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P1011NSN2HFB

NXP Semiconductors

P1011NSN2HFB by NXP Semiconductors

The NXP Semiconductors P1011NSN2HFB is a 32-bit microprocessor with integrated cache and a max supply voltage of 1.05V. It is used in applications requiring high-speed processing, such as networking equipment and industrial automation systems.

Median Price

$57.860

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 28 parts In-Stock

1+ parts

$43.650

100+ parts

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28

$43.650

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Rochester

USA . 3 parts In-Stock

1+ parts

-

100+ parts

$72.070

1k+ parts

$64.480

10k+ parts

$60.690

3

-

$72.070

$64.480

$60.690

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 804 parts In-Stock

1+ parts

$48.999

100+ parts

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804

$48.999

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Nova Conductors

Japan . 52 parts In-Stock

1+ parts

$68.990

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52

$68.990

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Anansix

USA . 2,668 parts In-Stock

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2,668

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Chip Stock

USA . 1,125 parts In-Stock

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1,125

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Flip Electronics

USA . 1,054 parts In-Stock

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1,054

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Vyrian

USA . 409 parts In-Stock

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409

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Bristol Electronics

USA . 135 parts In-Stock

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135

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J & M Industries LLC

USA . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 529 parts In-Stock

1+ parts

$43.640

100+ parts

-

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529

$43.640

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Ampacity Inc.

Singapore . 122 parts In-Stock

1+ parts

$43.640

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122

$43.640

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Corphita

USA . 3,495 parts In-Stock

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$46.420

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3,495

$46.420

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Microchip USA

USA . 189 parts In-Stock

1+ parts

$53.723

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189

$53.723

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Continental Prestige Electronics

USA . 3,934 parts In-Stock

1+ parts

$68.990

100+ parts

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10k+ parts

$67.610

3,934

$68.990

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$67.610

Vigor

Singapore . 903 parts In-Stock

1+ parts

$125.345

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903

$125.345

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UNI Independent Distributors

Spain . 2,012 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

$67.610

1k+ parts

$65.540

10k+ parts

$64.161

1,000

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$67.610

$65.540

$64.161

Argo Parts USA

USA . 535 parts In-Stock

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535

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Perfect Parts

USA . 6 parts In-Stock

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6

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Overview

Discover the power of the P1011NSN2HFB by NXP Semiconductors, a game-changer in the world of microprocessors. With its cutting-edge technology and superior quality, this remarkable product delivers unparalleled performance and reliability. Designed for a wide range of applications, it offers countless benefits and advantages to customers like never before. Unlock the true potential of your projects with the P1011NSN2HFB and experience a whole new level of efficiency and innovation. Trust NXP Semiconductors, a leader in the industry, to bring you the best that technology has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides excellent protection for the microprocessor, ensuring durability and reliability.

Integrated Cache: YES

The integrated cache allows for faster data access and improved system performance, making this microprocessor ideal for tasks that require extensive data processing.

Surface Mount: YES

The surface mount capability of this microprocessor simplifies the installation process and enhances space efficiency, making it suitable for small form factor devices.

Maximum Supply Voltage: 1.05 V

The maximum supply voltage of 1.05 V allows for efficient power consumption and reduced heat generation, promoting energy efficiency in the system.

Address Bus Width: 16

The 16-bit address bus width enables this microprocessor to access a large memory space, accommodating complex applications and supporting multitasking operations.

Package Shape: SQUARE

The square package shape offers ease of mounting and ensures stability, making it convenient for integration into various electronic systems.

Bit Size: 32

The 32-bit bit size enables the microprocessor to handle larger chunks of data and perform calculations with higher precision, enhancing overall performance and compatibility.

No. of Terminals: 689

With a high number of terminals, this microprocessor offers extensive connectivity options, facilitating integration with multiple peripherals and supporting versatile system designs.

Package Style (Meter): GRID ARRAY

The grid array package style provides a reliable connection between the microprocessor and the PCB, ensuring good signal integrity and reducing the risk of electrical failures.

Minimum Supply Voltage: 0.95 V

The minimum supply voltage of 0.95 V allows for efficient power management, extending battery life in portable devices and reducing overall energy consumption.

No. of External Interrupts: 7

With 7 external interrupts, this microprocessor can handle multiple external events and prioritize tasks effectively, enhancing system responsiveness and flexibility.

Terminal Position: BOTTOM

The bottom terminal position simplifies the PCB layout, ensuring ease of assembly and efficient utilization of space, making this microprocessor suitable for embedded applications.

Maximum Seated Height: 2.46 mm

The maximum seated height of 2.46 mm allows for low-profile designs and compact system configurations, enabling this microprocessor to be used in slim devices and space-constrained environments.

Width: 31 mm

The 31 mm width makes this microprocessor compatible with standard PCB designs and allows for easy integration into various electronic systems, ensuring broad compatibility and versatility.

Boundary Scan: YES

The boundary scan capability enables efficient testing and diagnostics of the microprocessor, simplifying production processes and enhancing overall product quality.

External Data Bus Width: 32

With a 32-bit external data bus width, this microprocessor can efficiently transfer larger amounts of data between the processor and other peripherals, enhancing system performance and data throughput.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time allowed at peak reflow temperature of 40 seconds ensures reliable soldering connections during assembly, resulting in secure and robust operation of the microprocessor.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper solder melting and bonding during assembly, ensuring long-term reliability and preventing solder joint failures.

Length: 31 mm

The 31 mm length of this microprocessor allows for seamless integration into various PCB designs, providing flexibility in system arrangements and board layouts.

Peripheral IC Type: MICROPROCESSOR, RISC

With a RISC architecture, this microprocessor offers simplified instruction sets and execution, enhancing overall system performance and efficiency for tasks involving extensive computations.

Technology: CMOS

The CMOS technology employed in this microprocessor ensures low power consumption, reduced heat generation, and improved noise immunity, making it an optimal choice for energy-efficient and reliable applications.

Terminal Form: BALL

The ball terminal form simplifies the installation process and enhances electrical connections, ensuring secure and reliable interconnection between the microprocessor and the PCB.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1 V ensures stable and efficient power delivery, contributing to overall power savings and improved performance in the system.

No. of DMA Channels: 4

With 4 DMA channels, this microprocessor enables direct memory data transfers without CPU intervention, enhancing data handling capabilities and system efficiency.

Terminal Pitch: 1 mm

The terminal pitch of 1 mm allows for compact PCB designs and efficient space utilization, enabling this microprocessor to be used in miniaturized devices and space-constrained environments.

Format: FIXED POINT

The fixed-point format of this microprocessor enables efficient numerical calculations and precise arithmetic operations, making it suitable for applications that require high accuracy and computational predictability.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this microprocessor requires standard moisture-sensitive handling during assembly, ensuring moisture absorption prevention and preventing possible damage to the device.

Speed: 800 rpm

With a speed of 800 revolutions per minute, this microprocessor delivers fast and responsive performance, supporting demanding applications that require quick computation and data processing.

Technical Specifications

Microprocessors P1011NSN2HFB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

16

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B689

Length:

31 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

7

No. of Terminals:

689

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA689,29X29,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.46 mm

Speed:

800 rpm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

31 mm

Peripheral IC Type:

Trade Compliance

P1011NSN2HFB Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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