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AM3356BZCZA80

Texas Instruments

AM3356BZCZA80 by Texas Instruments

AM3356BZCZA80 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 28-bit address bus width, and 16-bit external data bus width. It operates at a max clock frequency of 26 MHz and is suitable for industrial applications requiring low power mode and boundary scan capabilities.

Median Price

$17.511

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,474 parts In-Stock

1+ parts

$15.372

100+ parts

$13.427

1k+ parts

$9.260

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-

2,474

$15.372

$13.427

$9.260

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Mouser Electronics

USA . 216 parts In-Stock

1+ parts

$19.650

100+ parts

$13.450

1k+ parts

$12.750

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216

$19.650

$13.450

$12.750

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DigiKey

USA . 103 parts In-Stock

1+ parts

$19.650

100+ parts

$14.681

1k+ parts

$12.751

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103

$19.650

$14.681

$12.751

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Chip1Stop

Japan . 126 parts In-Stock

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-

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$13.618

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126

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$13.618

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Distributors (In-Stock)

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Digiode

USA . 2,681 parts In-Stock

1+ parts

$14.603

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2,681

$14.603

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Maritex

Poland . 378 parts In-Stock

1+ parts

$16.450

100+ parts

$10.027

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$7.984

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378

$16.450

$10.027

$7.984

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Nova Conductors

Japan . 10 parts In-Stock

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$18.110

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10

$18.110

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VNN

France . 20,432 parts In-Stock

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20,432

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Chip Stock

USA . 15,100 parts In-Stock

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Vyrian

USA . 2,867 parts In-Stock

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2,867

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Cyclops Electronics Ltd

UK . 1,531 parts In-Stock

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Classic Components Corporation

USA . 427 parts In-Stock

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427

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Distributors (Availability)

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Semicontronic

India . 752 parts In-Stock

1+ parts

$11.580

100+ parts

$11.290

1k+ parts

$11.233

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752

$11.580

$11.290

$11.233

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Ampacity Inc.

Singapore . 370 parts In-Stock

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$11.580

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370

$11.580

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Corphita

USA . 384 parts In-Stock

1+ parts

$13.835

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384

$13.835

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Continental Prestige Electronics

USA . 2,252 parts In-Stock

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$18.110

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$17.748

2,252

$18.110

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$17.748

Netroflash

USA . 500 parts In-Stock

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$18.110

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$17.748

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500

$18.110

$17.748

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Parana Technologies

USA . 915 parts In-Stock

1+ parts

$38.461

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915

$38.461

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DigiPath Technology Company

USA . 722 parts In-Stock

1+ parts

$42.351

100+ parts

$38.963

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-

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722

$42.351

$38.963

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ChromeModa Solutions

Germany . 6,335 parts In-Stock

1+ parts

$43.215

100+ parts

$35.436

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6,335

$43.215

$35.436

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IDEA Electronic Components Group

UK . 1,371 parts In-Stock

1+ parts

$43.215

100+ parts

$41.054

1k+ parts

$38.894

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1,371

$43.215

$41.054

$38.894

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Corohmni

South Africa . 1,088 parts In-Stock

1+ parts

$52.880

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1,088

$52.880

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Advanced Electronics

New Zealand . 700 parts In-Stock

1+ parts

$81.346

100+ parts

$77.279

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$77.279

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700

$81.346

$77.279

$77.279

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Lixinc

USA . 4,896 parts In-Stock

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Argo Parts USA

USA . 2,964 parts In-Stock

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iodParts Technologies Inc.

India . 1,207 parts In-Stock

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Authorized Procurement Solutions

USA . 1,100 parts In-Stock

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1,100

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Futuretech Components

Singapore . 1,000 parts In-Stock

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Perfect Parts

USA . 840 parts In-Stock

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840

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Overview

Elevate your projects with the Texas Instruments AM3356BZCZA80 microprocessor, a top-of-the-line solution known for its exceptional quality and reliability. Manufactured by industry leader Texas Instruments, this powerful chip boasts integrated cache and a wide range of applications in various industries. With a low profile package style and advanced technology, the AM3356BZCZA80 offers customers unrivaled value, efficiency, and performance. Upgrade your designs today with this cutting-edge microprocessor and experience the difference firsthand!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and reliable, making the product suitable for various environments.

Integrated Cache: YES

Having an integrated cache improves the performance of the microprocessor by reducing the average time to access memory.

Maximum Supply Voltage: 1.326 V

A higher maximum supply voltage allows for greater flexibility in power management and performance optimization.

On Chip Data RAM Width: 8

Having a wider data RAM width enables the microprocessor to process larger chunks of data in parallel, leading to improved efficiency.

Address Bus Width: 28

A wider address bus allows the microprocessor to access a larger memory space, making it suitable for handling complex computations and larger data sets.

Package Shape: SQUARE

A square package shape provides more efficient use of space and easier integration into circuit designs.

Bit Size: 32

A 32-bit architecture allows the microprocessor to handle larger data sets and perform more complex calculations, making it a versatile choice for various applications.

Power Supplies (V): 0.95/1.1

Having multiple power supply options allows for flexibility in power management and energy efficiency.

No. of Terminals: 324

A higher number of terminals provide greater connectivity options and potential for expansion and customization.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact design, reduced footprint, and enhanced thermal performance, making it suitable for space-constrained applications.

Minimum Supply Voltage: 1.21 V

A lower minimum supply voltage can help optimize power consumption and improve energy efficiency.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this microprocessor can withstand extended use in demanding environments without overheating.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes this microprocessor suitable for use in a wide range of environmental conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides good electrical conductivity and corrosion resistance, ensuring reliable connectivity and longevity.

Terminal Position: BOTTOM

Having terminals positioned at the bottom facilitates easier assembly and better heat dissipation, enhancing overall performance and reliability.

Maximum Seated Height: 1.4 mm

A low maximum seated height allows for a more compact and streamlined design, ideal for applications with limited space constraints.

RAM Words: 131072

A larger RAM capacity enables the microprocessor to efficiently handle a greater amount of data and instructions, enhancing overall performance.

Width: 15 mm

The compact width makes this microprocessor suitable for applications where space is a premium, without compromising on performance.

Boundary Scan: YES

Boundary scan capability helps in testing and debugging the microprocessor, ensuring reliability and ease of integration.

External Data Bus Width: 16

A wider external data bus allows for faster data transfer between the microprocessor and external components, improving overall system performance.

Maximum Clock Frequency: 26 MHz

A high maximum clock frequency enables the microprocessor to execute instructions quickly and efficiently, making it suitable for time-sensitive applications.

Maximum Time At Peak Reflow Temperature (s): 30

The microprocessor can withstand peak reflow temperatures for a sufficient time, ensuring proper soldering and reliability during assembly.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, the microprocessor can endure the soldering process effectively without damage.

Length: 15 mm

The compact length of the microprocessor makes it suitable for small form factor devices and applications with space constraints.

Temperature Grade: INDUSTRIAL

Designed to operate in industrial temperature ranges, this microprocessor is suitable for rugged environments and extended usage.

Peripheral IC Type: MICROPROCESSOR, RISC

As a RISC microprocessor, it offers simplified instruction set architecture, enabling faster execution of instructions and improved performance efficiency.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and fast switching speeds, making this microprocessor energy-efficient and reliable.

Terminal Form: BALL

Using ball terminals facilitates easier soldering, better thermal conductivity, and reliable connections, ensuring high performance and durability.

Maximum Supply Current: 400 mA

The microprocessor can operate within a specified maximum supply current, ensuring optimal performance and reliability under varying load conditions.

Nominal Supply Voltage: 1.26 V

Having a stable nominal supply voltage helps maintain consistent performance and efficiency, ensuring reliable operation in diverse applications.

No. of DMA Channels: 64

With a high number of DMA channels, the microprocessor can efficiently manage data transfer and processing tasks, improving overall system performance.

Terminal Pitch: 0.8 mm

A narrow terminal pitch allows for greater terminal density, enabling more connections in a compact space and enhancing overall functionality.

Format: FIXED POINT

Operating in fixed-point format simplifies computation and improves performance efficiency, making this microprocessor suitable for a wide range of applications.

Moisture Sensitivity Level (MSL): 3

With a moderate moisture sensitivity level, the microprocessor can withstand standard storage and handling conditions without risk of damage.

Speed: 800 rpm

With a high rotational speed, the microprocessor can deliver quick processing and response times, making it ideal for demanding applications.

Low Power Mode: YES

The low power mode feature allows the microprocessor to conserve energy when not operating at full capacity, reducing power consumption and heat generation.

Technical Specifications

Microprocessors AM3356BZCZA80 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

64

No. of Terminals:

324

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.95/1.1

Qualification:

Not Qualified

RAM Words:

131072

Maximum Seated Height:

1.4 mm

Speed:

800 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

1.326 V

Minimum Supply Voltage:

1.21 V

Nominal Supply Voltage:

1.26 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

AM3356BZCZA80 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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