Loading...

AM3872BCYEA100

Texas Instruments

AM3872BCYEA100 by Texas Instruments

The Texas Instruments AM3872BCYEA100 is a 32-bit microprocessor with integrated cache and 30 MHz clock frequency. It features a CMOS technology, 684 terminals in a grid array package style, and supports boundary scan. Ideal for applications requiring high-speed processing and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,417 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,417

-

-

-

-

Digiode

USA . 1,954 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,954

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 703 parts In-Stock

1+ parts

$5.126

100+ parts

-

1k+ parts

-

10k+ parts

-

703

$5.126

-

-

-

One Stop Electronics

USA . 1,455 parts In-Stock

1+ parts

$24.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,455

$24.000

-

-

-

Parana Technologies

USA . 2,378 parts In-Stock

1+ parts

$40.742

100+ parts

-

1k+ parts

-

10k+ parts

-

2,378

$40.742

-

-

-

DigiPath Technology Company

USA . 524 parts In-Stock

1+ parts

$44.861

100+ parts

$41.273

1k+ parts

-

10k+ parts

-

524

$44.861

$41.273

-

-

ChromeModa Solutions

Germany . 4,691 parts In-Stock

1+ parts

$45.777

100+ parts

$37.537

1k+ parts

-

10k+ parts

-

4,691

$45.777

$37.537

-

-

IDEA Electronic Components Group

UK . 665 parts In-Stock

1+ parts

$45.777

100+ parts

$43.488

1k+ parts

$41.199

10k+ parts

-

665

$45.777

$43.488

$41.199

-

Native Components

USA . 767 parts In-Stock

1+ parts

$48.242

100+ parts

-

1k+ parts

-

10k+ parts

$46.312

767

$48.242

-

-

$46.312

Northwest PG Solutions

USA . 391 parts In-Stock

1+ parts

$53.066

100+ parts

-

1k+ parts

-

10k+ parts

-

391

$53.066

-

-

-

Corphita

USA . 235 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

235

-

-

-

-

Overview

Unleash the power of innovation with the AM3872BCYEA100 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality microprocessors like this one, designed for high-performance applications. Whether you're looking to enhance your computing capabilities or streamline your operations, this product offers unmatched value and benefits. With integrated cache and advanced technology, the AM3872BCYEA100 is the perfect solution for cutting-edge projects that demand reliability and efficiency. Elevate your work with Texas Instruments and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microprocessor easy to handle and resistant to damage.

Integrated Cache: YES

Having an integrated cache improves the overall performance of the microprocessor by reducing memory access times and increasing data processing speed.

Surface Mount: YES

Being surface mountable ensures easy and secure placement on circuit boards, making it suitable for compact electronic devices.

Address Bus Width: 15

A wider address bus allows the microprocessor to access a larger amount of memory, enhancing its capability to handle complex tasks.

Package Shape: SQUARE

The square shape offers efficient use of space on a circuit board, enabling a higher component density and better airflow for cooling.

Bit Size: 32

A 32-bit architecture allows the microprocessor to process data in larger chunks, improving overall performance and efficiency.

No. of Terminals: 684

Having a high number of terminals provides the microprocessor with a wide range of connectivity options, making it versatile for various applications.

Terminal Position: BOTTOM

Bottom terminal position simplifies the soldering process and promotes better heat dissipation, ensuring reliable performance under heavy workloads.

Maximum Seated Height: 3.06 mm

The low seated height allows the microprocessor to be used in slim and compact devices without compromising performance or cooling.

Width: 23 mm

The compact width of the microprocessor makes it suitable for small form factor devices, saving valuable space on the circuit board.

Boundary Scan: YES

Having boundary scan capability simplifies the testing and debugging process during production, ensuring higher quality and reliability.

External Data Bus Width: 32

A 32-bit external data bus enables faster data transfer rates between the microprocessor and other components, enhancing overall system performance.

Maximum Clock Frequency: 30 MHz

The high maximum clock frequency allows the microprocessor to execute instructions quickly and efficiently, meeting the demands of high-speed applications.

Length: 23 mm

The compact length of the microprocessor ensures it can fit into tight spaces without compromising functionality, making it ideal for space-constrained designs.

Peripheral IC Type: MICROPROCESSOR

Being a microprocessor makes this product suitable for a wide range of computing applications, from embedded systems to high-performance computing.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making the microprocessor energy-efficient and suitable for battery-powered devices.

Terminal Form: BALL

Ball terminals provide reliable electrical connections and facilitate easier mounting on the circuit board, ensuring stable performance in various environments.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for a high density of terminals on the microprocessor, enabling more functionality in a compact package.

Format: FLOATING POINT

Support for floating-point operations enhances the microprocessor's ability to handle complex mathematical computations with high accuracy and efficiency.

Speed: 1000 rpm

The high speed of 1000 rpm indicates fast data processing and execution, making the microprocessor suitable for time-critical applications.

Low Power Mode: YES

The low power mode feature allows the microprocessor to conserve energy during idle or low-demand periods, extending battery life and reducing overall power consumption.

Technical Specifications

Microprocessors AM3872BCYEA100 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

15

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B684

Length:

23 mm

Low Power Mode:

YES

No. of Terminals:

684

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

3.06 mm

Speed:

1000 rpm

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

23 mm

Peripheral IC Type:

Trade Compliance

AM3872BCYEA100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 19