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AM3352BZCZ80

Texas Instruments

AM3352BZCZ80 by Texas Instruments

AM3352BZCZ80 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 26 MHz clock frequency, and 64 DMA channels. It is used in applications requiring low power mode, such as embedded systems and IoT devices.

Median Price

$15.070

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 13,800 parts In-Stock

1+ parts

$10.896

100+ parts

$9.518

1k+ parts

$6.564

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13,800

$10.896

$9.518

$6.564

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Mouser Electronics

USA . 168 parts In-Stock

1+ parts

$15.070

100+ parts

$9.700

1k+ parts

$9.130

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168

$15.070

$9.700

$9.130

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DigiKey

USA . 106 parts In-Stock

1+ parts

$15.070

100+ parts

$11.131

1k+ parts

$9.601

10k+ parts

$9.397

106

$15.070

$11.131

$9.601

$9.397

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,470 parts In-Stock

1+ parts

$10.351

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-

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3,470

$10.351

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Nova Conductors

Japan . 100 parts In-Stock

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$11.421

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100

$11.421

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Chip Stock

USA . 6,500 parts In-Stock

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6,500

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Vyrian

USA . 4,809 parts In-Stock

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Cyclops Electronics Ltd

UK . 3,859 parts In-Stock

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3,859

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VNN

France . 2,558 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 4,462 parts In-Stock

1+ parts

$9.260

100+ parts

$9.028

1k+ parts

$8.982

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4,462

$9.260

$9.028

$8.982

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Ampacity Inc.

Singapore . 4,389 parts In-Stock

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$9.260

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4,389

$9.260

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Corphita

USA . 4,516 parts In-Stock

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$9.806

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4,516

$9.806

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Continental Prestige Electronics

USA . 6,218 parts In-Stock

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$10.470

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$10.260

6,218

$10.470

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$10.260

Netroflash

USA . 100 parts In-Stock

1+ parts

$11.421

100+ parts

$11.193

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-

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100

$11.421

$11.193

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Parana Technologies

USA . 2,027 parts In-Stock

1+ parts

$38.951

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2,027

$38.951

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Microchip USA

USA . 1,452 parts In-Stock

1+ parts

$40.520

100+ parts

$39.940

1k+ parts

$39.650

10k+ parts

$39.360

1,452

$40.520

$39.940

$39.650

$39.360

ChromeModa Solutions

Germany . 3,391 parts In-Stock

1+ parts

$43.765

100+ parts

$35.887

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3,391

$43.765

$35.887

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IDEA Electronic Components Group

UK . 1,644 parts In-Stock

1+ parts

$43.765

100+ parts

$41.577

1k+ parts

$39.388

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1,644

$43.765

$41.577

$39.388

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Corohmni

South Africa . 499 parts In-Stock

1+ parts

$44.371

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499

$44.371

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$76.996

100+ parts

$73.146

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$73.146

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2,500

$76.996

$73.146

$73.146

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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Lixinc

USA . 12,396 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,371 parts In-Stock

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Argo Parts USA

USA . 4,443 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,247 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Kepictronics

USA . 3,000 parts In-Stock

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Perfect Parts

USA . 2,738 parts In-Stock

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2,738

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DigiPath Technology Company

USA . 1,866 parts In-Stock

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$39.459

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$39.459

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iodParts Technologies Inc.

India . 1,147 parts In-Stock

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Assy Fe

Spain . 882 parts In-Stock

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Robosynatics

Brazil . 100 parts In-Stock

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Lucentia Tech

USA . 100 parts In-Stock

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$0.265

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$0.265

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$0.265

100

-

$0.265

$0.265

$0.265

Overview

Upgrade your electronics with the AM3352BZCZ80 by Texas Instruments, a cutting-edge microprocessor designed for optimal performance. With an integrated cache and boundary scan technology, this processor offers lightning-fast speeds and efficient data processing. Manufactured by Texas Instruments, a renowned leader in semiconductor technology, you can trust in the quality and reliability of this product. Perfect for a wide range of applications, from industrial automation to consumer electronics, the AM3352BZCZ80 provides unmatched value and benefits to customers seeking top-notch performance in their devices. Experience the power of Texas Instruments with the AM3352BZCZ80 microprocessor today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microprocessor easy to handle and long-lasting.

Integrated Cache: YES

Having integrated cache helps improve the performance of the microprocessor by reducing memory access latency.

Maximum Supply Voltage: 1.326 V

The higher maximum supply voltage allows for better power efficiency and performance capabilities.

On Chip Data RAM Width: 8

A wider data RAM width allows for faster data processing and storage on the chip.

Address Bus Width: 28

A wider address bus width enables the microprocessor to access and communicate with larger areas of memory.

Package Shape: SQUARE

The square shape of the package provides efficient use of space and can fit neatly into various electronic devices.

Bit Size: 32

A 32-bit architecture allows for faster data processing and improved overall performance.

Power Supplies (V): 0.95/1.1

The range of power supplies allows for flexibility in different operating conditions and power requirements.

No. of Terminals: 324

Having a high number of terminals enables the microprocessor to connect with various components and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact design with efficient heat dissipation and easy installation.

Minimum Supply Voltage: 1.21 V

The minimum supply voltage ensures stable and reliable operation even under low power conditions.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature allows the microprocessor to withstand elevated heat levels without performance degradation.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that the microprocessor can function in cold environments without issues.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides good conductivity and corrosion resistance for reliable connections.

RAM Words: 131072

With a large number of RAM words, the microprocessor can handle more data processing tasks efficiently.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC architecture microprocessor with peripheral IC type ensures optimized performance for specific applications.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation for energy-efficient performance.

Terminal Form: BALL

The ball terminal form provides secure connections and efficient heat dissipation for improved reliability.

Maximum Supply Current: 400 mA

The maximum supply current indicates the power consumption capability of the microprocessor and ensures stable operation.

Nominal Supply Voltage: 1.26 V

The nominal supply voltage provides a standard operating voltage for consistent performance in various conditions.

No. of DMA Channels: 64

Having 64 DMA channels enables efficient data transfer and processing capabilities within the microprocessor.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for compact placement of terminals and efficient connectivity in a limited space.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the microprocessor can handle moderate exposure to moisture without damaging its performance.

Speed: 800 rpm

With a speed of 800 rpm, the microprocessor can process instructions and data at a rapid rate for efficient operation.

Low Power Mode: YES

The low power mode feature allows the microprocessor to reduce power consumption during idle or low-activity periods, improving overall energy efficiency.

Technical Specifications

Microprocessors AM3352BZCZ80 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

64

No. of Terminals:

324

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.95/1.1

Qualification:

Not Qualified

RAM Words:

131072

Maximum Seated Height:

1.4 mm

Speed:

800 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

1.326 V

Minimum Supply Voltage:

1.21 V

Nominal Supply Voltage:

1.26 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

AM3352BZCZ80 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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