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AM3352BZCED60

Texas Instruments

AM3352BZCED60 by Texas Instruments

AM3352BZCED60 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 64 DMA channels, and 26 MHz clock frequency. Ideal for industrial applications requiring low power mode, it features a max operating temperature of 90°C and boundary scan capability.

Median Price

$12.178

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,330 parts In-Stock

1+ parts

$9.567

100+ parts

$8.356

1k+ parts

$5.763

10k+ parts

-

2,330

$9.567

$8.356

$5.763

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Mouser Electronics

USA . 160 parts In-Stock

1+ parts

$14.790

100+ parts

$7.810

1k+ parts

$7.790

10k+ parts

-

160

$14.790

$7.810

$7.790

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,504 parts In-Stock

1+ parts

$9.089

100+ parts

-

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3,504

$9.089

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$9.394

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10

$9.394

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Vyrian

USA . 7,201 parts In-Stock

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7,201

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Chip Stock

USA . 2,846 parts In-Stock

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VNN

France . 694 parts In-Stock

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694

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TME

Poland . 160 parts In-Stock

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-

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$8.720

10k+ parts

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160

-

-

$8.720

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,011 parts In-Stock

1+ parts

$8.130

100+ parts

-

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1,011

$8.130

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Corphita

USA . 1,675 parts In-Stock

1+ parts

$8.610

100+ parts

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1,675

$8.610

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Continental Prestige Electronics

USA . 1,351 parts In-Stock

1+ parts

$9.394

100+ parts

-

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$9.206

1,351

$9.394

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$9.206

Netroflash

USA . 1,000 parts In-Stock

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$9.394

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-

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1,000

$9.394

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Parana Technologies

USA . 1,256 parts In-Stock

1+ parts

$13.759

100+ parts

$1,277.769

1k+ parts

$12.383

10k+ parts

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1,256

$13.759

$1,277.769

$12.383

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DigiPath Technology Company

USA . 1,317 parts In-Stock

1+ parts

$15.151

100+ parts

$13.939

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1,317

$15.151

$13.939

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IDEA Electronic Components Group

UK . 2,130 parts In-Stock

1+ parts

$15.460

100+ parts

$14.687

1k+ parts

$13.914

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2,130

$15.460

$14.687

$13.914

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ChromeModa Solutions

Germany . 172 parts In-Stock

1+ parts

$15.460

100+ parts

$12.677

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172

$15.460

$12.677

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Perfect Parts

USA . 25,805 parts In-Stock

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Lixinc

USA . 15,592 parts In-Stock

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A-Z Elektronik GmbH

Germany . 10,241 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,574 parts In-Stock

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4,574

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

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Argo Parts USA

USA . 934 parts In-Stock

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934

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Kepictronics

USA . 140 parts In-Stock

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140

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Overview

Unlock unparalleled performance and efficiency with the AM3352BZCED60 by Texas Instruments. As a leading manufacturer of microprocessors, Texas Instruments guarantees top-notch quality and reliability. This powerful processor is ideal for a wide range of applications, offering seamless integration, enhanced speed, and low power consumption. Experience the value and benefits of this cutting-edge technology, perfect for industrial-grade solutions that require high performance and precision. Upgrade your systems with the AM3352BZCED60 and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and thermal conductivity, making the product long-lasting and reliable.

Integrated Cache: YES

Integrated cache allows for faster data access and improved performance of the microprocessor.

Maximum Supply Voltage: 1.144 V

Operating within a safe maximum voltage range ensures the stability and longevity of the microprocessor.

Address Bus Width: 28

A wider address bus allows for larger memory addressable space, enabling advanced data processing capabilities.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, the microprocessor can perform efficiently even under demanding conditions.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent conductivity and corrosion resistance, contributing to the reliability of the microprocessor.

Peripheral IC Type: MICROPROCESSOR, RISC

Having a RISC architecture enables efficient processing of instructions, enhancing the overall performance of the product.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable.

Maximum Clock Frequency: 26 MHz

The high maximum clock frequency allows for fast data processing speed, critical for performance-intensive applications.

Technical Specifications

Microprocessors AM3352BZCED60 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B298

JESD-609 Code:

e1

Length:

13 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

64

No. of Terminals:

298

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA298,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.95/1.1

Qualification:

Not Qualified

RAM Words:

131072

Maximum Seated Height:

1.3 mm

Speed:

600 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

1.144 V

Minimum Supply Voltage:

1.056 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

AM3352BZCED60 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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