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AM3354BZCZD80

Texas Instruments

AM3354BZCZD80 by Texas Instruments

AM3354BZCZD80 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words and 16-bit external data bus width. It operates at a max clock frequency of 26 MHz, suitable for industrial applications requiring low power mode and boundary scan capability. The package style is grid array, low profile, fine pitch with a terminal pitch of 0.8 mm.

Median Price

$15.988

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 59 parts In-Stock

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$11.620

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$8.480

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59

$11.620

$8.480

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Texas Instruments

USA . 75,703 parts In-Stock

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$13.725

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$11.989

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$8.268

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$13.725

$11.989

$8.268

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Newark

USA . 9 parts In-Stock

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$18.250

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$13.580

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-

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9

$18.250

$13.580

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Element14

Singapore . 59 parts In-Stock

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$18.890

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$13.450

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59

$18.890

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Mouser Electronics

USA . 607 parts In-Stock

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$19.330

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$13.970

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$13.710

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607

$19.330

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$13.710

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DigiKey

USA . 48 parts In-Stock

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$19.330

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$14.433

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48

$19.330

$14.433

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Chip1Stop

Japan . 1,638 parts In-Stock

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$11.766

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$10.924

1,638

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$10.924

Arrow

USA . 378 parts In-Stock

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-

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$11.439

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378

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$11.439

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,075 parts In-Stock

1+ parts

$13.039

100+ parts

-

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1,075

$13.039

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Maritex

Poland . 56 parts In-Stock

1+ parts

$13.105

100+ parts

$8.180

1k+ parts

$6.642

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56

$13.105

$8.180

$6.642

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Nova Conductors

Japan . 56 parts In-Stock

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$14.386

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56

$14.386

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Vyrian

USA . 9,652 parts In-Stock

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Semtec, LLC

USA . 6,510 parts In-Stock

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Chip Stock

USA . 6,433 parts In-Stock

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6,433

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Cyclops Electronics Ltd

UK . 3,035 parts In-Stock

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VNN

France . 1,472 parts In-Stock

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GLYN GmbH & Co. KG

Germany . 76 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 9,650 parts In-Stock

1+ parts

$9.720

100+ parts

-

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9,650

$9.720

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Semicontronic

India . 9,619 parts In-Stock

1+ parts

$9.720

100+ parts

$9.477

1k+ parts

$9.428

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9,619

$9.720

$9.477

$9.428

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Corphita

USA . 444 parts In-Stock

1+ parts

$12.352

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444

$12.352

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$14.386

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$14.099

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2,000

$14.386

$14.099

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Continental Prestige Electronics

USA . 62 parts In-Stock

1+ parts

$18.330

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$14.230

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62

$18.330

$14.230

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Parana Technologies

USA . 1,196 parts In-Stock

1+ parts

$25.207

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$25.849

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$25.207

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$25.849

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DigiPath Technology Company

USA . 1,457 parts In-Stock

1+ parts

$27.756

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$27.756

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ChromeModa Solutions

Germany . 1,537 parts In-Stock

1+ parts

$28.322

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$23.224

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$28.322

$23.224

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IDEA Electronic Components Group

UK . 551 parts In-Stock

1+ parts

$28.322

100+ parts

$26.906

1k+ parts

$25.490

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551

$28.322

$26.906

$25.490

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Corohmni

South Africa . 89 parts In-Stock

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$29.945

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89

$29.945

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$70.891

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$67.346

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$67.346

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$70.891

$67.346

$67.346

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Lixinc

USA . 18,278 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,588 parts In-Stock

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7,588

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Epart123

USA . 3,780 parts In-Stock

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$8.600

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$8.600

3,780

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-

$8.600

$8.600

Alle Elektronik GmbH

Germany . 3,725 parts In-Stock

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3,725

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Kepictronics

USA . 2,520 parts In-Stock

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2,520

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Assy Fe

Spain . 2,500 parts In-Stock

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S.R.D Solutions

India . 2,500 parts In-Stock

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Argo Parts USA

USA . 1,894 parts In-Stock

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1,894

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Authorized Procurement Solutions

USA . 1,100 parts In-Stock

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Robosynatics

Brazil . 350 parts In-Stock

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350

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Lucentia Tech

USA . 350 parts In-Stock

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$0.443

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$0.443

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$0.443

350

-

$0.443

$0.443

$0.443

iodParts Technologies Inc.

India . 30 parts In-Stock

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30

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Overview

Experience the unmatched quality and reliability of Texas Instruments with the AM3354BZCZD80 microprocessor. This cutting-edge component offers seamless integration, superior performance, and a wide range of applications in various industries. Its advanced features, including integrated cache and low power mode, ensure optimal efficiency and speed. Trust in Texas Instruments to deliver top-of-the-line technology that exceeds expectations and provides unparalleled value to customers looking for the best in microprocessor solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microprocessor, ensuring a longer lifespan.

Integrated Cache: YES

Integrated cache helps improve the speed and efficiency of processing tasks by storing frequently accessed data for quick retrieval.

Maximum Supply Voltage: 1.326 V

A higher maximum supply voltage allows for increased performance capabilities without risking damage to the microprocessor.

On Chip Data RAM Width: 8

Having a wider data RAM width allows for faster data processing and improved multitasking capabilities.

Address Bus Width: 28

A wider address bus width enables the microprocessor to access larger amounts of memory, enhancing its overall processing power.

Package Shape: SQUARE

Square package shape helps with space efficiency and easier integration into circuit designs.

Bit Size: 32

A higher bit size allows for processing larger chunks of data at once, improving performance and efficiency.

Power Supplies (V): 0.95/1.1

Having multiple power supply options enables flexible power management based on performance needs and energy efficiency considerations.

No. of Terminals: 324

A higher number of terminals allows for more connectivity options and functionality in the microprocessor.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact and efficient design, making it easier to mount and integrate into electronic devices.

Minimum Supply Voltage: 1.21 V

A lower minimum supply voltage helps with power efficiency and can extend battery life in portable devices.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, this microprocessor can withstand elevated temperatures without performance degradation.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes this microprocessor suitable for a wide range of environmental conditions.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides good conductivity and corrosion resistance, ensuring reliable connections and longevity.

Maximum Seated Height: 1.4 mm

Low seated height allows for a more compact design and easier integration into slim devices.

RAM Words: 131072

A large RAM capacity enables the microprocessor to handle complex data processing tasks and run multiple applications simultaneously.

Width: 15 mm

Compact width allows for flexibility in circuit board layouts and space-constrained applications.

Boundary Scan: YES

Boundary scan capability helps with testing and debugging during the manufacturing and maintenance processes.

External Data Bus Width: 16

Having a wide external data bus width enhances data transfer speeds between the microprocessor and external components.

Maximum Clock Frequency: 26 MHz

High clock frequency enables fast data processing and smooth operation of applications that require real-time responsiveness.

Maximum Time At Peak Reflow Temperature (s): 30

This parameter ensures that the microprocessor can withstand reflow soldering processes without damage within the specified time limit.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this microprocessor can endure soldering processes without compromising its functionality.

Length: 15 mm

Compact length allows for space-efficient placement on circuit boards and in electronic devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance makes this microprocessor suitable for harsh operating environments and industrial applications.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture helps improve processing efficiency and execution speed, making this microprocessor ideal for performance-critical applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, leading to energy-efficient and reliable operation.

Terminal Form: BALL

Ball terminal form offers secure connections and ease of soldering during the manufacturing process.

Maximum Supply Current: 400 mA

Having a higher maximum supply current capacity allows for handling power demands during peak performance without voltage drop issues.

Nominal Supply Voltage: 1.26 V

Stable nominal supply voltage ensures consistent performance and reliable operation of the microprocessor under normal operating conditions.

No. of DMA Channels: 64

A high number of DMA channels provide efficient data transfer capabilities, enhancing overall system performance and multitasking abilities.

Terminal Pitch: 0.8 mm

Narrow terminal pitch allows for denser terminal configurations, enabling more connections in a limited space for increased functionality.

Format: FIXED POINT

Fixed-point format simplifies mathematical operations and improves computational efficiency for certain applications.

Moisture Sensitivity Level (MSL): 3

MSL level indicates the microprocessor's resistance to moisture, ensuring reliability in humid environments or during reflow soldering processes.

Speed: 800 rpm

High speed capability enables quick data processing and efficient execution of tasks, making this microprocessor suitable for high-performance applications.

Low Power Mode: YES

Low power mode feature helps conserve energy and extend battery life in portable devices, providing a balance between performance and energy efficiency.

Technical Specifications

Microprocessors AM3354BZCZD80 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

64

No. of Terminals:

324

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.95/1.1

Qualification:

Not Qualified

RAM Words:

131072

Maximum Seated Height:

1.4 mm

Speed:

800 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

1.326 V

Minimum Supply Voltage:

1.21 V

Nominal Supply Voltage:

1.26 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

AM3354BZCZD80 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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