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MPC8347ECZQAGDB

NXP Semiconductors

MPC8347ECZQAGDB by NXP Semiconductors

The NXP Semiconductors MPC8347ECZQAGDB microprocessor features a 32-bit address and external data bus width, with a max clock frequency of 66 MHz. It is designed for industrial applications requiring low power mode, integrated cache, and boundary scan capabilities.

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MPC8347ECZQAGDB by NXP Semiconductors
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DigiKey

USA . 135 parts In-Stock

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Flip Electronics (Authorized)

USA . 135 parts In-Stock

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Anansix

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Digiode

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Nova Conductors

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One Stop Electronics

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Overview

Unleash the power of cutting-edge technology with the MPC8347ECZQAGDB by NXP Semiconductors. As a leader in semiconductor innovation, NXP delivers unmatched quality and reliability in their microprocessors. Ideal for a wide range of applications, this product offers unparalleled value, benefits, and advantages to customers looking to elevate their projects to the next level. Experience seamless performance and efficiency like never before with the MPC8347ECZQAGDB.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and thermal resistance for the microprocessor.

Integrated Cache: YES

Having integrated cache improves the processing speed and efficiency of the microprocessor.

Surface Mount: YES

Surface mount capability makes it easier to integrate the microprocessor onto circuit boards.

Maximum Supply Voltage: 1.26 V

Operating within a maximum supply voltage of 1.26V ensures safe and efficient performance.

Address Bus Width: 32

A wider address bus width of 32 allows for efficient data transfer and processing.

Package Shape: SQUARE

Square package shape helps in easy mounting and alignment on circuit boards.

Power Supplies (V): 1.2,2.5,3.3

Having multiple power supply options of 1.2V, 2.5V, and 3.3V gives flexibility in different operating scenarios.

No. of Terminals: 620

Having 620 terminals allows for multiple connections and interfaces for hardware integration.

Package Style (Meter): GRID ARRAY

Grid array package style provides a robust and secure mounting solution for the microprocessor.

Minimum Supply Voltage: 1.14 V

Operating within a minimum supply voltage of 1.14V ensures stable performance even under low power conditions.

Maximum Operating Temperature: 105 °C

High maximum operating temperature of 105°C allows for reliable performance in various environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C ensures the microprocessor can function even in extreme cold conditions.

Terminal Finish: TIN LEAD SILVER

Tin, lead, silver terminal finish provides good conductivity and corrosion resistance for the microprocessor terminals.

Terminal Position: BOTTOM

Bottom terminal position allows for easy soldering and mounting on circuit boards.

Maximum Seated Height: 2.46 mm

Having a maximum seated height of 2.46mm ensures compatibility with different board designs and layouts.

Width: 29 mm

With a width of 29mm, the microprocessor can fit into compact spaces without compromising on performance.

Boundary Scan: YES

Boundary scan feature allows for efficient testing and debugging of the microprocessor during development and manufacturing.

External Data Bus Width: 32

Having an external data bus width of 32 enables fast data transfer between the microprocessor and external devices.

Maximum Clock Frequency: 66 MHz

A maximum clock frequency of 66MHz ensures high-speed processing and execution of instructions.

Maximum Time At Peak Reflow Temperature (s): 40

Being able to withstand a peak reflow temperature for 40 seconds ensures proper soldering and assembly during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C allows for reliable solder connections and durability.

Length: 29 mm

With a length of 29mm, the microprocessor can fit into various board layouts and configurations.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the microprocessor can operate reliably in harsh industrial environments.

Peripheral IC Type: MICROPROCESSOR

Designed specifically as a microprocessor, providing optimized performance for various computing applications.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliability for the microprocessor.

Terminal Form: BALL

Ball terminal form allows for secure and reliable connections with other components on the circuit board.

Nominal Supply Voltage: 1.2 V

Having a nominal supply voltage of 1.2V ensures consistent and stable operation of the microprocessor.

Terminal Pitch: 1 mm

With a terminal pitch of 1mm, the microprocessor can be easily integrated and soldered onto standard circuit boards.

Format: FLOATING POINT

Floating-point format allows for efficient and accurate mathematical calculations on the microprocessor.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the microprocessor can withstand moderate exposure to moisture during storage and handling.

Speed: 400 rpm

Operating at a speed of 400 revolutions per minute ensures fast data processing and execution on the microprocessor.

Low Power Mode: YES

Having a low power mode allows the microprocessor to operate efficiently and conserve energy when not in full use.

Technical Specifications

Microprocessors MPC8347ECZQAGDB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Additional Features:

ALSO REQUIRES 2.5V AND 3.3V SUPPLY

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

66 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B620

JESD-609 Code:

e0

Length:

29 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

620

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA620,28X28,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,2.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.46 mm

Speed:

400 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

29 mm

Peripheral IC Type:

Trade Compliance

MPC8347ECZQAGDB Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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