Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The NXP Semiconductors P1011NSN2HFB is a 32-bit microprocessor with integrated cache and a max supply voltage of 1.05V. It is used in applications requiring high-speed processing, such as networking equipment and industrial automation systems.
Median Price
$57.860
Lifecycle Status
Suppliers In-Stock
10
In-Stock Inventory
1k+
Verical
1+ parts
$43.650
100+ parts
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1k+ parts
10k+ parts
Rochester
$72.070
$64.480
$60.690
Digiode
$48.999
Nova Conductors
$68.990
Anansix
Chip Stock
Flip Electronics
Vyrian
Bristol Electronics
J & M Industries LLC
One Stop Electronics
$43.640
Ampacity Inc.
Corphita
$46.420
Microchip USA
$53.723
Continental Prestige Electronics
$67.610
Vigor
$125.345
UNI Independent Distributors
Netroflash
$65.540
$64.161
Argo Parts USA
Perfect Parts
The plastic/epoxy package body material provides excellent protection for the microprocessor, ensuring durability and reliability.
The integrated cache allows for faster data access and improved system performance, making this microprocessor ideal for tasks that require extensive data processing.
The surface mount capability of this microprocessor simplifies the installation process and enhances space efficiency, making it suitable for small form factor devices.
The maximum supply voltage of 1.05 V allows for efficient power consumption and reduced heat generation, promoting energy efficiency in the system.
The 16-bit address bus width enables this microprocessor to access a large memory space, accommodating complex applications and supporting multitasking operations.
The square package shape offers ease of mounting and ensures stability, making it convenient for integration into various electronic systems.
The 32-bit bit size enables the microprocessor to handle larger chunks of data and perform calculations with higher precision, enhancing overall performance and compatibility.
With a high number of terminals, this microprocessor offers extensive connectivity options, facilitating integration with multiple peripherals and supporting versatile system designs.
The grid array package style provides a reliable connection between the microprocessor and the PCB, ensuring good signal integrity and reducing the risk of electrical failures.
The minimum supply voltage of 0.95 V allows for efficient power management, extending battery life in portable devices and reducing overall energy consumption.
With 7 external interrupts, this microprocessor can handle multiple external events and prioritize tasks effectively, enhancing system responsiveness and flexibility.
The bottom terminal position simplifies the PCB layout, ensuring ease of assembly and efficient utilization of space, making this microprocessor suitable for embedded applications.
The maximum seated height of 2.46 mm allows for low-profile designs and compact system configurations, enabling this microprocessor to be used in slim devices and space-constrained environments.
The 31 mm width makes this microprocessor compatible with standard PCB designs and allows for easy integration into various electronic systems, ensuring broad compatibility and versatility.
The boundary scan capability enables efficient testing and diagnostics of the microprocessor, simplifying production processes and enhancing overall product quality.
With a 32-bit external data bus width, this microprocessor can efficiently transfer larger amounts of data between the processor and other peripherals, enhancing system performance and data throughput.
The maximum time allowed at peak reflow temperature of 40 seconds ensures reliable soldering connections during assembly, resulting in secure and robust operation of the microprocessor.
The peak reflow temperature of 260°C ensures proper solder melting and bonding during assembly, ensuring long-term reliability and preventing solder joint failures.
The 31 mm length of this microprocessor allows for seamless integration into various PCB designs, providing flexibility in system arrangements and board layouts.
With a RISC architecture, this microprocessor offers simplified instruction sets and execution, enhancing overall system performance and efficiency for tasks involving extensive computations.
The CMOS technology employed in this microprocessor ensures low power consumption, reduced heat generation, and improved noise immunity, making it an optimal choice for energy-efficient and reliable applications.
The ball terminal form simplifies the installation process and enhances electrical connections, ensuring secure and reliable interconnection between the microprocessor and the PCB.
The nominal supply voltage of 1 V ensures stable and efficient power delivery, contributing to overall power savings and improved performance in the system.
With 4 DMA channels, this microprocessor enables direct memory data transfers without CPU intervention, enhancing data handling capabilities and system efficiency.
The terminal pitch of 1 mm allows for compact PCB designs and efficient space utilization, enabling this microprocessor to be used in miniaturized devices and space-constrained environments.
The fixed-point format of this microprocessor enables efficient numerical calculations and precise arithmetic operations, making it suitable for applications that require high accuracy and computational predictability.
With an MSL of 3, this microprocessor requires standard moisture-sensitive handling during assembly, ensuring moisture absorption prevention and preventing possible damage to the device.
With a speed of 800 revolutions per minute, this microprocessor delivers fast and responsive performance, supporting demanding applications that require quick computation and data processing.
Microprocessors P1011NSN2HFB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors
Address Bus Width:
Bit Size:
Boundary Scan:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
Length:
Low Power Mode:
Moisture Sensitivity Level (MSL):
No. of DMA Channels:
No. of External Interrupts:
No. of Terminals:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Seated Height:
Speed:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
P1011NSN2HFB Peripheral ICs trade compliance attributes, and parameters.
ECCN
3A991.A.2
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
MMBT2907ALT1G
Onsemi
MMBT2907ALT1G by Onsemi is a PNP BJT transistor with 100 min hFE, 60V VCEO, and 200MHz fT. Ideal for switching applications, it has a small outline package with Gull Wing terminals and can handle up to 0.6A of collector current.
FDC5614P
MSKSEMI SEMICONDUCTOR
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 60 V;
1N4148
International Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BSS138
Yangzhou Yangjie Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JESD-30 Code: R-PDSO-G3; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Operating Mode: ENHANCEMENT MODE;
MBRA160T3G
MBRA160T3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.51V. It operates b/w -55 to 150°C, has a reverse test voltage of 60V, and is ideal for power applications due to its high efficiency and small outline package style.
SS14
Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
PAP-06V-S
J S T Mfg
PAP-06V-S by J S T Mfg is a 6-contact BOARD CONNECTOR with 94V-0 UL Flammability Code. It has FEMALE contacts, CRIMP termination, and comes WITH CABLE ASSEMBLY for CABLE mounting applications.
Vicor
Won-top Electronics
1N4148WS
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Plessey Semiconductors Discrete Components Div
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/58-360
TE Connectivity
TE Connectivity's M39029/58-360 is a CRIMP terminal backshell for 22-28 AWG wires, rated at 5A. Ideal for male contacts in Mil-Spec applications, it offers a cross-section area of 0.34 mm2 and ensures secure connections in demanding environments.
TAIZHOU ELECTRONICS CO LTD
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.92 W; Maximum Operating Temperature: 150 Cel; Package Body Material: PLASTIC/EPOXY;
LM358AN
Philips Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Capar Components
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Forward Voltage (VF): 1 V; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Output Current: .15 A;
General Semiconductor
LM107H
Linear Technology
LM107H by Linear Technology is an Operational Amplifier with a max input offset voltage of 3000uV, common mode reject ratio of 96dB, and min voltage gain of 50000. It is used in military applications due to its MILITARY temperature grade and BIPOLAR technology for precise signal processing in harsh environments.
MBRS340T3G
MBRS340T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.5V and output current of 4A. It operates b/w -65°C to 150°C, making it suitable for various applications requiring high-speed switching and low power loss in a small outline package. The diode's matte tin terminal finish and dual position make it ideal for surface mount PCB designs.
2N2222A
Forward International Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .6 A;
SMBJ18CA
Semitron
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SAM9X60T-V/DWB
Microchip Technology
SAM9X60T-V/DWB by Microchip Technology is a 32-bit microprocessor with integrated cache and 32-bit external data bus width. It operates at a max clock frequency of 48 MHz, suitable for industrial applications requiring low power mode and high-speed processing. With 16 DMA channels, this RISC-based processor offers efficient data transfer capabilities in a compact square package shape.
R7S721020VLFP#AA1
Renesas Electronics
Renesas Electronics R7S721020VLFP#AA1 microprocessor features 32-bit external data bus, 8KB integrated cache, and 26-bit address bus width. Ideal for low power applications with a max clock frequency of 13.33 MHz. Suitable for use in embedded systems requiring high-speed processing and low power consumption.
MC7448TVU1267ND
Freescale Semiconductor
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE; Boundary Scan: YES;
MIMXRT1175AVM8A
NXP Semiconductors
The NXP MIMXRT1175AVM8A microprocessor features integrated cache, 32 DMA channels, and a max clock frequency of 48 MHz. Ideal for automotive applications, it operates in a temperature range from -40 to 125°C with low power mode support.
MPC7410HX500LE
Motorola
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE; Bit Size: 32;
MCF53721CVM240
NXP Semiconductors' MCF53721CVM240 microprocessor features 32-bit architecture, 80 MHz clock frequency, and integrated cache. Ideal for industrial applications requiring low power consumption and high-speed processing in a compact square package with 196 terminals.
MCF54452VR266
MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE;
AT91SAM9G35-CU-999
AT91SAM9G35-CU-999 by Microchip Technology is a 32-bit microprocessor with integrated cache and 26-bit address bus width. It operates at a max clock frequency of 50 MHz, suitable for industrial applications requiring low power mode and boundary scan capability. With a package style of grid array and terminal pitch of 0.8 mm, it offers high performance in a compact form factor.
MIMXRT1176AVM8A
NXP's MIMXRT1176AVM8A microprocessor features integrated cache, 48 MHz clock frequency, and 32 DMA channels. Ideal for automotive applications, it operates b/w -40 to 125 °C with low power mode and floating-point format support.
MCF5275LCVM166
NXP Semiconductors' MCF5275LCVM166 microprocessor features 32-bit architecture, 83 MHz clock frequency, and integrated cache. Ideal for industrial applications requiring low power mode, with a temperature range of -40 to 85 °C. This microprocessor is designed for high-speed data processing in compact devices.
SPC5200CVR400BR2
MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 272; Package Code: BGA; Package Shape: SQUARE;
ADSP-21489KSWZ-3A
Analog Devices
Analog Devices' ADSP-21489KSWZ-3A microprocessor features 40-bit size, 24-bit address bus width, and 163840 RAM words. Ideal for applications requiring a max clock frequency of 25 MHz, such as embedded systems and signal processing tasks. With a terminal pitch of 0.5 mm and GULL WING form factor, it offers efficient performance in compact designs.
MCF5329CVM240J
MCF5329CVM240J by Freescale Semiconductor is a 32-bit microprocessor with power supplies of 1.5V, 1.8/3.3V and a speed of 240rpm. It features a grid array package style with 256 terminals in a square shape, suitable for industrial applications requiring high processing capabilities and reliability at temperatures ranging from -40 to 85°C.
AM3354BZCZA80R
Texas Instruments
AM3354BZCZA80R by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 26 MHz clock frequency, and 64 DMA channels. It is used in applications requiring low power mode, such as embedded systems and IoT devices. With a package size of 15mm x 15mm and a max supply current of 400mA, it offers high performance in a compact form factor.
Z0840006PSC
IXYS Corporation
Z0840006PSC by IXYS Corporation is an 8-bit microprocessor with a power supply of 5V and 40 terminals. It operates b/w temperatures of 0 to 70°C, making it suitable for commercial applications. This MOS technology-based processor has a speed of 6 rpm and a max supply current of 200mA, ideal for various embedded systems.
P3041NSN7PNC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: BGA; Package Shape: SQUARE; Low Power Mode: YES;
MIMXRT106SCVL5B
MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
MCF5327CVM240
The NXP Semiconductors MCF5327CVM240 is a 32-bit microprocessor with integrated cache and a max clock frequency of 80 MHz. It is commonly used in industrial applications due to its low power mode and temperature grade of INDUSTRIAL.
STM32MP153DAB1
STMicroelectronics
MICROPROCESSOR, RISC;
AM3358BZCZA80
AM3358BZCZA80 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words and 64 DMA channels. It operates at a max clock frequency of 26 MHz, suitable for industrial applications requiring low power mode and boundary scan capability. The package style is grid array, making it ideal for compact designs with a terminal pitch of 0.8 mm.
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P1010NXE5KHB
The NXP Semiconductors P1010NXE5KHB microprocessor features a 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates at temperatures ranging from -40 to 105°C with a max supply voltage of 1.05V.
P1010NXE5HHB
MICROPROCESSOR, RISC; No. of Terminals: 425; Package Body Material: PLASTIC/EPOXY; Terminal Finish: TIN SILVER; Package Equivalence Code: BGA425,23X23,32; Technology: CMOS;
The NXP Semiconductors P1010NXE5HHB microprocessor features 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications with a temperature range of -40 to 105°C, it offers high performance in a compact square package with 425 terminals.
P1010NXE5HFB
The NXP Semiconductors P1010NXE5HFB microprocessor features a 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates b/w -40 to 105°C with a max supply voltage of 1.05V. This CMOS technology-based processor is designed for high-speed performance in various embedded systems.
P1010NXE5HFA
P1010NXE5HFA by NXP Semiconductors is a microprocessor with integrated cache and a max supply voltage of 1.05V. It has a package shape of square, with 425 terminals and a min operating temperature of -40°C. This processor is suitable for industrial applications requiring high-speed processing capabilities.
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE; Terminal Pitch: .8 mm;
P1010NXE5KHA
P1010NXE5KHA by NXP Semiconductors is a microprocessor with integrated cache and surface mount capability. It has a max supply voltage of 1.05V and an address bus width of 16. This processor is commonly used in industrial applications due to its temperature grade and moisture sensitivity level.
MICROPROCESSOR, RISC; No. of Terminals: 425; Package Body Material: PLASTIC/EPOXY; Package Equivalence Code: BGA425,23X23,32; Peak Reflow Temperature (C): 260; Technology: CMOS;
P1010NXE5HHA
The NXP Semiconductors P1010NXE5HHA microprocessor features a 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates at temperatures ranging from -40 to 105°C with a max supply voltage of 1.05V. This microprocessor is designed in a square package style with 425 terminals for surface mount assembly.
MICROPROCESSOR, RISC; No. of Terminals: 425; Power Supplies (V): 1; Bit Size: 32; Speed: 800 rpm; Technology: CMOS;
P1010NXE5FFA
MICROPROCESSOR, RISC; No. of Terminals: 425; Maximum Time At Peak Reflow Temperature (s): 40; Package Body Material: PLASTIC/EPOXY; Peak Reflow Temperature (C): 260; Qualification: Not Qualified;
The NXP Semiconductors P1010NXE5FFA microprocessor features integrated cache, 32-bit external data bus width, and 16-bit address bus width. Ideal for industrial applications requiring a high-speed RISC microprocessor with boundary scan capability.
P1010NXE5DFA
The NXP Semiconductors P1010NXE5DFA microprocessor features a 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates at speeds up to 533 rpm with a temperature range of -40 to 105°C. The package style is grid array with fine pitch terminals.
MICROPROCESSOR, RISC; No. of Terminals: 425; Power Supplies (V): 1; Nominal Supply Voltage: 1 V; Maximum Time At Peak Reflow Temperature (s): 40; Bit Size: 32;
P1010NXE5FFB
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE;
P1010NXE5DFB
NXP Semiconductors P1010NXE5DFB microprocessor features 32-bit external data bus, 16-bit address bus, and integrated cache. Ideal for industrial applications with a temperature range of -40 to 105°C, it offers high performance in a compact square package with 425 terminals.
MICROPROCESSOR, RISC; No. of Terminals: 425; Technology: CMOS; Surface Mount: YES; Moisture Sensitivity Level (MSL): 3; Bit Size: 32;
P1014NXE5HFB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE; Maximum Clock Frequency: 100 MHz;
P1014NXE5HFB by NXP Semiconductors is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 100 MHz. This processor features low power mode and boundary scan capabilities, making it ideal for applications requiring high-speed processing in compact devices. With a package style of grid array and fine pitch, this chip offers advanced performance in a small form factor.
P1011NSN2FFB
MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 689; Package Code: HBGA; Package Shape: SQUARE;
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