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AM3871CCYE100

Texas Instruments

AM3871CCYE100 by Texas Instruments

The Texas Instruments AM3871CCYE100 is a 32-bit microprocessor with integrated cache and 8-bit on-chip data RAM. It features a 28-bit address bus width, operates at up to 30 MHz, and has 64 DMA channels. This processor is ideal for applications requiring high-speed processing and low power consumption in a compact form factor.

Median Price

$51.450

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 19 parts In-Stock

1+ parts

$41.970

100+ parts

$41.130

1k+ parts

$40.290

10k+ parts

-

19

$41.970

$41.130

$40.290

-

Texas Instruments

USA . 2,751 parts In-Stock

1+ parts

$55.025

100+ parts

$48.911

1k+ parts

$35.964

10k+ parts

-

2,751

$55.025

$48.911

$35.964

-

Chip1Stop

Japan . 660 parts In-Stock

1+ parts

-

100+ parts

$51.450

1k+ parts

$50.490

10k+ parts

-

660

-

$51.450

$50.490

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,022 parts In-Stock

1+ parts

$52.274

100+ parts

-

1k+ parts

-

10k+ parts

-

3,022

$52.274

-

-

-

Vyrian

USA . 2,922 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,922

-

-

-

-

Chip Stock

USA . 275 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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275

-

-

-

-

Sensible Micro Corp

USA . 257 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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257

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 371 parts In-Stock

1+ parts

$9.760

100+ parts

-

1k+ parts

-

10k+ parts

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371

$9.760

-

-

-

Parana Technologies

USA . 567 parts In-Stock

1+ parts

$14.871

100+ parts

-

1k+ parts

$15.304

10k+ parts

-

567

$14.871

-

$15.304

-

ChromeModa Solutions

Germany . 5,830 parts In-Stock

1+ parts

$16.709

100+ parts

$13.701

1k+ parts

-

10k+ parts

-

5,830

$16.709

$13.701

-

-

IDEA Electronic Components Group

UK . 1,119 parts In-Stock

1+ parts

$16.709

100+ parts

$15.874

1k+ parts

$15.038

10k+ parts

-

1,119

$16.709

$15.874

$15.038

-

Native Components

USA . 265 parts In-Stock

1+ parts

$35.715

100+ parts

-

1k+ parts

-

10k+ parts

$34.286

265

$35.715

-

-

$34.286

Northwest PG Solutions

USA . 1,894 parts In-Stock

1+ parts

$39.287

100+ parts

-

1k+ parts

-

10k+ parts

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1,894

$39.287

-

-

-

Corphita

USA . 2,142 parts In-Stock

1+ parts

$49.522

100+ parts

-

1k+ parts

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10k+ parts

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2,142

$49.522

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 14,360 parts In-Stock

1+ parts

-

100+ parts

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14,360

-

-

-

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Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,000

-

-

-

-

DigiPath Technology Company

USA . 1,214 parts In-Stock

1+ parts

-

100+ parts

$15.065

1k+ parts

-

10k+ parts

-

1,214

-

$15.065

-

-

GreenTree Electronics

Israel . 1,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,200

-

-

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,000

-

-

-

-

Kepictronics

USA . 462 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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462

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Overview

Experience unparalleled performance and reliability with the AM3871CCYE100 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microprocessors designed for a wide range of applications. The AM3871CCYE100 offers integrated cache, advanced technology, and low power mode, providing customers with exceptional value and benefits. Trust Texas Instruments to provide you with cutting-edge solutions that meet your needs and exceed your expectations. Choose the AM3871CCYE100 for unmatched quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microprocessor suitable for portable devices.

Integrated Cache: YES

Having integrated cache helps in faster access to frequently used data, improving overall processing speed.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of PCB space.

Address Bus Width: 28

With a wider address bus, the microprocessor can access a larger memory space, enhancing overall performance.

Bit Size: 32

The 32-bit architecture allows for processing of larger chunks of data at a time, improving efficiency.

Maximum Clock Frequency: 30 MHz

A high clock frequency enables faster processing and better performance in demanding applications.

Peripheral IC Type: MICROPROCESSOR, RISC

A RISC architecture simplifies instructions and leads to efficient processing, making it suitable for high-performance computing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microprocessor energy efficient.

Technical Specifications

Microprocessors AM3871CCYE100 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B684

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of Terminals:

684

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA684,28X28,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Power Supplies (V):

0.95/1.35

Qualification:

Not Qualified

RAM Words:

786432

Maximum Seated Height:

3.06 mm

Speed:

1000 rpm

Sub-Category:

Microprocessors

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

AM3871CCYE100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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