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DM3730CBP100

Texas Instruments

DM3730CBP100 by Texas Instruments

DM3730CBP100 by Texas Instruments is a microprocessor with integrated cache and surface mount capability. It has an address bus width of 26, on-chip data RAM width of 8, and operates at a max clock frequency of 54 MHz. This processor is commonly used in applications requiring high-speed processing and low power consumption.

Median Price

$54.095

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,737 parts In-Stock

1+ parts

$40.952

100+ parts

$36.402

1k+ parts

$26.766

10k+ parts

-

10,737

$40.952

$36.402

$26.766

-

DigiKey

USA . 251 parts In-Stock

1+ parts

$65.440

100+ parts

$51.327

1k+ parts

$47.345

10k+ parts

-

251

$65.440

$51.327

$47.345

-

Mouser Electronics

USA . 448 parts In-Stock

1+ parts

$71.490

100+ parts

$53.230

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-

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448

$71.490

$53.230

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Rochester

USA . 8 parts In-Stock

1+ parts

-

100+ parts

$42.750

1k+ parts

$38.250

10k+ parts

$36.000

8

-

$42.750

$38.250

$36.000

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,698 parts In-Stock

1+ parts

$35.312

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-

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4,698

$35.312

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DigiKey Marketplace

USA . 8 parts In-Stock

1+ parts

$38.670

100+ parts

-

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8

$38.670

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Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$44.960

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150

$44.960

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Vyrian

USA . 8,030 parts In-Stock

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8,030

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Chip Stock

USA . 174 parts In-Stock

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174

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ComSIT Distribution GmbH

Germany . 23 parts In-Stock

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Bristol Electronics

USA . 3 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 38 parts In-Stock

1+ parts

$17.977

100+ parts

-

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38

$17.977

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Ampacity Inc.

Singapore . 2,787 parts In-Stock

1+ parts

$31.590

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2,787

$31.590

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Semicontronic

India . 2,559 parts In-Stock

1+ parts

$31.590

100+ parts

$30.800

1k+ parts

$30.642

10k+ parts

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2,559

$31.590

$30.800

$30.642

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$33.337

100+ parts

$30.337

1k+ parts

$27.336

10k+ parts

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1,000

$33.337

$30.337

$27.336

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Corphita

USA . 3,649 parts In-Stock

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$33.453

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3,649

$33.453

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Parana Technologies

USA . 1,375 parts In-Stock

1+ parts

$38.317

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$38.317

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DigiPath Technology Company

USA . 312 parts In-Stock

1+ parts

$42.192

100+ parts

$38.817

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312

$42.192

$38.817

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IDEA Electronic Components Group

UK . 443 parts In-Stock

1+ parts

$43.053

100+ parts

$40.900

1k+ parts

$38.748

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443

$43.053

$40.900

$38.748

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ChromeModa Solutions

Germany . 203 parts In-Stock

1+ parts

$43.053

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$35.303

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203

$43.053

$35.303

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Continental Prestige Electronics

USA . 3,090 parts In-Stock

1+ parts

$44.960

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-

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$44.061

3,090

$44.960

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-

$44.061

Netroflash

USA . 100 parts In-Stock

1+ parts

$44.960

100+ parts

-

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$42.712

10k+ parts

$41.813

100

$44.960

-

$42.712

$41.813

Microchip USA

USA . 1,395 parts In-Stock

1+ parts

$91.218

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1,395

$91.218

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Lixinc

USA . 10,045 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,757 parts In-Stock

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4,757

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Alle Elektronik GmbH

Germany . 3,171 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Argo Parts USA

USA . 357 parts In-Stock

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Kepictronics

USA . 136 parts In-Stock

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Overview

Experience the power and reliability of the DM3730CBP100 by Texas Instruments. As a leader in microprocessor technology, Texas Instruments delivers superior quality and performance with every product. The DM3730CBP100 is perfect for a wide range of applications, offering seamless integration, enhanced processing capabilities, and efficient power usage. With its advanced features and cutting-edge technology, this microprocessor provides unmatched value and benefits to customers. Harness the potential of the DM3730CBP100 and unlock a world of possibilities for your projects.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - The plastic/epoxy package material provides durability and protection for the microprocessor, making it suitable for various applications.

Integrated Cache

YES - The integrated cache allows for faster data retrieval and processing, enhancing the overall performance of the microprocessor.

Surface Mount

YES - The surface mount feature allows for easy installation and integration into circuit boards, making it convenient for manufacturers.

Maximum Supply Voltage

1.2 V - The low maximum supply voltage ensures energy efficiency and helps in reducing power consumption, making it an ideal choice for devices with limited power sources.

On Chip Data RAM Width

8 - The wide on-chip data RAM width helps in handling and storing a large amount of data simultaneously, enabling faster and efficient processing.

Address Bus Width

26 - The wide address bus width allows the microprocessor to access a larger memory space, increasing its capability to handle complex tasks and data-intensive applications.

Package Shape

SQUARE - The square package shape facilitates easy integration into various electronic devices, making it compatible with different designs.

Bit Size

32 - The 32-bit architecture enables the microprocessor to process and handle larger numerical values and complex calculations, enhancing its overall performance.

Power Supplies (V)

1.2,1.8 - The microprocessor is compatible with multiple power supply voltages, providing flexibility for diverse applications and environments.

No. of Terminals

515 - The high number of terminals ensures efficient connectivity and interface options, allowing for seamless integration into complex circuitry.

Package Style (Meter)

GRID ARRAY, VERY THIN PROFILE, FINE PITCH - The grid array package style with a very thin profile and fine pitch enables compact and space-saving designs, making it suitable for small form factor devices.

Minimum Supply Voltage

1.08 V - The low minimum supply voltage further enhances energy efficiency and reduces power consumption, increasing the product's suitability for devices with strict power requirements.

Maximum Operating Temperature

90 °C - The high maximum operating temperature tolerance ensures reliability and stability in challenging operating conditions, making it suitable for industrial and automotive applications.

Minimum Operating Temperature

0 °C - The low minimum operating temperature allows the microprocessor to operate efficiently even in cold environments, expanding its usability in various applications.

Terminal Finish

Tin/Silver/Copper (Sn/Ag/Cu) - The tin/silver/copper terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections and extended product lifespan.

Terminal Position

BOTTOM - The bottom terminal position simplifies the circuit board layout and facilitates proper heat dissipation, enhancing the overall reliability and performance of the microprocessor.

Maximum Seated Height

0.71 mm - The low maximum seated height allows for space-saving designs and compatibility with thin devices, making it suitable for applications with size constraints.

RAM Words

16384 - The large number of RAM words ensures ample memory capacity, enabling efficient multitasking and seamless operation of memory-hungry applications.

Width

12 mm - The compact width dimension allows for flexible integration into various electronic devices, making it suitable for space-constrained designs.

Boundary Scan

YES - The inclusion of boundary scan capability allows for efficient testing and debugging during manufacturing, ensuring high product quality.

External Data Bus Width

16 - The wide external data bus width allows for fast data transfer between the microprocessor and external devices, enhancing overall system performance.

Maximum Clock Frequency

54 MHz - The high maximum clock frequency enables faster execution of instructions and ensures efficient processing of data, improving the microprocessor's performance.

Peak Reflow Temperature °C

260 - The high peak reflow temperature tolerance facilitates reliable soldering during the manufacturing process, ensuring proper assembly and connection of the microprocessor.

Length

12 mm - The compact length dimension enables integration into tight spaces, enhancing versatility and compatibility with various electronic designs.

Peripheral IC Type

MICROPROCESSOR, RISC - The microprocessor's RISC architecture facilitates efficient and streamlined instruction execution, making it suitable for applications that require high-speed processing.

Technology

CMOS - The CMOS technology used in the microprocessor provides low power consumption, high performance, and excellent noise immunity, making it an efficient and reliable choice for various applications.

Terminal Form

BALL - The ball terminal form enables reliable contact with the circuit board, ensuring stable and efficient electrical connections, especially in applications with excessive vibrations or movement.

Maximum Supply Current

37 mA - The low maximum supply current requirement ensures energy efficiency and helps in minimizing power consumption, making it ideal for battery-powered devices.

Nominal Supply Voltage

1.14 V - The nominal supply voltage provides a stable and optimized power input for the microprocessor, ensuring consistent performance and minimizing the risk of damage.

No. of DMA Channels

128 - The high number of DMA channels enables efficient data transfer between devices without the involvement of the CPU, enhancing overall system performance and reducing the CPU's workload.

Terminal Pitch

0.4 mm - The small terminal pitch allows for compact and densely packed designs, enabling the integration of the microprocessor into space-constrained electronic devices.

Format

FLOATING POINT - The microprocessor's floating-point format enhances its mathematical capabilities, enabling precise and efficient handling of complex calculations and numerical operations.

Moisture Sensitivity Level (MSL)

3 - The moisture sensitivity level indicates the level of protection required during the manufacturing process, ensuring the microprocessor meets quality standards and avoiding moisture-related failures.

Speed

1000 rpm - The high-speed capabilities of the microprocessor enable fast data processing and execution of instructions, ensuring efficient performance in demanding applications.

Low Power Mode

YES - The inclusion of a low power mode allows the microprocessor to conserve energy when idle or under low processing requirements, making it suitable for battery-powered devices or energy-efficient systems.

Technical Specifications

Microprocessors DM3730CBP100 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

54 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B515

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

128

No. of Terminals:

515

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA515,28X28,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

.71 mm

Speed:

1000 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

37 mA

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.14 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Trade Compliance

DM3730CBP100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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