1.325 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

AM3358BZCZA100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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