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AM3359ZCZD72

Texas Instruments

AM3359ZCZD72 by Texas Instruments

AM3359ZCZD72 by Texas Instruments is a 32-bit microprocessor with integrated cache and 16-bit external data bus. It operates at a max clock frequency of 26 MHz and has low power mode, making it suitable for applications requiring high-speed processing in compact devices. The package style is grid array, low profile, fine pitch with terminal finish of tin silver copper.

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Vyrian

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Digiode

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Classic Components Corporation

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Nova Conductors

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Cyclops Electronics Ltd

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Prism Electronics

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Ampacity Inc.

Singapore . 1,541 parts In-Stock

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AZTECH Wire

Italy . 867 parts In-Stock

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Parana Technologies

USA . 2,168 parts In-Stock

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DigiPath Technology Company

USA . 1,317 parts In-Stock

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ChromeModa Solutions

Germany . 3,580 parts In-Stock

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IDEA Electronic Components Group

UK . 1,877 parts In-Stock

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One Stop Electronics

USA . 313 parts In-Stock

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A-Z Elektronik GmbH

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Alle Elektronik GmbH

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Corphita

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Continental Prestige Electronics

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Argo Parts USA

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Perfect Parts

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Bastille Electronics

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Microchip USA

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Kepictronics

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Overview

Experience unprecedented performance and efficiency with the Texas Instruments AM3359ZCZD72 microprocessor. Crafted with precision using top-quality materials, this device boasts integrated cache and a wide address bus width, ensuring seamless operation in various applications. From high-speed data processing to low power mode capabilities, this product delivers unmatched value and benefits to customers looking for reliable performance. Trust in Texas Instruments' expertise in microprocessors and elevate your projects to new heights with the AM3359ZCZD72.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body makes the microprocessor lightweight and durable, ideal for various applications.

Integrated Cache: YES

Having an integrated cache improves the processing speed and efficiency of the microprocessor, making it a good choice for high-performance tasks.

Maximum Supply Voltage: 1.326 V

The high maximum supply voltage allows for reliable performance and stable operation of the microprocessor under varying load conditions.

Address Bus Width: 28

With a wide address bus width of 28, this microprocessor can handle a large amount of memory address space efficiently, enhancing its processing capabilities.

Package Shape: SQUARE

The square package shape is space-efficient and allows for easy integration into electronic devices, making it a versatile choice for compact designs.

Bit Size: 32

A 32-bit architecture enables the microprocessor to process data in larger chunks, improving performance and handling complex computations effectively.

Power Supplies (V): 0.95/1.1,0.95/1.26

The dual power supply option provides flexibility in voltage selection, allowing the microprocessor to operate in a wide range of power environments.

No. of Terminals: 324

The high number of terminals offers enhanced connectivity options and signal paths, contributing to the overall functionality and performance of the microprocessor.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style enables easy mounting and installation of the microprocessor on circuit boards, facilitating assembly and reducing space constraints.

Minimum Supply Voltage: 1.21 V

The low minimum supply voltage ensures energy efficiency and power savings, making the microprocessor suitable for battery-operated devices and low-power applications.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides a reliable and durable connection, enhancing the longevity and performance of the microprocessor in various operating conditions.

Terminal Position: BOTTOM

Having terminals positioned at the bottom simplifies the installation process and reduces the risk of signal interference, ensuring smooth operation and efficient transmission of data.

Maximum Seated Height: 1.4 mm

The low maximum seated height allows for a compact design and efficient heat dissipation, making the microprocessor suitable for space-constrained applications and thermal management.

Width: 15 mm

The compact width of 15mm enables easy integration of the microprocessor into various electronic devices, offering flexibility in design and enhancing the overall functionality.

Boundary Scan: YES

The boundary scan feature allows for testing and debugging of the microprocessor's connectivity and functionality, ensuring high reliability and performance in complex systems.

External Data Bus Width: 16

With a wide external data bus width of 16, the microprocessor can efficiently transfer data between external devices, improving data processing speed and overall performance.

Maximum Clock Frequency: 26 MHz

The high maximum clock frequency of 26 MHz enables fast data processing and system operation, making the microprocessor suitable for demanding real-time applications and high-speed computing tasks.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand peak reflow temperatures for up to 30 seconds ensures the reliability and durability of the microprocessor during manufacturing processes and soldering operations.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C enables the microprocessor to withstand extreme heat conditions, ensuring robust performance and longevity in harsh operating environments.

Length: 15 mm

The compact length of 15mm allows for easy integration of the microprocessor into various electronic devices, contributing to a space-saving design and efficient utilization of available space.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a microprocessor with RISC architecture, this product offers enhanced performance, reduced complexity, and efficient execution of instructions, making it a reliable choice for high-speed computing tasks.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption, high noise immunity, and reliable operation of the microprocessor, making it energy-efficient and suitable for battery-operated devices.

Terminal Form: BALL

The ball terminal form offers reliable connections and efficient heat dissipation, ensuring stable performance and durability of the microprocessor under varying operating conditions.

Nominal Supply Voltage: 1.26 V

The nominal supply voltage of 1.26V provides a stable operating voltage for the microprocessor, ensuring consistent performance and reliable operation in a wide range of applications.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8mm allows for high-density mounting and efficient signal transmission, making the microprocessor suitable for compact electronic devices and space-constrained designs.

Format: FIXED POINT

The fixed-point format simplifies arithmetic operations and numeric calculations, improving the efficiency and accuracy of data processing in the microprocessor, making it a reliable choice for computational tasks.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 ensures the microprocessor's reliability and performance in humid environments, making it suitable for applications where moisture resistance is essential.

Speed: 720 rpm

With a speed of 720 rpm, the microprocessor offers fast data processing and efficient operation, making it suitable for high-performance computing tasks and real-time applications.

Low Power Mode: YES

The low power mode capability allows the microprocessor to conserve energy and extend battery life, making it an ideal choice for portable devices and applications requiring efficient power management.

Technical Specifications

Microprocessors AM3359ZCZD72 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

324

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.95/1.1,0.95/1.26

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Speed:

720 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.326 V

Minimum Supply Voltage:

1.21 V

Nominal Supply Voltage:

1.26 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

AM3359ZCZD72 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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