Loading...

AM3352BZCE30

Texas Instruments

AM3352BZCE30 by Texas Instruments

AM3352BZCE30 by Texas Instruments is a 32-bit microprocessor with integrated cache and 131072 RAM words. It operates at a max clock frequency of 26 MHz, suitable for low power applications. The package style is grid array, making it ideal for compact designs in various electronic devices.

Median Price

$11.213

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,006 parts In-Stock

1+ parts

$10.342

100+ parts

$9.034

1k+ parts

$6.230

10k+ parts

-

1,006

$10.342

$9.034

$6.230

-

Mouser Electronics

USA . 640 parts In-Stock

1+ parts

$13.690

100+ parts

$9.020

1k+ parts

$8.950

10k+ parts

-

640

$13.690

$9.020

$8.950

-

DigiKey

USA . 160 parts In-Stock

1+ parts

$13.690

100+ parts

$10.066

1k+ parts

$9.064

10k+ parts

-

160

$13.690

$10.066

$9.064

-

Rochester

USA . 120 parts In-Stock

1+ parts

-

100+ parts

$7.790

1k+ parts

$6.970

10k+ parts

$6.560

120

-

$7.790

$6.970

$6.560

Verical

USA . 60 parts In-Stock

1+ parts

-

100+ parts

$11.213

1k+ parts

$10.025

10k+ parts

$9.438

60

-

$11.213

$10.025

$9.438

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,792 parts In-Stock

1+ parts

$8.218

100+ parts

-

1k+ parts

-

10k+ parts

-

4,792

$8.218

-

-

-

Nova Conductors

Japan . 62 parts In-Stock

1+ parts

$10.375

100+ parts

-

1k+ parts

-

10k+ parts

-

62

$10.375

-

-

-

Vyrian

USA . 6,217 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,217

-

-

-

-

VNN

France . 4,630 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,630

-

-

-

-

North Shore Components

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

LIBRA Elektronik GmbH

Germany . 172 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

172

-

-

-

-

ComSIT USA

USA . 88 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

88

-

-

-

-

ComSIT Distribution GmbH

Germany . 88 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

88

-

-

-

-

DigiKey Marketplace

USA . 60 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

60

-

-

-

-

Prism Electronics

USA . 5 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 321 parts In-Stock

1+ parts

$7.350

100+ parts

-

1k+ parts

-

10k+ parts

-

321

$7.350

-

-

-

Semicontronic

India . 16 parts In-Stock

1+ parts

$7.350

100+ parts

$7.166

1k+ parts

$7.130

10k+ parts

-

16

$7.350

$7.166

$7.130

-

Corphita

USA . 3,123 parts In-Stock

1+ parts

$7.785

100+ parts

-

1k+ parts

-

10k+ parts

-

3,123

$7.785

-

-

-

Component Stockers USA

USA . 1,497 parts In-Stock

1+ parts

$8.750

100+ parts

$8.220

1k+ parts

-

10k+ parts

-

1,497

$8.750

$8.220

-

-

Continental Prestige Electronics

USA . 4,042 parts In-Stock

1+ parts

$10.375

100+ parts

-

1k+ parts

-

10k+ parts

$10.168

4,042

$10.375

-

-

$10.168

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$10.375

100+ parts

$10.168

1k+ parts

-

10k+ parts

-

2,000

$10.375

$10.168

-

-

Corohmni

South Africa . 365 parts In-Stock

1+ parts

$16.725

100+ parts

-

1k+ parts

-

10k+ parts

-

365

$16.725

-

-

-

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$34.054

100+ parts

$32.351

1k+ parts

$32.351

10k+ parts

-

2,000

$34.054

$32.351

$32.351

-

Parana Technologies

USA . 1,980 parts In-Stock

1+ parts

$38.129

100+ parts

$3,540.891

1k+ parts

$34.316

10k+ parts

-

1,980

$38.129

$3,540.891

$34.316

-

DigiPath Technology Company

USA . 714 parts In-Stock

1+ parts

$41.985

100+ parts

-

1k+ parts

-

10k+ parts

-

714

$41.985

-

-

-

ChromeModa Solutions

Germany . 2,686 parts In-Stock

1+ parts

$42.842

100+ parts

$35.130

1k+ parts

-

10k+ parts

-

2,686

$42.842

$35.130

-

-

IDEA Electronic Components Group

UK . 2,263 parts In-Stock

1+ parts

$42.842

100+ parts

$40.700

1k+ parts

$38.558

10k+ parts

-

2,263

$42.842

$40.700

$38.558

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

iodParts Technologies Inc.

India . 5,630 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,630

-

-

-

-

Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Argo Parts USA

USA . 509 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

509

-

-

-

-

Kepictronics

USA . 142 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

142

-

-

-

-

Overview

Unlock the power of cutting-edge technology with the AM3352BZCE30 by Texas Instruments. As a leader in microprocessor innovation, Texas Instruments delivers top-quality products that meet the highest industry standards. Whether you're designing IoT devices, industrial automation systems, or consumer electronics, this microprocessor offers unparalleled performance and reliability. Experience seamless integration, advanced features, and exceptional value with the AM3352BZCE30. Elevate your projects to new heights with Texas Instruments at the core.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and strength to the package, ensuring the safety of the microprocessor during handling and operation.

Integrated Cache: YES

Integrated cache improves the performance of the microprocessor by allowing it to store frequently accessed data closer to the CPU, reducing latency and improving overall speed.

Maximum Supply Voltage: 1.144 V

The maximum supply voltage of 1.144 V ensures stable and efficient power delivery to the microprocessor, preventing damage from voltage spikes.

On Chip Data RAM Width: 8

An 8-bit width for on-chip data RAM allows for efficient data processing and storage within the microprocessor.

Address Bus Width: 28

A wide 28-bit address bus allows the microprocessor to access a larger memory space, enabling it to handle complex calculations and tasks efficiently.

Package Shape: SQUARE

The square package shape offers a compact and space-saving design, making the microprocessor suitable for applications where space is limited.

Bit Size: 32

A 32-bit architecture provides the microprocessor with the capability to process data in 32-bit chunks, improving performance and enhancing compatibility with 32-bit software.

Power Supplies (V): 0.95/1.1

The availability of multiple power supply options (0.95V and 1.1V) allows for flexibility in design and power management, catering to different application requirements.

No. of Terminals: 298

Having a high number of terminals enables the microprocessor to connect to various external components, facilitating communication and data transfer between devices.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array package style with low profile and fine pitch features enhances thermal performance, reduces signal interference, and allows for precise connections, ensuring smooth operation.

Minimum Supply Voltage: 1.056 V

The minimum supply voltage of 1.056 V ensures that the microprocessor receives sufficient power for reliable operation while preventing overloading and potential damage.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature of 90°C ensures the microprocessor can withstand elevated temperatures and operate efficiently in challenging environments.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C indicates the microprocessor's ability to function in cold conditions, making it suitable for a wide range of temperature environments.

Terminal Finish: TIN SILVER COPPER

The TIN SILVER COPPER terminal finish offers excellent conductivity, corrosion resistance, and solderability, ensuring reliable connections and long-term performance.

Terminal Position: BOTTOM

Having terminals positioned at the bottom of the microprocessor simplifies the assembly process and allows for easy integration into circuit boards, improving overall system efficiency.

Maximum Seated Height: 1.3 mm

The maximum seated height of 1.3 mm provides a low-profile design, allowing the microprocessor to be installed in compact devices or applications with height restrictions.

RAM Words: 131072

With 131,072 RAM words, the microprocessor can efficiently store and access a large amount of data, improving performance in data-intensive tasks and applications.

Width: 13 mm

A width of 13 mm makes the microprocessor compatible with standard board sizes and allows for easy integration into various electronic systems.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging processes, allowing for efficient fault detection and resolution during manufacturing and operation.

External Data Bus Width: 16

A 16-bit external data bus width enables fast data transfer between the microprocessor and external devices, enhancing overall system performance and responsiveness.

Maximum Clock Frequency: 26 MHz

A maximum clock frequency of 26 MHz indicates the microprocessor's ability to handle high-speed operations and process data quickly, making it suitable for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures safe and efficient soldering during the manufacturing process, preventing thermal damage to the microprocessor.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for high-temperature soldering processes, ensuring reliable and durable connections between the microprocessor and circuit boards.

Length: 13 mm

A length of 13 mm complements the compact width of the microprocessor, offering a space-efficient design that is suitable for small form factor applications.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor, it is optimized for efficient instruction execution, enabling high performance and low power consumption in embedded systems and IoT devices.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high-speed operation, making the microprocessor energy-efficient and suitable for battery-powered devices.

Terminal Form: BALL

The ball terminal form simplifies the soldering and connection process, allowing for reliable and secure attachment to circuit boards, enhancing overall system reliability.

Maximum Supply Current: 400 mA

With a maximum supply current of 400 mA, the microprocessor operates within a safe power consumption range, preventing overheating and ensuring stable performance.

Nominal Supply Voltage: 1.1 V

The nominal supply voltage of 1.1 V provides a stable power source for the microprocessor, ensuring consistent and reliable operation in a wide range of applications.

No. of DMA Channels: 64

Having 64 DMA channels allows for efficient data transfer and processing within the microprocessor, enabling high-speed communication with peripherals and minimizing CPU load.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch allows for precise and compact terminal placement, optimizing board space utilization and facilitating smooth PCB design and assembly.

Format: FIXED POINT

Utilizing fixed-point format simplifies mathematical calculations and improves computational efficiency, making the microprocessor suitable for real-time processing and control applications.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the microprocessor can withstand moderate exposure to moisture during manufacturing and operation, ensuring reliability in various environments.

Speed: 300 rpm

Operating at a speed of 300 rpm, the microprocessor delivers fast and responsive performance, making it suitable for applications that require quick data processing and response times.

Low Power Mode: YES

The low power mode feature allows the microprocessor to reduce power consumption during idle or low activity periods, extending battery life and improving energy efficiency in portable devices.

Technical Specifications

Microprocessors AM3352BZCE30 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT MIN 0.912 V

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B298

JESD-609 Code:

e1

Length:

13 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

64

No. of Terminals:

298

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA298,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.95/1.1

Qualification:

Not Qualified

RAM Words:

131072

Maximum Seated Height:

1.3 mm

Speed:

300 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

1.144 V

Minimum Supply Voltage:

1.056 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

AM3352BZCE30 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 19