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STM32MP157DAA1

STMicroelectronics

STM32MP157DAA1 by STMicroelectronics

STM32MP157DAA1 by STMicroelectronics is a 32-bit microprocessor with 64 MHz clock frequency, 448 terminals, and 724992 RAM words. Ideal for industrial applications, it features low power mode, boundary scan support, and 48 DMA channels for efficient data transfer.

Median Price

$16.950

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 263 parts In-Stock

1+ parts

$16.950

100+ parts

$11.727

1k+ parts

$10.890

10k+ parts

-

263

$16.950

$11.727

$10.890

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Mouser Electronics

USA . 204 parts In-Stock

1+ parts

$16.950

100+ parts

$11.360

1k+ parts

$10.890

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204

$16.950

$11.360

$10.890

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Avnet

USA . 252 parts In-Stock

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252

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EBV Elektronik

Germany . 252 parts In-Stock

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252

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Distributors (In-Stock)

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Digiode

USA . 4,102 parts In-Stock

1+ parts

$9.642

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-

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4,102

$9.642

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Nova Conductors

Japan . 450 parts In-Stock

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$21.459

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-

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450

$21.459

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Vyrian

USA . 3,116 parts In-Stock

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3,116

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Anansix

USA . 1,129 parts In-Stock

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IBS Electronics

USA . 420 parts In-Stock

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-

100+ parts

$13.198

1k+ parts

$13.001

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420

-

$13.198

$13.001

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 269 parts In-Stock

1+ parts

$8.070

100+ parts

-

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-

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269

$8.070

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Semicontronic

India . 147 parts In-Stock

1+ parts

$8.070

100+ parts

$7.868

1k+ parts

$7.828

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-

147

$8.070

$7.868

$7.828

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Corphita

USA . 3,020 parts In-Stock

1+ parts

$9.135

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3,020

$9.135

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AZTECH Wire

Italy . 349 parts In-Stock

1+ parts

$13.066

100+ parts

-

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349

$13.066

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Vigor

Singapore . 1,115 parts In-Stock

1+ parts

$17.130

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1,115

$17.130

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Continental Prestige Electronics

USA . 4,894 parts In-Stock

1+ parts

$21.459

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$21.030

4,894

$21.459

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$21.030

Netroflash

USA . 100 parts In-Stock

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$21.459

100+ parts

$21.030

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100

$21.459

$21.030

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Aztec Data Supply Inc.

USA . 301 parts In-Stock

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$50.630

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301

$50.630

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Corohmni

South Africa . 178 parts In-Stock

1+ parts

$53.957

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178

$53.957

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IDEA Electronic Components Group

UK . 1,195 parts In-Stock

1+ parts

$71.642

100+ parts

-

1k+ parts

$64.478

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1,195

$71.642

-

$64.478

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MKK Technologies

India . 1,992 parts In-Stock

1+ parts

$134.719

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-

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1,992

$134.719

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DigiPath Technology Company

USA . 1,992 parts In-Stock

1+ parts

$134.719

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1,992

$134.719

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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Lixinc

USA . 1,902 parts In-Stock

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1,902

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GreenTree Electronics

Israel . 420 parts In-Stock

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420

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Parana Technologies

USA . 222 parts In-Stock

1+ parts

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$85.659

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222

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$85.659

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Argo Parts USA

USA . 125 parts In-Stock

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Eastek

USA . 84 parts In-Stock

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84

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Overview

Experience the power and efficiency of the STM32MP157DAA1 microprocessor by STMicroelectronics. With a focus on quality and innovation, STMicroelectronics delivers cutting-edge technology for a wide range of applications. This reliable and versatile microprocessor offers customers exceptional value with its integrated cache, low power mode, and high clock frequency capabilities. Whether you're working on industrial automation, IoT devices, or consumer electronics, the STM32MP157DAA1 provides the performance and reliability you need to bring your projects to life. Trust STMicroelectronics to deliver top-notch solutions that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material provides durability and protection to the microprocessor, making it suitable for a wide range of applications.

Integrated Cache: YES

Integrated cache helps improve the performance of the microprocessor by reducing the access time to frequently used data and instructions.

Maximum Supply Voltage: 1.25 V

Operating at a maximum supply voltage of 1.25V ensures efficient power consumption and prevents potential damage from overvoltage.

On Chip Data RAM Width: 8

Having a wider on-chip data RAM width of 8 improves data processing speed and efficiency.

Address Bus Width: 26

With a wider address bus width of 26, the microprocessor can handle larger memory capacities and address more data.

Package Shape: SQUARE

The square package shape allows for easy and compact integration into various electronic devices and systems.

Bit Size: 32

A 32-bit microprocessor provides enhanced performance and compatibility with 32-bit software applications.

No. of Terminals: 448

Having a higher number of terminals allows for more connectivity options and facilitates complex system integrations.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact design and high density mounting, making it ideal for space-constrained applications.

Minimum Supply Voltage: 0.85 V

Operating at a minimum supply voltage of 0.85V ensures low power consumption and efficiency during operation.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, the microprocessor can withstand high heat environments and extended usage.

Minimum Operating Temperature: -20 °C

Operating at a minimum temperature of -20°C ensures reliable performance even in cold environments.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and secure connectivity in circuit board assembly.

Maximum Seated Height: 1.32 mm

The low maximum seated height of 1.32mm enables slim and compact device designs.

RAM Words: 724992

With a large number of RAM words, the microprocessor can handle extensive data processing tasks efficiently.

Width: 18 mm

Compact width of 18mm allows for easy integration into various electronic devices and systems.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging of the microprocessor during development and production.

Maximum Clock Frequency: 64 MHz

A high maximum clock frequency of 64MHz ensures fast data processing and execution of instructions.

Length: 18 mm

Compact length of 18mm facilitates easy placement and mounting of the microprocessor in electronic devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments with varying temperature conditions.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor allows for efficient and simplified instruction execution, leading to improved performance.

Technology: CMOS

CMOS technology provides low power consumption, high speed, and reliability, making it suitable for a wide range of applications.

Terminal Form: BALL

Ball terminal form enables reliable and secure connections in surface mount applications.

Maximum Supply Current: 865 mA

Operating at a maximum supply current of 865mA ensures efficient power usage and prevents overheating.

Nominal Supply Voltage: 0.9 V

Operating at a nominal supply voltage of 0.9V provides optimal performance and power efficiency.

No. of DMA Channels: 48

Having 48 DMA channels enables efficient data transfer and processing between peripherals and memory.

Terminal Pitch: 0.8 mm

Compact terminal pitch of 0.8mm allows for high density mounting and space-saving design.

Format: FLOATING POINT

Supporting floating point format allows for efficient and accurate computation of decimal numbers, enhancing overall performance.

Speed: 800 rpm

High speed of 800rpm ensures fast data processing and execution, making the microprocessor suitable for demanding applications.

Low Power Mode: YES

Having a low power mode option allows for energy-efficient operation and longer battery life in portable devices.

Technical Specifications

Microprocessors STM32MP157DAA1 attributes and parameters. Explore more Microprocessors devices from STMicroelectronics

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

64 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B448

Length:

18 mm

Low Power Mode:

YES

No. of DMA Channels:

48

No. of Terminals:

448

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA448,22X22,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

RAM Words:

724992

Maximum Seated Height:

1.32 mm

Speed:

800 rpm

Maximum Supply Current:

865 mA

Maximum Supply Voltage:

1.25 V

Minimum Supply Voltage:

.85 V

Nominal Supply Voltage:

.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

18 mm

Peripheral IC Type:

Trade Compliance

STM32MP157DAA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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