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AM3352BZCED30

Texas Instruments

AM3352BZCED30 by Texas Instruments

AM3352BZCED30 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 64 DMA channels, and 26 MHz clock frequency. Ideal for industrial applications requiring low power mode, it features a max supply voltage of 1.144 V and operates in temperatures ranging from -40 to 90°C.

Median Price

$8.558

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,854 parts In-Stock

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$9.050

100+ parts

$7.905

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$5.452

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1,854

$9.050

$7.905

$5.452

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Chip1Stop

Japan . 160 parts In-Stock

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$8.066

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160

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$8.066

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Distributors (In-Stock)

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Digiode

USA . 1,515 parts In-Stock

1+ parts

$8.598

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1,515

$8.598

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Nova Conductors

Japan . 18 parts In-Stock

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$10.660

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18

$10.660

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Vyrian

USA . 8,487 parts In-Stock

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VNN

France . 3,651 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 923 parts In-Stock

1+ parts

$6.860

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923

$6.860

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Semicontronic

India . 832 parts In-Stock

1+ parts

$6.860

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$6.688

1k+ parts

$6.654

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832

$6.860

$6.688

$6.654

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Corphita

USA . 954 parts In-Stock

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$8.145

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954

$8.145

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Aranea Global

USA . 100 parts In-Stock

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$10.447

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$10.029

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100

$10.447

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$10.029

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Continental Prestige Electronics

USA . 6,770 parts In-Stock

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$10.660

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$10.447

6,770

$10.660

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$10.447

AZTECH Wire

Italy . 393 parts In-Stock

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$15.280

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$15.280

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Corohmni

South Africa . 538 parts In-Stock

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$23.934

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538

$23.934

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$46.228

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$43.917

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$43.917

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500

$46.228

$43.917

$43.917

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Parana Technologies

USA . 1,403 parts In-Stock

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$49.321

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$49.321

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IDEA Electronic Components Group

UK . 1,858 parts In-Stock

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$55.417

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$52.646

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$49.875

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1,858

$55.417

$52.646

$49.875

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ChromeModa Solutions

Germany . 490 parts In-Stock

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$55.417

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$45.442

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490

$55.417

$45.442

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A-Z Elektronik GmbH

Germany . 7,244 parts In-Stock

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Lixinc

USA . 5,281 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,829 parts In-Stock

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Authorized Procurement Solutions

USA . 2,700 parts In-Stock

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2,700

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DigiPath Technology Company

USA . 1,426 parts In-Stock

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$49.964

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Argo Parts USA

USA . 939 parts In-Stock

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Kepictronics

USA . 374 parts In-Stock

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Futuretech Components

Singapore . 300 parts In-Stock

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Overview

Experience the top-notch performance and reliability of Texas Instruments with the AM3352BZCED30 microprocessor. This cutting-edge technology offers seamless integration, fast processing speeds, and low power consumption, making it ideal for a wide range of applications in the industrial sector. Trust in the quality and innovation that Texas Instruments is known for, and unlock new possibilities with the AM3352BZCED30 microprocessor. Elevate your projects with this advanced solution today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product suitable for a wide range of applications.

Integrated Cache: YES

The integrated cache improves the processing speed and efficiency of the microprocessor, enhancing overall performance.

Maximum Supply Voltage: 1.144 V

The low maximum supply voltage helps in reducing power consumption and heat generation, resulting in energy efficiency.

Address Bus Width: 28

With a wider address bus width, the microprocessor can access a larger memory space, enabling it to handle more complex tasks and data.

Bit Size: 32

A 32-bit architecture allows the microprocessor to process data in larger chunks, improving efficiency and speed of operations.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature ensures the reliability and stability of the microprocessor even in harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microprocessor suitable for mobile and battery-powered devices.

Technical Specifications

Microprocessors AM3352BZCED30 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT MIN 0.912 V

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B298

JESD-609 Code:

e1

Length:

13 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

64

No. of Terminals:

298

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA298,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.95/1.1

Qualification:

Not Qualified

RAM Words:

131072

Maximum Seated Height:

1.3 mm

Speed:

300 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

1.144 V

Minimum Supply Voltage:

1.056 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

AM3352BZCED30 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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