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AM3872BCYEA80

Texas Instruments

AM3872BCYEA80 by Texas Instruments

The Texas Instruments AM3872BCYEA80 is a 32-bit microprocessor with integrated cache and 16-bit address bus. It operates at a max clock frequency of 30 MHz, suitable for low power mode applications. The package style is grid array, fine pitch with 684 terminals in a square shape, making it ideal for compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,339 parts In-Stock

1+ parts

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8,339

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Digiode

USA . 3,079 parts In-Stock

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3,079

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Distributors (Availability)

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AZTECH Wire

Italy . 498 parts In-Stock

1+ parts

$9.490

100+ parts

-

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498

$9.490

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One Stop Electronics

USA . 1,266 parts In-Stock

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$20.000

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-

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1,266

$20.000

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Parana Technologies

USA . 1,361 parts In-Stock

1+ parts

$38.381

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1,361

$38.381

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DigiPath Technology Company

USA . 347 parts In-Stock

1+ parts

$42.262

100+ parts

$38.882

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347

$42.262

$38.882

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ChromeModa Solutions

Germany . 5,150 parts In-Stock

1+ parts

$43.125

100+ parts

$35.362

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5,150

$43.125

$35.362

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IDEA Electronic Components Group

UK . 1,662 parts In-Stock

1+ parts

$43.125

100+ parts

$40.969

1k+ parts

$38.812

10k+ parts

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1,662

$43.125

$40.969

$38.812

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Native Components

USA . 89 parts In-Stock

1+ parts

$52.243

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$50.153

89

$52.243

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$50.153

Northwest PG Solutions

USA . 1,457 parts In-Stock

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$57.467

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1,457

$57.467

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Corphita

USA . 1,235 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the AM3872BCYEA80 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality microprocessors that are perfect for a wide range of applications. With integrated cache and low power mode, this product offers unparalleled performance and efficiency. Say goodbye to slow processing speeds and hello to lightning-fast operation with the AM3872BCYEA80. Upgrade your devices today and experience the difference that Texas Instruments can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and less prone to damage during handling or shipping.

Integrated Cache: YES

Having integrated cache improves the performance of the microprocessor by allowing for faster access to frequently used data and instructions.

Maximum Supply Voltage: 1.42 V

The high maximum supply voltage allows for flexibility in power supply options, accommodating a range of voltage levels for optimal performance.

Address Bus Width: 16

A wider address bus allows for faster data transfer and processing, enhancing the overall speed and efficiency of the microprocessor.

Terminal Position: BOTTOM

Having terminals positioned at the bottom of the package makes it easier for soldering and connection to other components in the circuit, ensuring a secure and stable connection.

Maximum Clock Frequency: 30 MHz

A high maximum clock frequency means the microprocessor can handle more operations per second, resulting in faster overall performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable in various operating conditions.

Speed: 800 rpm

With a speed of 800 rpm, this microprocessor is capable of handling demanding tasks and processing data quickly, making it suitable for high-performance applications.

Technical Specifications

Microprocessors AM3872BCYEA80 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B684

Length:

23 mm

Low Power Mode:

YES

No. of Terminals:

684

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA684,28X28,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

0.95/1.35

Qualification:

Not Qualified

Maximum Seated Height:

3.06 mm

Speed:

800 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.42 V

Minimum Supply Voltage:

1.28 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

AM3872BCYEA80 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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