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AM3894CCYG120

Texas Instruments

AM3894CCYG120 by Texas Instruments

The Texas Instruments AM3894CCYG120 microprocessor features 32-bit architecture, 8-word data RAM width, and a clock frequency of up to 27 MHz. Ideal for applications requiring high-speed processing such as embedded systems, industrial automation, and networking equipment.

Median Price

$98.300

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,384 parts In-Stock

1+ parts

$72.086

100+ parts

$64.076

1k+ parts

$47.115

10k+ parts

-

1,384

$72.086

$64.076

$47.115

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Chip1Stop

Japan . 44 parts In-Stock

1+ parts

$98.300

100+ parts

$74.300

1k+ parts

$67.000

10k+ parts

-

44

$98.300

$74.300

$67.000

-

DigiKey

USA . 42 parts In-Stock

1+ parts

$100.340

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-

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-

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42

$100.340

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,303 parts In-Stock

1+ parts

$54.150

100+ parts

-

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3,303

$54.150

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$62.286

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-

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50

$62.286

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VNN

France . 2,186 parts In-Stock

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2,186

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Vyrian

USA . 491 parts In-Stock

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491

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TME

Poland . 44 parts In-Stock

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-

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$88.362

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44

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$88.362

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ACDS - Activité Composants Distribution Service

France . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,137 parts In-Stock

1+ parts

$14.983

100+ parts

-

1k+ parts

$15.410

10k+ parts

-

2,137

$14.983

-

$15.410

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DigiPath Technology Company

USA . 90 parts In-Stock

1+ parts

$16.498

100+ parts

-

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90

$16.498

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ChromeModa Solutions

Germany . 6,349 parts In-Stock

1+ parts

$16.835

100+ parts

$13.805

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-

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6,349

$16.835

$13.805

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IDEA Electronic Components Group

UK . 2,263 parts In-Stock

1+ parts

$16.835

100+ parts

$15.993

1k+ parts

$15.152

10k+ parts

-

2,263

$16.835

$15.993

$15.152

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Advanced Electronics

New Zealand . 15 parts In-Stock

1+ parts

$47.507

100+ parts

$45.131

1k+ parts

$45.131

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15

$47.507

$45.131

$45.131

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Ampacity Inc.

Singapore . 426 parts In-Stock

1+ parts

$48.200

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426

$48.200

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Corphita

USA . 150 parts In-Stock

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$51.300

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150

$51.300

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Corohmni

South Africa . 419 parts In-Stock

1+ parts

$51.368

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419

$51.368

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Continental Prestige Electronics

USA . 3,014 parts In-Stock

1+ parts

$59.059

100+ parts

-

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$57.877

3,014

$59.059

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-

$57.877

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$62.286

100+ parts

-

1k+ parts

$59.172

10k+ parts

$57.926

1,000

$62.286

-

$59.172

$57.926

Semicontronic

India . 312 parts In-Stock

1+ parts

$101.200

100+ parts

$98.670

1k+ parts

$98.164

10k+ parts

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312

$101.200

$98.670

$98.164

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Microchip USA

USA . 2,018 parts In-Stock

1+ parts

$127.430

100+ parts

$125.220

1k+ parts

$124.110

10k+ parts

$123.000

2,018

$127.430

$125.220

$124.110

$123.000

QUARKTWIN TECHNOLOGY LTD

USA . 23,250 parts In-Stock

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Argo Parts USA

USA . 2,556 parts In-Stock

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2,556

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Perfect Parts

USA . 112 parts In-Stock

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112

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Cyclops Electronics Ltd (Excess)

UK . 1 parts In-Stock

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1

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Overview

Experience the next level of performance with the AM3894CCYG120 by Texas Instruments. This top-of-the-line microprocessor offers unparalleled quality and reliability, making it the ideal choice for a wide range of applications. From advanced computing to industrial automation, this innovative product delivers exceptional value, benefits, and advantages to customers. Trust Texas Instruments to provide cutting-edge technology that exceeds expectations and unlocks endless possibilities. Elevate your projects with the AM3894CCYG120 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microprocessor, making it suitable for a wide range of applications.

Integrated Cache: YES

Having integrated cache helps improve processing speed and efficiency, enhancing overall performance of the microprocessor.

Maximum Supply Voltage: 1.05 V

The maximum supply voltage of 1.05 V ensures stable and reliable operation of the microprocessor within safe voltage limits.

On Chip Data RAM Width: 8

A wider data RAM width of 8 allows for faster data processing and handling by the microprocessor.

Address Bus Width: 28

A wider address bus width of 28 enables the microprocessor to access and communicate with a larger memory space efficiently.

Package Shape: SQUARE

The square package shape offers easy mounting and handling, making it convenient for integration into various systems.

Bit Size: 32

With a bit size of 32, this microprocessor is capable of processing 32 bits of data at a time, improving computational speed and capacity.

No. of Terminals: 1031

The high number of terminals allows for versatile connectivity options, enabling the microprocessor to interface with multiple components.

Package Style (Meter): GRID ARRAY, FINE PITCH

The fine pitch grid array package style provides a compact and efficient design for the microprocessor, maximizing space utilization.

Minimum Supply Voltage: 0.95 V

The lower minimum supply voltage of 0.95 V helps reduce power consumption and heat generation, contributing to energy efficiency.

Maximum Operating Temperature: 95 °C

With a high maximum operating temperature of 95°C, this microprocessor can withstand demanding environmental conditions and maintain performance.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures reliable functionality of the microprocessor even in cold environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides good conductivity and corrosion resistance, enhancing the durability and lifespan of the microprocessor.

Terminal Position: BOTTOM

The bottom terminal position allows for easy and secure soldering during assembly, ensuring stable connections for optimal performance.

Maximum Seated Height: 3.31 mm

The low maximum seated height enables compact integration of the microprocessor in space-constrained applications.

RAM Words: 65536

With a high RAM capacity of 65536 words, the microprocessor can efficiently store and process large amounts of data for complex computations.

Width: 25 mm

The compact width of 25 mm allows for easy installation and integration of the microprocessor in various system configurations.

Boundary Scan: YES

Boundary scan capability facilitates testing and debugging of the microprocessor, improving reliability and ease of maintenance.

External Data Bus Width: 16

The external data bus width of 16 enhances data transfer speed and efficiency, optimizing performance in data-intensive applications.

Maximum Clock Frequency: 27 MHz

The high maximum clock frequency of 27 MHz enables fast data processing and execution, enhancing overall performance of the microprocessor.

Maximum Time At Peak Reflow Temperature (s): 30

The microprocessor can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable soldering during assembly processes.

Peak Reflow Temperature °C: 245

The high peak reflow temperature of 245°C allows for efficient soldering of the microprocessor, ensuring secure connections and reliable performance.

Length: 25 mm

The compact length of 25 mm provides flexibility for system design and integration, allowing for versatile placement of the microprocessor.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC-based microprocessor, it offers simplified instruction set architecture and efficient processing for faster and optimized performance.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable for long-term use.

Terminal Form: BALL

The ball terminal form ensures secure and reliable connections, preventing solder joint failures and maintaining consistent performance.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1 V ensures stable and efficient operation of the microprocessor within specified voltage levels.

No. of DMA Channels: 72

The high number of DMA channels allows for efficient data transfer and processing, enhancing overall system performance and throughput.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm enables high-density packaging and precise connection of the microprocessor, optimizing space utilization.

Format: FLOATING POINT

The floating-point format provides enhanced precision for numerical calculations and data processing, improving accuracy and performance.

Moisture Sensitivity Level (MSL): 4

With MSL 4 rating, the microprocessor can withstand moderate exposure to moisture during handling and assembly processes.

Speed: 1200 rpm

The high speed of 1200 rpm enables fast data processing and execution, enhancing overall performance and efficiency of the microprocessor.

Low Power Mode: YES

The low power mode enhances energy efficiency and reduces power consumption when the microprocessor is not operating at full capacity, prolonging battery life.

Technical Specifications

Microprocessors AM3894CCYG120 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

27 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B1031

JESD-609 Code:

e1

Length:

25 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

72

No. of Terminals:

On Chip Data RAM Width:

8

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA1031,37X37,25

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1

Qualification:

Not Qualified

RAM Words:

65536

Maximum Seated Height:

3.31 mm

Speed:

1200 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

25 mm

Peripheral IC Type:

Trade Compliance

AM3894CCYG120 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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