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STM32MP151DAB1

STMicroelectronics

STM32MP151DAB1 by STMicroelectronics

STM32MP151DAB1 by STMicroelectronics is a 32-bit microprocessor with integrated cache and 48 MHz max clock frequency. It features 354 terminals, 724992 RAM words, and operates in low power mode. Ideal for applications requiring high-speed processing in compact devices with low power consumption.

Median Price

$6.522

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 23,184 parts In-Stock

1+ parts

$6.241

100+ parts

-

1k+ parts

-

10k+ parts

$6.065

23,184

$6.241

-

-

$6.065

Chip1Stop

Japan . 4,032 parts In-Stock

1+ parts

$6.803

100+ parts

$6.621

1k+ parts

$6.199

10k+ parts

-

4,032

$6.803

$6.621

$6.199

-

Mouser Electronics

USA . 266 parts In-Stock

1+ parts

$9.060

100+ parts

$7.100

1k+ parts

$7.090

10k+ parts

$6.960

266

$9.060

$7.100

$7.090

$6.960

Verical

USA . 23,184 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$6.065

23,184

-

-

-

$6.065

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,613 parts In-Stock

1+ parts

$6.463

100+ parts

-

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-

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2,613

$6.463

-

-

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$11.400

100+ parts

-

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500

$11.400

-

-

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Vyrian

USA . 2,295 parts In-Stock

1+ parts

-

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2,295

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Anansix

USA . 1,384 parts In-Stock

1+ parts

-

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1,384

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,944 parts In-Stock

1+ parts

$5.780

100+ parts

-

1k+ parts

-

10k+ parts

-

2,944

$5.780

-

-

-

Corphita

USA . 4,435 parts In-Stock

1+ parts

$6.123

100+ parts

-

1k+ parts

-

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-

4,435

$6.123

-

-

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Continental Prestige Electronics

USA . 719 parts In-Stock

1+ parts

$11.400

100+ parts

-

1k+ parts

-

10k+ parts

$11.172

719

$11.400

-

-

$11.172

Netroflash

USA . 100 parts In-Stock

1+ parts

$11.400

100+ parts

-

1k+ parts

$10.830

10k+ parts

$10.602

100

$11.400

-

$10.830

$10.602

Semicontronic

India . 2,954 parts In-Stock

1+ parts

$12.360

100+ parts

$12.051

1k+ parts

$11.989

10k+ parts

-

2,954

$12.360

$12.051

$11.989

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Vigor

Singapore . 95 parts In-Stock

1+ parts

$13.350

100+ parts

-

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95

$13.350

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Microchip USA

USA . 1,689 parts In-Stock

1+ parts

$42.252

100+ parts

-

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1,689

$42.252

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-

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$43.896

100+ parts

$41.701

1k+ parts

$41.701

10k+ parts

-

3,000

$43.896

$41.701

$41.701

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Aztec Data Supply Inc.

USA . 278 parts In-Stock

1+ parts

$48.140

100+ parts

-

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-

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278

$48.140

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-

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Corohmni

South Africa . 297 parts In-Stock

1+ parts

$72.391

100+ parts

-

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297

$72.391

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IDEA Electronic Components Group

UK . 1,984 parts In-Stock

1+ parts

$73.195

100+ parts

-

1k+ parts

$65.876

10k+ parts

-

1,984

$73.195

-

$65.876

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MKK Technologies

India . 1,593 parts In-Stock

1+ parts

$137.639

100+ parts

-

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10k+ parts

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1,593

$137.639

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DigiPath Technology Company

USA . 1,593 parts In-Stock

1+ parts

$137.639

100+ parts

-

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1,593

$137.639

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iodParts Technologies Inc.

India . 2,000 parts In-Stock

1+ parts

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2,000

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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2,000

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Argo Parts USA

USA . 519 parts In-Stock

1+ parts

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519

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Parana Technologies

USA . 52 parts In-Stock

1+ parts

-

100+ parts

$87.516

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-

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52

-

$87.516

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-

Overview

Unleash the power of innovation with the STM32MP151DAB1 by STMicroelectronics. As a leader in microprocessor technology, STMicroelectronics delivers top-quality products that exceed expectations. The STM32MP151DAB1 is versatile, reliable, and efficient - making it ideal for a wide range of applications. Experience seamless performance, advanced features, and exceptional value with this cutting-edge microprocessor. Upgrade your projects with the STM32MP151DAB1 and discover a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability of the product.

Integrated Cache: YES

Having integrated cache improves the overall performance of the microprocessor by reducing processing time for frequently accessed data.

Maximum Supply Voltage: 1.38 V

Higher maximum supply voltage allows for more efficient processing capabilities.

On Chip Data RAM Width: 8

Having a wider data RAM width allows for faster data processing and storage capacity.

Address Bus Width: 26

A wider address bus width enables the microprocessor to handle larger memory capacities and data transfers.

Package Shape: SQUARE

Square package shape allows for efficient layout and placement within electronic devices.

Bit Size: 32

32-bit architecture enables the microprocessor to handle larger data sizes and improve computational efficiency.

No. of Terminals: 354

Higher number of terminals provide more connectivity options and capabilities for the microprocessor.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array, low profile, and fine pitch package style allows for compact and efficient integration within devices.

Minimum Supply Voltage: 1.3 V

Lower minimum supply voltage helps in reducing power consumption and improving energy efficiency.

Maximum Operating Temperature: 105 °C

Higher maximum operating temperature ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -20 °C

Lower minimum operating temperature ensures usability in colder environments without risk of damage.

Terminal Position: BOTTOM

Terminal position at the bottom provides easy accessibility for installation and connection.

Maximum Seated Height: 1.29 mm

Low maximum seated height allows for slim and compact designs in electronic devices.

RAM Words: 724992

Higher RAM word count provides ample memory storage capacity for data processing and multitasking.

Width: 16 mm

Compact width size enables easy integration of the microprocessor into various electronic devices.

Boundary Scan: YES

Boundary scan feature allows for efficient testing and debugging of the microprocessor during production and operation.

External Data Bus Width: 16

External data bus width of 16 bits enables faster data exchange between the microprocessor and external devices.

Maximum Clock Frequency: 48 MHz

Clock frequency of 48 MHz allows for fast data processing and computational speed.

Length: 16 mm

Compact length size enables easy integration of the microprocessor into various electronic devices.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture in the microprocessor enables efficient and streamlined processing operations.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microprocessor energy efficient and reliable.

Terminal Form: BALL

Terminal form in ball shape provides secure and stable connections for efficient data transfer.

Maximum Supply Current: 955 mA

Higher maximum supply current ensures stable power delivery to the microprocessor for consistent performance.

Nominal Supply Voltage: 1.34 V

Nominal supply voltage of 1.34 V provides a balanced power input for optimal performance.

No. of DMA Channels: 48

Higher number of DMA channels enhance data transfer speeds and efficiency in handling input/output operations.

No. of Serial I/Os: 8

Having 8 serial I/Os allows for versatile connectivity options and communication capabilities.

Terminal Pitch: 0.8 mm

Narrow terminal pitch of 0.8 mm provides compact connections and efficient data exchange.

Format: FLOATING POINT

Floating point format enables the microprocessor to handle complex mathematical calculations with precision and accuracy.

Speed: 800 rpm

Operating speed of 800 rpm allows for fast data processing and efficient task execution.

Low Power Mode: YES

Low power mode feature helps in reducing energy consumption and heat generation during idle or low usage periods.

Technical Specifications

Microprocessors STM32MP151DAB1 attributes and parameters. Explore more Microprocessors devices from STMicroelectronics

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

48 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B354

Length:

16 mm

Low Power Mode:

YES

No. of DMA Channels:

48

No. of Serial I/Os:

8

No. of Terminals:

354

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA354,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

RAM Words:

724992

Maximum Seated Height:

1.29 mm

Speed:

800 rpm

Maximum Supply Current:

955 mA

Maximum Supply Voltage:

1.38 V

Minimum Supply Voltage:

1.3 V

Nominal Supply Voltage:

1.34 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

16 mm

Peripheral IC Type:

Trade Compliance

STM32MP151DAB1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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