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ATSAMA5D34A-CUR

Microchip Technology

ATSAMA5D34A-CUR by Microchip Technology

ATSAMA5D34A-CUR by Microchip: 32-bit microprocessor with 1.2V supply, 48MHz clock frequency, and 131072 RAM words. Ideal for industrial applications requiring high-speed processing, low power mode, and extensive peripheral support. Features include integrated cache, 26-bit address bus width, and boundary scan capability.

Median Price

$12.500

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 430 parts In-Stock

1+ parts

$14.280

100+ parts

$11.760

1k+ parts

$10.740

10k+ parts

$10.300

430

$14.280

$11.760

$10.740

$10.300

Future Electronics

Canada . 2,000 parts In-Stock

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$12.500

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DigiKey

USA . 500 parts In-Stock

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$11.760

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500

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$11.760

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Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

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$12.399

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10

$12.399

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Digiode

USA . 238 parts In-Stock

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$13.566

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238

$13.566

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Chip Stock

USA . 12,000 parts In-Stock

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12,000

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VNN

France . 5,112 parts In-Stock

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Vyrian

USA . 1,155 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,126 parts In-Stock

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$12.140

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1,126

$12.140

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Semicontronic

India . 342 parts In-Stock

1+ parts

$12.140

100+ parts

$11.836

1k+ parts

$11.776

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342

$12.140

$11.836

$11.776

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Vigor

Singapore . 500 parts In-Stock

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$12.360

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500

$12.360

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Continental Prestige Electronics

USA . 6,106 parts In-Stock

1+ parts

$12.399

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$12.151

6,106

$12.399

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$12.151

Corphita

USA . 360 parts In-Stock

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$12.852

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360

$12.852

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Corohmni

South Africa . 540 parts In-Stock

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$52.036

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540

$52.036

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Aztec Data Supply Inc.

USA . 4,638 parts In-Stock

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$72.003

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Lixinc

USA . 10,731 parts In-Stock

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QualityLine Systems

Poland . 7,729 parts In-Stock

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7,729

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XL Components Corporation

Australia . 5,575 parts In-Stock

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Argo Parts USA

USA . 4,593 parts In-Stock

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Supply Digital

USA . 2,462 parts In-Stock

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Perfect Parts

USA . 2,177 parts In-Stock

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Authorized Procurement Solutions

USA . 1,190 parts In-Stock

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Kepictronics

USA . 414 parts In-Stock

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Marpe Global Electronics

Taiwan . 283 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the Microchip Technology ATSAMA5D34A-CUR microprocessor. As a leading manufacturer in the industry, Microchip Technology delivers top-quality products that are reliable and efficient. This microprocessor is ideal for a wide range of applications, offering seamless integration and advanced features. Elevate your projects with the cutting-edge technology and superior capabilities of the ATSAMA5D34A-CUR, providing you with unparalleled value and benefits. Experience innovation at its finest with Microchip Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable devices.

Integrated Cache: YES

Having an integrated cache improves processing speed by storing frequently accessed data, enhancing overall performance.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage allows for flexibility in power management and performance optimization.

On Chip Data RAM Width: 8

Having a width of 8 for on-chip data RAM allows for faster data processing and storage capabilities.

Address Bus Width: 26

A wide address bus width of 26 enables the processor to handle large amounts of memory efficiently.

Package Shape: SQUARE

The square package shape allows for efficient use of space and easy integration into circuit designs.

Bit Size: 32

A bit size of 32 enables the processor to handle data in 32-bit chunks, leading to faster processing speeds.

Power Supplies (V): 1.2

The standard power supply voltage of 1.2V ensures compatibility with most power sources and efficient power consumption.

No. of Terminals: 324

Having 324 terminals provides ample connectivity options for peripheral devices and external components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, fine pitch package style offers high density integration and efficient thermal management.

Minimum Supply Voltage: 1.08 V

With a minimum supply voltage of 1.08V, the processor can operate efficiently even under low power conditions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures stability and reliability in various environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the processor to function in extreme cold environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, copper provides excellent conductivity and resistance to corrosion, ensuring long-term reliability.

Terminal Position: BOTTOM

Having terminals positioned at the bottom simplifies the installation process and improves thermal management.

Maximum Seated Height: 1.4 mm

The low maximum seated height of 1.4 mm allows for compact designs and efficient airflow for cooling.

RAM Words: 131072

The large number of RAM words (131072) provides ample memory capacity for handling complex computational tasks.

Width: 15 mm

The compact width of 15 mm ensures the processor can fit into space-constrained devices while maintaining high performance.

Boundary Scan: YES

Having boundary scan capability allows for efficient testing and debugging of the processor during development and production.

External Data Bus Width: 16

An external data bus width of 16 enables fast data transfer between the processor and external devices.

Maximum Clock Frequency: 48 MHz

The high maximum clock frequency of 48 MHz allows for fast data processing and responsive performance.

Length: 15 mm

With a length of 15 mm, the processor is compact and suitable for small form factor devices without compromising performance.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments with varying temperature conditions.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a microprocessor with Reduced Instruction Set Computing (RISC) architecture offers efficient and streamlined processing of instructions.

Technology: CMOS

The CMOS technology used in the processor provides low power consumption, high speed, and reliable performance.

Terminal Form: BALL

The terminal form of ball simplifies soldering and ensures secure connections with the circuit board.

Nominal Supply Voltage: 1.2 V

Having a nominal supply voltage of 1.2V ensures stable and efficient operation under standard conditions.

No. of DMA Channels: 39

With 39 DMA channels, the processor can efficiently manage data transfer between peripherals and memory without CPU intervention.

No. of Serial I/Os: 10

Having 10 serial I/Os enables the processor to communicate with multiple external devices simultaneously, enhancing connectivity.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8 mm allows for high-density mounting and space-saving integration in circuit designs.

Format: FLOATING POINT

The floating-point format allows for precise mathematical calculations and improved accuracy in numerical operations.

Speed: 536 rpm

With a speed of 536 rpm, the processor delivers fast performance and responsiveness in executing tasks.

Low Power Mode: YES

The low power mode capability allows the processor to operate efficiently while conserving energy, ideal for battery-powered devices.

Technical Specifications

Microprocessors ATSAMA5D34A-CUR attributes and parameters. Explore more Microprocessors devices from Microchip Technology

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

48 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

No. of DMA Channels:

39

No. of External Interrupts:

1

No. of Serial I/Os:

10

No. of Terminals:

324

On Chip Data RAM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.2

Qualification:

Not Qualified

RAM Words:

131072

Maximum Seated Height:

1.4 mm

Speed:

536 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

15 mm

Peripheral IC Type:

Trade Compliance

ATSAMA5D34A-CUR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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