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ATSAMA5D27C-LD2G-CUR

Microchip Technology

ATSAMA5D27C-LD2G-CUR by Microchip Technology

ATSAMA5D27C-LD2G-CUR by Microchip: 16-bit, 24MHz clock, 32-word RAM. Ideal for industrial applications requiring low power consumption and high-speed processing. Features integrated cache, 51 DMA channels, and operates b/w -40 to 85°C.

Median Price

$15.320

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 296 parts In-Stock

1+ parts

$15.320

100+ parts

$13.700

1k+ parts

$13.080

10k+ parts

$12.710

296

$15.320

$13.700

$13.080

$12.710

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$22.728

100+ parts

-

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-

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200

$22.728

-

-

-

IBS Electronics

USA . 7,000 parts In-Stock

1+ parts

-

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-

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$23.400

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7,000

-

-

$23.400

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Vyrian

USA . 5,861 parts In-Stock

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5,861

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-

-

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VNN

France . 609 parts In-Stock

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609

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 382 parts In-Stock

1+ parts

$8.880

100+ parts

-

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382

$8.880

-

-

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Vigor

Singapore . 2,000 parts In-Stock

1+ parts

$17.160

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2,000

$17.160

-

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Semicontronic

India . 14,904 parts In-Stock

1+ parts

$19.930

100+ parts

$19.432

1k+ parts

$19.332

10k+ parts

-

14,904

$19.930

$19.432

$19.332

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Ampacity Inc.

Singapore . 14,791 parts In-Stock

1+ parts

$19.930

100+ parts

-

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14,791

$19.930

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Continental Prestige Electronics

USA . 3,150 parts In-Stock

1+ parts

$22.728

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-

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10k+ parts

$22.273

3,150

$22.728

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-

$22.273

Corohmni

South Africa . 873 parts In-Stock

1+ parts

$39.176

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873

$39.176

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Advanced Electronics

New Zealand . 66 parts In-Stock

1+ parts

$42.288

100+ parts

$40.173

1k+ parts

$40.173

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-

66

$42.288

$40.173

$40.173

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Microchip USA

USA . 2,685 parts In-Stock

1+ parts

$48.780

100+ parts

$47.930

1k+ parts

$47.510

10k+ parts

$47.090

2,685

$48.780

$47.930

$47.510

$47.090

Aztec Data Supply Inc.

USA . 655 parts In-Stock

1+ parts

$72.580

100+ parts

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655

$72.580

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Lixinc

USA . 9,332 parts In-Stock

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9,332

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West Coast Incorporated

USA . 3,916 parts In-Stock

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3,916

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Argo Parts USA

USA . 2,808 parts In-Stock

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2,808

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

$22.273

1k+ parts

$21.591

10k+ parts

$21.137

2,000

-

$22.273

$21.591

$21.137

Robosynatics

Brazil . 500 parts In-Stock

1+ parts

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500

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Lucentia Tech

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$0.303

1k+ parts

$0.303

10k+ parts

$0.303

500

-

$0.303

$0.303

$0.303

Overview

Unlock the power of cutting-edge technology with the ATSAMA5D27C-LD2G-CUR by Microchip Technology. This high-quality microprocessor offers unparalleled performance and reliability, making it the perfect choice for a wide range of applications. With advanced features such as integrated cache and low power mode, this product delivers exceptional value and benefits to customers seeking top-notch processing capabilities. Trust Microchip Technology to provide you with the tools you need to stay ahead in today's fast-paced world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product lightweight and durable, perfect for portable devices.

Integrated Cache: YES

The integrated cache allows for faster processing speeds and efficient multitasking capabilities.

Surface Mount: YES

Surface mount technology simplifies the manufacturing process and saves space on the circuit board.

Maximum Supply Voltage: 1.9 V

This higher supply voltage ensures stable performance and reliability under varying load conditions.

On Chip Data RAM Width: 32

The wide data RAM width allows for quick access to stored data, improving overall processing speed.

Package Shape: SQUARE

The square package shape provides a compact footprint, ideal for space-constrained applications.

Bit Size: 16

The 16-bit architecture enables efficient processing of data and instructions, enhancing overall performance.

No. of Terminals: 361

With a large number of terminals, this microprocessor can interface with various external components for enhanced functionality.

Package Style: GRID ARRAY, THIN PROFILE, FINE PITCH

This package style offers high-density mounting, making it suitable for complex electronic systems with limited space.

Minimum Supply Voltage: 1.7 V

The low minimum supply voltage allows for power-efficient operation, extending battery life in mobile devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microprocessor can withstand demanding environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in harsh cold environments.

Terminal Position: BOTTOM

Bottom terminal positioning simplifies the PCB layout and facilitates easy assembly and maintenance.

Maximum Seated Height: 1.2 mm

The low seated height profile makes this microprocessor suitable for slim and compact device designs.

RAM Words: 32768

The large RAM capacity provides ample storage for data and instructions, supporting complex computing tasks.

Width: 16 mm

The compact width dimension enables efficient placement on the PCB, optimizing space utilization.

Boundary Scan: YES

Boundary scan capability aids in debugging and testing during the manufacturing process, ensuring high product quality.

Maximum Clock Frequency: 24 MHz

The high clock frequency allows for swift data processing and quick response times.

Length: 16 mm

With a small length dimension, this microprocessor can fit into tight spaces without sacrificing performance.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this microprocessor can operate reliably in rugged environments.

Peripheral IC Type: MICROPROCESSOR, RISC

The RISC architecture of this microprocessor enhances overall performance by simplifying data processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for energy-efficient devices.

Terminal Form: BALL

The ball terminal form simplifies soldering and ensures secure connections for robust performance.

Nominal Supply Voltage: 1.8 V

The stable nominal supply voltage ensures consistent operation and minimizes the risk of voltage fluctuations.

No. of DMA Channels: 51

With a high number of DMA channels, this microprocessor can efficiently manage data transfers and optimize system performance.

Terminal Pitch: 0.8 mm

The narrow terminal pitch allows for high-density mounting, maximizing connectivity options in a limited space.

Format: FIXED POINT

The fixed-point format simplifies mathematical operations and enhances computational efficiency.

Speed: 500 rpm

The high speed of 500 rpm enables rapid data processing and seamless multitasking capabilities.

Low Power Mode: YES

The low power mode feature conserves energy and extends battery life, making this microprocessor environmentally friendly.

Technical Specifications

Microprocessors ATSAMA5D27C-LD2G-CUR attributes and parameters. Explore more Microprocessors devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

24 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-G361

Length:

16 mm

Low Power Mode:

YES

No. of DMA Channels:

51

No. of Serial I/Os:

1

No. of Terminals:

361

On Chip Data RAM Width:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

RAM Words:

32768

Maximum Seated Height:

1.2 mm

Speed:

500 rpm

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

16 mm

Peripheral IC Type:

Trade Compliance

ATSAMA5D27C-LD2G-CUR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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