Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Texas Instruments AM3874CCYEA100 is a 32-bit microprocessor with integrated cache and 16-bit external data bus. It operates at a max clock frequency of 30 MHz, suitable for industrial applications requiring low power mode and floating-point format calculations. The package style is grid array, fine pitch, making it ideal for compact designs with high terminal count.
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This material provides durability and protection for the microprocessor, making it suitable for various environments.
Having integrated cache helps in improving the overall performance of the microprocessor by providing faster access to frequently used data.
Surface mount capability allows for easy installation of the microprocessor on a circuit board, saving space and making it ideal for compact devices.
A wider address bus width allows for efficient memory addressing, enabling the microprocessor to handle larger amounts of data and instructions.
The square shape of the package provides ease of handling and installation, making it convenient for assembly processes.
A 32-bit architecture allows the microprocessor to process data and perform calculations with higher precision and speed.
The dual power supply options offer flexibility in operating the microprocessor at different voltage levels, catering to various power requirements.
A higher number of terminals enable efficient connectivity and communication within the microprocessor and with external devices, enhancing overall performance.
The grid array and fine pitch package style provides a compact and reliable design for the microprocessor, suitable for high-density circuit boards.
The high maximum operating temperature tolerance ensures stability and reliability of the microprocessor even in demanding thermal conditions.
The low minimum operating temperature allows the microprocessor to function optimally in cold environments, expanding its usability across a wide range of temperatures.
The terminal finish of tin, silver, and copper provides good conductivity and corrosion resistance, ensuring reliable connections for efficient performance.
Having terminals positioned at the bottom facilitates easier installation and connection of the microprocessor on circuit boards, streamlining the assembly process.
The low maximum seated height of the microprocessor allows for space-saving integration in compact devices with height constraints.
The compact width of the microprocessor makes it suitable for applications where space is limited, without compromising on performance.
The presence of boundary scan capability facilitates efficient testing and debugging of the microprocessor during production and maintenance stages.
An external data bus width of 16 bits enables fast data transfer and communication between the microprocessor and external devices, enhancing overall system performance.
The high maximum clock frequency allows the microprocessor to operate at fast speeds, supporting quick execution of instructions and time-sensitive tasks.
The ability to withstand peak reflow temperature for 30 seconds ensures reliable soldering and assembly of the microprocessor on circuit boards.
With a peak reflow temperature of 250°C, the microprocessor can undergo soldering processes without damage, ensuring secure connections for functionality.
The compact length of the microprocessor contributes to its space-saving design, making it suitable for integration in small form factor devices.
Industrial temperature grade ensures reliable operation of the microprocessor in harsh industrial environments with varying temperature conditions.
Being a RISC-based microprocessor enhances efficiency and performance by optimizing instruction execution and data processing, making it suitable for a wide range of applications.
CMOS technology offers low power consumption and high-speed operation, making the microprocessor energy-efficient and suitable for battery-powered devices.
The ball terminal form provides reliable connections for seamless integration of the microprocessor on circuit boards, ensuring stable performance.
The nominal supply voltage of 1.35V offers efficient power consumption, optimizing the performance and energy efficiency of the microprocessor.
A terminal pitch of 0.8mm allows for precise and secure connections, enhancing the reliability and stability of the microprocessor in operation.
The floating-point format enables the microprocessor to perform complex mathematical calculations with high precision and accuracy, making it ideal for computational tasks.
MSL level 4 indicates that the microprocessor can withstand exposure to moisture during storage and handling, ensuring long-term reliability and performance.
With a speed rating of 1000 RPM, the microprocessor can efficiently process instructions and data at a high speed, supporting fast and responsive performance.
The low power mode feature allows the microprocessor to operate in a power-efficient state, extending battery life and reducing energy consumption in portable devices.
Microprocessors AM3874CCYEA100 attributes and parameters. Explore more Microprocessors devices from Texas Instruments
Address Bus Width:
Bit Size:
Boundary Scan:
Maximum Clock Frequency:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
JESD-609 Code:
Length:
Low Power Mode:
Moisture Sensitivity Level (MSL):
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
Maximum Seated Height:
Speed:
Sub-Category:
Nominal Supply Voltage:
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
AM3874CCYEA100 Peripheral ICs trade compliance attributes, and parameters.
ECCN
5A002.A.1.A
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
1N4148
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Good-ark Electronics
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Forward Voltage (VF): 1 V; No. of Phases: 1;
FDLL4148
National Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
L7805CV
STMicroelectronics
L7805CV by STMicroelectronics is a fixed positive single output standard regulator with an output voltage of 5V and max current of 1.5A. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring stable voltage regulation in electronic circuits.
Temic Semiconductors
Sinyork
RECTIFIER DIODE; Surface Mount: NO; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Output Current: .15 A; Maximum Repetitive Peak Reverse Voltage: 100 V; No. of Phases: 1;
MBR0520LT1G
Onsemi
MBR0520LT1G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, has a peak reflow temperature of 260°C, and a repetitive peak reverse voltage of 20V. This diode is ideal for applications requiring high-speed switching in compact electronic devices.
SMBJ18CA
Brightking
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ISO1050DUBR
Texas Instruments
ISO1050DUBR by Texas Instruments is a network interface IC with 8 terminals, operating from -55 to 105°C. It features a small outline package, nickel palladium gold finish, and gull wing terminal form. Ideal for telecom applications requiring a 5V supply voltage and peak reflow temperature of 260°C.
Rfe International
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Forward Voltage (VF): 1 V; Config: SINGLE;
LM358MX
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
LM358DT
ROHM
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR;
LL4148
TDK
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); No. of Phases: 1; No. of Elements: 1; Maximum Output Current: .2 A;
BSS138NH6327XTSA2
Infineon Technologies
BSS138NH6327XTSA2 by Infineon is a N-CHANNEL FET with 60V DS Breakdown Voltage, ideal for small signal applications. Operating in Enhancement Mode, it has 0.36W Power Dissipation and 3.5 ohm Drain-Source Resistance. With Gull Wing terminals and AEC-Q101 reference standard, it's suitable for automotive electronics due to its high temperature range of -55 to 150 °C.
MURS160T3G
MURS160T3G by Onsemi is a single rectifier diode with a max output current of 2A and max repetitive peak reverse voltage of 600V. It has a fast recovery time of 0.075us, making it suitable for high voltage applications. The diode operates in temperatures ranging from -65 to 175°C, ideal for power systems requiring ultra-fast response.
Bkc Semiconductors
2N2222A
Secos
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .6 A; JEDEC-95 Code: TO-92;
1N4148WS
General Instrument
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
OPA2277UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
Sun Wai Electronic
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Reverse Recovery Time: .004 us; Maximum Repetitive Peak Reverse Voltage: 100 V;
FWIXP420BC
Intel
Intel FWIXP420BC is a 32-bit microprocessor with integrated cache, operating at 33.33 MHz. It features a grid array package style and CMOS technology, suitable for commercial-grade applications requiring high-speed processing within a temperature range of 0-70°C.
AM3517AZCNAC
AM3517AZCNAC by Texas Instruments is a 16-bit microprocessor with integrated cache and surface mount capability. It operates at a max clock frequency of 26 MHz and has a wide temperature range, making it suitable for industrial applications.
AM3358BZCZA100
AM3358BZCZA100 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 64 DMA channels, and 26 MHz clock frequency. Ideal for industrial applications requiring low power mode, it features a max operating temperature of 105°C and boundary scan capability.
MCF5275LCVM166
NXP Semiconductors
NXP Semiconductors' MCF5275LCVM166 microprocessor features 32-bit architecture, 83 MHz clock frequency, and integrated cache. Ideal for industrial applications requiring low power mode, with a temperature range of -40 to 85 °C. This microprocessor is designed for high-speed data processing in compact devices.
STM32MP135AAG3
STM32MP135AAG3 by STMicroelectronics is a 32-bit microprocessor with 172032 RAM words and 48 MHz max clock frequency. Ideal for low power applications, it features 56 DMA channels and operates b/w -40 to 125 °C temperature range.
MPC8270VVQLDA
Freescale Semiconductor
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 480; Package Code: LBGA; Package Shape: SQUARE; Technology: CMOS;
MCF5233CVM150
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
P1011NSN2DFB
The NXP Semiconductors P1011NSN2DFB microprocessor features a 32-bit architecture with integrated cache and 16-bit address bus width. It is designed for applications requiring high-speed processing, with a max supply voltage of 1.05 V and external data bus width of 32 bits. The package style is grid array, making it suitable for surface mount configurations in various electronic devices.
P2010NXE2MHC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Boundary Scan: YES;
TDA4VM88TGBALFRQ1
TDA4VM88TGBALFRQ1 by Texas Instruments is a microprocessor with 64-bit architecture, 32-bit external data bus width, and integrated cache. Ideal for automotive applications, it operates b/w -40 to 125°C, features boundary scan capability, and has a max clock frequency of 27 MHz.
MPC8270CVVUPEA
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 480; Package Code: LBGA; Package Shape: SQUARE;
MCIMX6X2AVN08AB
MICROPROCESSOR, RISC; JESD-609 Code: e1; Technology: CMOS; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3;
AM3354BZCZ60
AM3354BZCZ60 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 16-bit external data bus width, and max clock frequency of 26 MHz. It is ideal for applications requiring low power mode, such as embedded systems and IoT devices.
MPC8308VMAGDA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 473; Package Code: LFBGA; Package Shape: SQUARE; Data EEPROM Size: 0;
T1042NXN7PQB
T1042NXN7PQB by NXP Semiconductors is a 32-bit microprocessor with integrated cache and a max clock frequency of 133.3 MHz. It is commonly used in applications requiring high-speed processing, such as networking and telecommunications.
DM3730CBPA
DM3730CBPA by Texas Instruments is a 32-bit microprocessor with integrated cache and a max clock frequency of 54 MHz. It is commonly used in industrial applications due to its low power mode, wide temperature range (-40 to 105 °C), and high number of DMA channels (128).
AM3352BZCZ100
AM3352BZCZ100 by Texas Instruments is a 32-bit microprocessor with integrated cache and 131072 RAM words. It operates at a max clock frequency of 26 MHz, suitable for low power applications in various industries like IoT and industrial automation. The package style is grid array with 324 terminals, making it ideal for surface mount assembly.
AM3517AZERC
AM3517AZERC by Texas Instruments is a microprocessor with 16-bit address bus, 8-bit on-chip data RAM width, and integrated cache. It operates at a max clock frequency of 26 MHz and has low power mode for energy efficiency. Ideal for applications requiring high-speed processing in compact devices.
MCF54452CVR200
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE;
NG80960JD3V66
Intel NG80960JD3V66 microprocessor features 32-bit address and data bus width, clocked at 33.3 MHz with integrated cache. Suitable for low power applications, it operates at a speed of 66 rpm in fixed point format. With boundary scan support and RISC architecture, this CMOS chip is ideal for embedded systems requiring high performance within a compact footprint.
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LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
AM3894CCYGA120
AM3894CCYGA120 by Texas Instruments is a 32-bit microprocessor with integrated cache and a max clock frequency of 27 MHz. It is commonly used in industrial applications due to its low power mode and temperature grade.
AM3894CCYG120
The Texas Instruments AM3894CCYG120 microprocessor features 32-bit architecture, 8-word data RAM width, and a clock frequency of up to 27 MHz. Ideal for applications requiring high-speed processing such as embedded systems, industrial automation, and networking equipment.
AM3894CCYG135
The Texas Instruments AM3894CCYG135 is a 32-bit microprocessor with integrated cache and 8-bit on-chip data RAM. It features a max clock frequency of 27 MHz, suitable for applications requiring high-speed processing. With a package style of grid array, fine pitch, it is ideal for use in devices where compact size and efficient performance are essential.
AM3874CCYEA80
The Texas Instruments AM3874CCYEA80 microprocessor features 32-bit architecture, 8-word data RAM width, and 16-bit external data bus. Ideal for industrial applications, it operates b/w -40 to 105°C with a clock frequency of up to 30 MHz. With low power mode and integrated cache, it offers high-speed processing capabilities in a compact square package.
AM3872BCYEA100
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 684; Package Code: FBGA; Package Shape: SQUARE; Length: 23 mm;
AM3892BCYG120
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1031; Package Code: FBGA; Package Shape: SQUARE; Address Bus Width: 16;
AM3892BCYG150
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1031; Package Code: FBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
AM3871BCYE80
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 684; Package Code: FBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B684;
AM3871CCYE100
MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 684; Package Code: FBGA; Package Shape: SQUARE;
AM3874BCYE100
MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 684; Package Code: FBGA; Package Shape: SQUARE;
AM3874CCYE80
AM3872BCYE80
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 684; Package Code: FBGA; Package Shape: SQUARE; External Data Bus Width: 16;
AM3874BCYE80
AM3871BCYEA80
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 684; Package Code: FBGA; Package Shape: SQUARE; Terminal Pitch: .8 mm;
AM3871CCYE80
AM3874BCYEA100
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 684; Package Code: FBGA; Package Shape: SQUARE; Speed: 1000 rpm;
AM3874BCYEA80
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 684; Package Code: FBGA; Package Shape: SQUARE; Address Bus Width: 16;
AM3872BCYEA80
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 684; Package Code: FBGA; Package Shape: SQUARE; Bit Size: 32;
AM3871BCYE100
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 684; Package Code: FBGA; Package Shape: SQUARE; Low Power Mode: YES;
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