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AM3356BZCZD60

Texas Instruments

AM3356BZCZD60 by Texas Instruments

AM3356BZCZD60 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 16-bit external data bus width, and 64 DMA channels. Ideal for industrial applications requiring low power mode, it operates at a max clock frequency of 26 MHz and supports boundary scan testing.

Median Price

$15.722

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,820 parts In-Stock

1+ parts

$13.725

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$11.989

1k+ parts

$8.268

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2,820

$13.725

$11.989

$8.268

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DigiKey

USA . 172 parts In-Stock

1+ parts

$17.720

100+ parts

$13.178

1k+ parts

$12.049

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172

$17.720

$13.178

$12.049

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Mouser Electronics

USA . 170 parts In-Stock

1+ parts

$17.720

100+ parts

$11.610

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$11.600

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170

$17.720

$11.610

$11.600

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Chip1Stop

Japan . 126 parts In-Stock

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$12.500

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126

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$12.500

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Distributors (In-Stock)

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Nova Conductors

Japan . 200 parts In-Stock

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$12.588

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200

$12.588

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Digiode

USA . 2,434 parts In-Stock

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$13.039

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2,434

$13.039

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Vyrian

USA . 7,893 parts In-Stock

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7,893

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Chip Stock

USA . 4,700 parts In-Stock

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4,700

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VNN

France . 3,604 parts In-Stock

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3,604

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Classic Components Corporation

USA . 490 parts In-Stock

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490

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Distributors (Availability)

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Semicontronic

India . 499 parts In-Stock

1+ parts

$10.630

100+ parts

$10.364

1k+ parts

$10.311

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499

$10.630

$10.364

$10.311

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Ampacity Inc.

Singapore . 454 parts In-Stock

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$10.630

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454

$10.630

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Corphita

USA . 4,305 parts In-Stock

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$12.352

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4,305

$12.352

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Corohmni

South Africa . 636 parts In-Stock

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$22.964

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636

$22.964

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Parana Technologies

USA . 771 parts In-Stock

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$61.503

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771

$61.503

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Advanced Electronics

New Zealand . 46 parts In-Stock

1+ parts

$61.560

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$58.482

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$58.482

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46

$61.560

$58.482

$58.482

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DigiPath Technology Company

USA . 837 parts In-Stock

1+ parts

$67.722

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$62.304

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837

$67.722

$62.304

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ChromeModa Solutions

Germany . 1,064 parts In-Stock

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$69.104

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$56.665

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1,064

$69.104

$56.665

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IDEA Electronic Components Group

UK . 520 parts In-Stock

1+ parts

$69.104

100+ parts

$65.649

1k+ parts

$62.194

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520

$69.104

$65.649

$62.194

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QUARKTWIN TECHNOLOGY LTD

USA . 14,696 parts In-Stock

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A-Z Elektronik GmbH

Germany . 10,976 parts In-Stock

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Lixinc

USA . 10,448 parts In-Stock

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Perfect Parts

USA . 8,586 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,516 parts In-Stock

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Kepictronics

USA . 4,128 parts In-Stock

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Continental Prestige Electronics

USA . 3,095 parts In-Stock

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GreenTree Electronics

Israel . 2,142 parts In-Stock

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Futuretech Components

Singapore . 2,000 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Argo Parts USA

USA . 288 parts In-Stock

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288

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Overview

Unlock unparalleled performance and efficiency with the AM3356BZCZD60 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microprocessors that are ideal for a wide range of applications. From embedded systems to industrial automation, this microprocessor offers exceptional value, benefits, and advantages to customers looking to optimize their systems. Experience seamless operation, advanced features, and reliable performance with the AM3356BZCZD60 - the perfect choice for all your processing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability to the package, ensuring long-lasting performance of the microprocessor.

Integrated Cache: YES

Having integrated cache helps in improving the overall performance of the microprocessor by reducing memory access times and increasing processing speed.

Surface Mount: YES

Surface mount capability makes it easier to mount the microprocessor on a circuit board, saving space and reducing assembly time.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, this microprocessor can withstand harsh environmental conditions and maintain stable performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range ensures that the microprocessor can function reliably even in cold environments.

Maximum Clock Frequency: 26 MHz

The high maximum clock frequency allows for fast processing speed and efficient operation of the microprocessor.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC (Reduced Instruction Set Computer) microprocessor, it offers enhanced performance and efficiency in executing instructions.

Technology: CMOS

CMOS technology provides low power consumption and high speed operation, making the microprocessor energy-efficient and fast.

Speed: 600 rpm

The high speed of 600 rpm ensures rapid data transfer and processing capabilities, making this microprocessor suitable for demanding applications.

Technical Specifications

Microprocessors AM3356BZCZD60 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

64

No. of Terminals:

324

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.95/1.1

Qualification:

Not Qualified

RAM Words:

131072

Maximum Seated Height:

1.4 mm

Speed:

600 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

1.144 V

Minimum Supply Voltage:

1.056 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

AM3356BZCZD60 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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