Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
The Intel FH8065301487717SR1X6 microprocessor features a 64-bit architecture, 16-bit address bus width, and 1910 rpm speed. It is ideal for applications requiring high processing power in a compact form factor, such as embedded systems and industrial automation.
Median Price
-
Lifecycle Status
Suppliers In-Stock
5
In-Stock Inventory
1k+
Vyrian
1+ parts
100+ parts
1k+ parts
10k+ parts
Digiode
Nova Conductors
ACDS - Activité Composants Distribution Service
Sunrise Surplus Inc.
Ampacity Inc.
$33.000
MARBEL Systems
$60.947
$58.509
Texas Native Microelectronics
$70.054
$67.252
$65.150
Kenton Components
$84.065
$73.977
Qasali Group International
$181.580
$166.448
Argo Parts USA
Authorized Procurement Solutions
Perfect Parts
Continental Prestige Electronics
Corphita
Aranea Global
Having an integrated cache helps improve the overall performance of the microprocessor by reducing the access time to frequently used data and instructions.
Surface mount technology allows for smaller and lighter devices, making it ideal for applications where size and weight are important factors.
With a wider address bus width, the microprocessor can access a larger range of memory addresses, enabling it to handle more complex tasks and store more data.
The rectangular shape of the package allows for easier integration into circuit boards and provides a more compact design for space-constrained applications.
A 64-bit microprocessor can process larger chunks of data at once, leading to faster and more efficient data processing capabilities.
Having a higher number of terminals provides more connectivity options and allows for greater flexibility in designing complex electronic systems.
The grid array package style offers better thermal performance and signal integrity, improving the overall reliability and longevity of the microprocessor.
Bottom terminal position simplifies the process of soldering the microprocessor onto circuit boards, contributing to easier assembly and maintenance.
Boundary scan capability facilitates testing and debugging of the microprocessor during production, ensuring higher quality and reliability of the final product.
A wider external data bus width allows for faster communication with external devices and peripherals, resulting in improved overall system performance.
Being a microprocessor, this product is specifically designed for handling complex computational tasks, making it suitable for applications requiring high processing power.
CMOS technology offers low power consumption and high noise immunity, making this microprocessor energy efficient and reliable in noisy environments.
A ball terminal form provides better mechanical integrity and electrical performance, ensuring robust connections and improved signal transmission.
Fixed-point format simplifies arithmetic operations and enhances numerical accuracy, making this microprocessor suitable for applications that do not require floating-point calculations.
The high speed of 1910 RPM enables faster data processing and computation, making this microprocessor suitable for demanding applications that require quick response times.
The low power mode option allows for reducing power consumption during idle or low-demand periods, increasing energy efficiency and extending battery life in portable devices.
Microprocessors FH8065301487717SR1X6 attributes and parameters. Explore more Microprocessors devices from Intel
Address Bus Width:
Bit Size:
Boundary Scan:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
Low Power Mode:
No. of Terminals:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Speed:
Surface Mount:
Technology:
Terminal Form:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Peripheral IC Type:
FH8065301487717SR1X6 Peripheral ICs trade compliance attributes, and parameters.
HTS
8542.31.00.01
SB
8542.31.00.00
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
2N2222A
Motorola
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Collector-Base Capacitance: 8 pF;
2N7002
Samsung
N-CHANNEL AND P-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain-Source On Resistance: 5 ohm; No. of Terminals: 3;
C0805C104K5RACTU
KEMET Corporation
KEMET C0805C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring compact size and reliable performance.
Rectron
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Package Shape: ROUND;
FDV304P
Onsemi
The Onsemi FDV304P is a P-CHANNEL FET with 25V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max Drain Current of 0.46A and an Operating Temperature range of -55 to 150 °C. The transistor comes in a PLASTIC/EPOXY package with GULL WING terminals, suitable for surface mount configurations.
LL4148
Semtech Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BSS138
Micro Commercial Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Terminal Position: DUAL;
OPA2227UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
BAV99
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
M85049/85-08W02
TE Connectivity
CONNECTOR ACCESSORY; Minimum Operating Temperature: -65 Cel; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 175 Cel; Material: ALUMINUM ALLOY;
ABS10-32.768KHZ-T
Abracon
Abracon's ABS10-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 122% stability, and 70000 ohm series resistance. Ideal for applications requiring precise timing at 0.032768 MHz, such as IoT devices and wearables due to its compact size and low power consumption.
Promax-johnton
M39029/56351
Esterline Technologies
CONNECTOR ACCESSORY; IEC Conformity: NO; Contact Gender: FEMALE; DIN Conformity: NO; MIL-Connector Accessory Name: CONTACT; Tool Settings: M22520/2-10;
1N4148
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
National Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Style (Meter): SMALL OUTLINE; Terminal Position: DUAL;
Philips Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SMBJ18CA
Transpro Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; JESD-609 Code: e0; Terminal Finish: Tin/Lead (Sn/Pb); Nominal Breakdown Voltage: 21.1 V; Maximum Clamping Voltage: 29.2 V;
SS14
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
NDT2955
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3 W; JESD-609 Code: e0; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
M39029/58-360
Positronic Industries
CONNECTOR ACCESSORY; MIL-Connector Accessory Name: CONTACT; DIN Conformity: NO; National Stock Number (NSN): 5999004733551; Mating Contacts: M39029/56-348, M39029/57-354; Contact Type: CRIMP REAR RELEASE;
ATSAMA5D27C-D1G-CU
Microchip Technology
ATSAMA5D27C-D1G-CU by Microchip Technology is a 16-bit microprocessor with integrated cache, operating at up to 24 MHz. Ideal for industrial applications, it features 65536 RAM words and 51 DMA channels, with low power mode and boundary scan support.
N80C186XL20
Intel
MICROPROCESSOR; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 68; Package Code: QCCJ; Package Shape: SQUARE;
MPC860DEZQ50D4
NXP Semiconductors
The NXP Semiconductors MPC860DEZQ50D4 is a 32-bit microprocessor with integrated cache and 3.3V power supply. It features a max clock frequency of 50 MHz, suitable for low power mode applications in various industries like telecommunications and networking. With a package style of grid array and terminal pitch of 1.27mm, it offers high performance in a compact design.
MCIMX537CVV8CR2
MCIMX537CVV8CR2 by NXP Semiconductors is a 32-bit microprocessor with integrated cache and 16-bit address bus width. Ideal for automotive applications, it operates at speeds up to 27 MHz with low power mode support. The package style is grid array, featuring a max supply voltage of 1.15 V and operating temperature range from -40 to 125 °C.
AM3352BZCZ60
Texas Instruments
AM3352BZCZ60 by Texas Instruments is a 32-bit microprocessor with integrated cache, 131072 RAM words, and 16-bit external data bus width. It operates at a max clock frequency of 26 MHz and is suitable for applications requiring low power mode and boundary scan capabilities.
MC9S08PT8VLC
MC9S08PT8VLC by NXP Semiconductors is an 8-bit microprocessor with 32 terminals, 2048 bytes of RAM, and 8192 ROM words. It operates at a speed of 20 rpm and has a power supply range of 3/5 V. Ideal for industrial applications requiring a robust CPU like HCS08 family.
MPC8313CVRADDC
The NXP Semiconductors MPC8313CVRADDC is a 32-bit microprocessor with integrated cache, operating at a max frequency of 66.67 MHz. It features a 32-bit external data bus width and supports low power mode, making it ideal for industrial applications requiring high-speed processing in compact form factors.
MC7448THX1400ND
The NXP Semiconductors MC7448THX1400ND microprocessor features a 32-bit architecture, 64-bit external data bus width, and operates at a max clock frequency of 200 MHz. Ideal for industrial applications requiring high-speed processing with low power consumption.
MCF54453CVP200
MICROPROCESSOR; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;
LUPXA255A0C200
Intel LUPXA255A0C200 microprocessor features 32-bit architecture, 26-bit address bus, and operates at a max clock frequency of 3.6864 MHz. Ideal for low power applications with integrated cache and boundary scan capabilities.
MPC8313EVRAFFC
Freescale Semiconductor
MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 516; Package Code: HBGA; Package Shape: SQUARE;
AM5706BCBDJAS
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN SILVER COPPER;
STM32MP151AAB3T
STMicroelectronics
STM32MP151AAB3T by STMicroelectronics is a 32-bit microprocessor with integrated cache and 48 MHz clock frequency. It features 724992 RAM words, 26-bit address bus width, and low power mode for energy efficiency. Ideal for applications requiring high-speed processing in compact devices.
FH8065301567313SR3UZ
Intel's FH8065301567313SR3UZ microprocessor features 64-bit size, 1170 terminals, and operates at speeds up to 1330 rpm. Suitable for industrial applications with a temperature range of -40 to 110 °C, this processor is designed for high-performance computing tasks requiring integrated cache and CMOS technology.
MIMXRT1051DVL6A
NXP Semiconductors' MIMXRT1051DVL6A microprocessor features 32-bit architecture, 24 MHz clock frequency, and 524288 RAM words. Ideal for low power applications, it offers integrated cache, 29 serial I/Os, and supports boundary scan technology.
AT97SC3205T-H3M4C10B
Microchip Technology's AT97SC3205T-H3M4C10B is an 8-bit RISC microprocessor with 32 terminals in a square chip carrier package. Operating at -40 to 85°C, it has a nominal voltage of 3.3V and CMOS technology. Ideal for industrial applications requiring a compact, surface-mount solution with very thin profile and no-lead terminal form.
MCF5307AI90B
MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
MPC8270VVUPEA
The NXP Semiconductors MPC8270VVUPEA microprocessor features a 32-bit address bus width, 64-bit external data bus width, and max clock frequency of 100 MHz. Ideal for commercial applications requiring high-speed processing capabilities in a compact package with boundary scan support.
T1023NXE7PQA
The NXP Semiconductors T1023NXE7PQA microprocessor features a 64-bit architecture, 32-bit external data bus width, and integrated cache. Ideal for industrial applications requiring high-speed processing with low power consumption. Package style is grid array with fine pitch terminals for compact design.
MIMXRT106LCVL5B
MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
FH8065301487918SR1X7
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 1170; Package Code: BGA; Package Shape: RECTANGULAR; Integrated Cache: YES;
FH8065801974816SR267
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 1168; Package Code: BGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B1168;
FH8065301487717SR3UT
MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1170; Package Shape: RECTANGULAR; Bit Size: 64;
FH8066802980002SR2YB
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 1296; Package Code: BGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B1296;
FH8066802980002SR2Z7
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 1296; Package Code: BGA; Package Shape: RECTANGULAR; Format: FIXED POINT;
FH8065301567313
Intel FH8065301567313 is a 64-bit microprocessor with integrated cache. It has a package shape of rectangular and surface mount capability. This industrial-grade processor operates at temperatures ranging from -40 to 110 °C, making it suitable for various applications.
FH8065301567313SR1X9
MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1170; Package Code: BGA; Package Shape: RECTANGULAR;
FH8069004541900SRK0Y
Microprocessors;
FH8065301487715SR1RE
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 1170; Package Code: BGA; Package Shape: RECTANGULAR; Bit Size: 64;
FH8066802979803SR2Z6
MICROPROCESSOR;
FH8065301487717
FH8065503553601SR3H1
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 1283; Package Code: BGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY;
FH8065503553701SR3H2
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 1283; Package Shape: RECTANGULAR; Speed: 1700 rpm; Boundary Scan: NO;
FH8066501715923SR2A7
FH8066501715928SR2KP
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 1170; Package Code: BGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B1170;
FH8069004638047SRKWY
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 1787; Package Shape: RECTANGULAR; Format: FIXED POINT; Technology: CMOS;
FH8065301487715
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 1170; Package Code: BGA; Package Shape: RECTANGULAR; Format: FIXED POINT;
FH8065301487916
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 1170; Package Code: BGA; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED;
FH8065301487918
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 1170; Package Code: BGA; Package Shape: RECTANGULAR; Address Bus Width: 16;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
© 2023 All rights reserved