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AM3874CCYEA100

Texas Instruments

AM3874CCYEA100 by Texas Instruments

The Texas Instruments AM3874CCYEA100 is a 32-bit microprocessor with integrated cache and 16-bit external data bus. It operates at a max clock frequency of 30 MHz, suitable for industrial applications requiring low power mode and floating-point format calculations. The package style is grid array, fine pitch, making it ideal for compact designs with high terminal count.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,142 parts In-Stock

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2,142

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Digiode

USA . 1,413 parts In-Stock

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1,413

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 732 parts In-Stock

1+ parts

$12.557

100+ parts

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732

$12.557

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Native Components

USA . 829 parts In-Stock

1+ parts

$15.130

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829

$15.130

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One Stop Electronics

USA . 655 parts In-Stock

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$16.000

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655

$16.000

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Northwest PG Solutions

USA . 2,031 parts In-Stock

1+ parts

$16.643

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$14.979

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2,031

$16.643

$14.979

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Parana Technologies

USA . 478 parts In-Stock

1+ parts

$18.746

100+ parts

$1,740.857

1k+ parts

$16.871

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478

$18.746

$1,740.857

$16.871

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DigiPath Technology Company

USA . 1,786 parts In-Stock

1+ parts

$20.642

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1,786

$20.642

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IDEA Electronic Components Group

UK . 1,509 parts In-Stock

1+ parts

$21.063

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$20.010

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$18.957

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1,509

$21.063

$20.010

$18.957

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ChromeModa Solutions

Germany . 1,403 parts In-Stock

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$21.063

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$17.272

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1,403

$21.063

$17.272

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Corohmni

South Africa . 249 parts In-Stock

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$83.719

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249

$83.719

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Corphita

USA . 529 parts In-Stock

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Overview

Elevate your electronic designs with the AM3874CCYEA100 by Texas Instruments, a high-quality microprocessor that offers unmatched performance and reliability. With a focus on cutting-edge technology and innovation, Texas Instruments has consistently delivered top-notch products that exceed industry standards. Ideal for a wide range of applications, this microprocessor boasts integrated cache and low power mode for optimal efficiency. Experience seamless operation and unparalleled speed with the AM3874CCYEA100, setting a new standard in the field of microprocessors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microprocessor, making it suitable for various environments.

Integrated Cache: YES

Having integrated cache helps in improving the overall performance of the microprocessor by providing faster access to frequently used data.

Surface Mount: YES

Surface mount capability allows for easy installation of the microprocessor on a circuit board, saving space and making it ideal for compact devices.

Address Bus Width: 28

A wider address bus width allows for efficient memory addressing, enabling the microprocessor to handle larger amounts of data and instructions.

Package Shape: SQUARE

The square shape of the package provides ease of handling and installation, making it convenient for assembly processes.

Bit Size: 32

A 32-bit architecture allows the microprocessor to process data and perform calculations with higher precision and speed.

Power Supplies (V): 0.95/1.35

The dual power supply options offer flexibility in operating the microprocessor at different voltage levels, catering to various power requirements.

No. of Terminals: 684

A higher number of terminals enable efficient connectivity and communication within the microprocessor and with external devices, enhancing overall performance.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style provides a compact and reliable design for the microprocessor, suitable for high-density circuit boards.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature tolerance ensures stability and reliability of the microprocessor even in demanding thermal conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the microprocessor to function optimally in cold environments, expanding its usability across a wide range of temperatures.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides good conductivity and corrosion resistance, ensuring reliable connections for efficient performance.

Terminal Position: BOTTOM

Having terminals positioned at the bottom facilitates easier installation and connection of the microprocessor on circuit boards, streamlining the assembly process.

Maximum Seated Height: 3.06 mm

The low maximum seated height of the microprocessor allows for space-saving integration in compact devices with height constraints.

Width: 23 mm

The compact width of the microprocessor makes it suitable for applications where space is limited, without compromising on performance.

Boundary Scan: YES

The presence of boundary scan capability facilitates efficient testing and debugging of the microprocessor during production and maintenance stages.

External Data Bus Width: 16

An external data bus width of 16 bits enables fast data transfer and communication between the microprocessor and external devices, enhancing overall system performance.

Maximum Clock Frequency: 30 MHz

The high maximum clock frequency allows the microprocessor to operate at fast speeds, supporting quick execution of instructions and time-sensitive tasks.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand peak reflow temperature for 30 seconds ensures reliable soldering and assembly of the microprocessor on circuit boards.

Peak Reflow Temperature °C: 250

With a peak reflow temperature of 250°C, the microprocessor can undergo soldering processes without damage, ensuring secure connections for functionality.

Length: 23 mm

The compact length of the microprocessor contributes to its space-saving design, making it suitable for integration in small form factor devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation of the microprocessor in harsh industrial environments with varying temperature conditions.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC-based microprocessor enhances efficiency and performance by optimizing instruction execution and data processing, making it suitable for a wide range of applications.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation, making the microprocessor energy-efficient and suitable for battery-powered devices.

Terminal Form: BALL

The ball terminal form provides reliable connections for seamless integration of the microprocessor on circuit boards, ensuring stable performance.

Nominal Supply Voltage: 1.35 V

The nominal supply voltage of 1.35V offers efficient power consumption, optimizing the performance and energy efficiency of the microprocessor.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8mm allows for precise and secure connections, enhancing the reliability and stability of the microprocessor in operation.

Format: FLOATING POINT

The floating-point format enables the microprocessor to perform complex mathematical calculations with high precision and accuracy, making it ideal for computational tasks.

Moisture Sensitivity Level (MSL): 4

MSL level 4 indicates that the microprocessor can withstand exposure to moisture during storage and handling, ensuring long-term reliability and performance.

Speed: 1000 rpm

With a speed rating of 1000 RPM, the microprocessor can efficiently process instructions and data at a high speed, supporting fast and responsive performance.

Low Power Mode: YES

The low power mode feature allows the microprocessor to operate in a power-efficient state, extending battery life and reducing energy consumption in portable devices.

Technical Specifications

Microprocessors AM3874CCYEA100 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B684

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

684

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA684,28X28,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Power Supplies (V):

0.95/1.35

Qualification:

Not Qualified

Maximum Seated Height:

3.06 mm

Speed:

1000 rpm

Sub-Category:

Microprocessors

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

AM3874CCYEA100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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