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MPC8270VVQLDA

NXP Semiconductors

MPC8270VVQLDA by NXP Semiconductors

NXP Semiconductors' MPC8270VVQLDA microprocessor features 32-bit address and data bus width, with integrated cache and 64-bit external data bus. It operates at a max clock frequency of 83.33 MHz, suitable for commercial-grade applications requiring high-speed processing in a compact square package.

Median Price

$128.684

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

MPC8270VVQLDA by NXP Semiconductors
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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 21 parts In-Stock

1+ parts

$91.570

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$91.570

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Rochester

USA . 335 parts In-Stock

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$118.330

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$111.230

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$104.130

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335

$118.330

$111.230

$104.130

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Element14

Singapore . 21 parts In-Stock

1+ parts

$184.610

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$172.140

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21

$184.610

$172.140

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Flip Electronics (Authorized)

USA . 3,744 parts In-Stock

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3,744

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DigiKey

USA . 335 parts In-Stock

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335

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Verical

USA . 115 parts In-Stock

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$139.037

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$130.162

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115

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$139.037

$130.162

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Distributors (In-Stock)

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Digiode

USA . 559 parts In-Stock

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$130.520

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559

$130.520

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Nova Conductors

Japan . 750 parts In-Stock

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$175.000

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750

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Flip Electronics

USA . 2,537 parts In-Stock

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2,537

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Vyrian

USA . 696 parts In-Stock

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696

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R&J Components

USA . 367 parts In-Stock

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367

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Chip Stock

USA . 325 parts In-Stock

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325

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Anansix

USA . 202 parts In-Stock

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202

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 11 parts In-Stock

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Connector Distribution Corp

USA . 5 parts In-Stock

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5

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Right Parts Inc.

USA . 5 parts In-Stock

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Distributors (Availability)

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$25.102

100+ parts

$22.843

1k+ parts

$20.584

10k+ parts

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3,000

$25.102

$22.843

$20.584

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Ampacity Inc.

Singapore . 1,038 parts In-Stock

1+ parts

$116.780

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1,038

$116.780

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Corphita

USA . 1,541 parts In-Stock

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$123.651

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$123.651

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Continental Prestige Electronics

USA . 6,300 parts In-Stock

1+ parts

$175.000

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$171.500

6,300

$175.000

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$171.500

Netroflash

USA . 2,000 parts In-Stock

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$175.000

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$166.250

10k+ parts

$162.750

2,000

$175.000

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$166.250

$162.750

Vigor

Singapore . 400 parts In-Stock

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$224.780

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400

$224.780

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Microchip USA

USA . 962 parts In-Stock

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$282.615

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Lixinc

USA . 10,997 parts In-Stock

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UNI Independent Distributors

Spain . 6,292 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,849 parts In-Stock

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Kepictronics

USA . 1,259 parts In-Stock

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Argo Parts USA

USA . 1,002 parts In-Stock

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Authorized Procurement Solutions

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Futuretech Components

Singapore . 900 parts In-Stock

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900

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Perfect Parts

USA . 110 parts In-Stock

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110

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Speed Components Ltd (Excess)

Israel . 1 parts In-Stock

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Overview

Experience cutting-edge technology with the MPC8270VVQLDA microprocessor from NXP Semiconductors. This powerful chip offers integrated cache, high-performance processing, and advanced features for a wide range of applications. With NXP's reputation for quality and innovation, you can trust that this microprocessor delivers superior performance and reliability. Unlock new possibilities in computing with the MPC8270VVQLDA and stay ahead of the curve in today's fast-paced digital world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the microprocessor, ensuring a longer lifespan and reliability.

Integrated Cache: YES

Integrated cache improves the processing speed by storing frequently accessed data, resulting in faster performance.

Maximum Supply Voltage: 1.6 V

Higher maximum supply voltage allows for better performance and stability under heavy workloads.

Address Bus Width: 32

A wider address bus allows for more efficient data transfer and access to memory locations, increasing overall performance.

Bit Size: 32

32-bit processing capability enables efficient handling of data and instructions, suitable for a wide range of applications.

Power Supplies (V): 1.5,3.3

Support for multiple power supply voltages allows for flexibility in different operating environments.

Terminal Finish: TIN SILVER COPPER

A terminal finish of Tin Silver Copper provides good conductivity and resistance to corrosion, ensuring reliable connections.

Maximum Seated Height: 1.65 mm

Low profile design with a maximum seated height of 1.65 mm enables compact and slim form factors for space-constrained applications.

Maximum Clock Frequency: 83.33 MHz

High maximum clock frequency allows for rapid processing of instructions and data, enhancing overall performance.

Technical Specifications

Microprocessors MPC8270VVQLDA attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

83.33 MHz

External Data Bus Width:

64

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B480

JESD-609 Code:

e1

Length:

37.5 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

480

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA480,29X29,50

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.65 mm

Speed:

333 rpm

Sub-Category:

Other uPs/uCs/Peripheral ICs

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1.45 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

37.5 mm

Peripheral IC Type:

Trade Compliance

MPC8270VVQLDA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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