Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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Intel NG80960JD3V66 microprocessor features 32-bit address and data bus width, clocked at 33.3 MHz with integrated cache. Suitable for low power applications, it operates at a speed of 66 rpm in fixed point format. With boundary scan support and RISC architecture, this CMOS chip is ideal for embedded systems requiring high performance within a compact footprint.
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This material is cost-effective and provides good protection for the microprocessor, making it a reliable choice for various applications.
Having integrated cache improves the processing speed and efficiency of the microprocessor, making it suitable for tasks that require quick data access.
The higher maximum supply voltage allows for flexibility in power supply options and can support higher performance levels when needed.
With a wider address bus width, this microprocessor can handle larger amounts of memory and data, making it suitable for more complex tasks.
The square package shape allows for easy integration into circuit boards and provides a compact form factor for space-constrained designs.
A 32-bit architecture provides a good balance between performance and cost, making this microprocessor suitable for a wide range of applications.
Having a sufficient number of terminals allows for seamless connectivity and integration with other components in a system, enhancing overall performance.
The flatpack package style is easy to handle and solder, making installation and maintenance of the microprocessor hassle-free.
The lower minimum supply voltage can help in reducing power consumption and heat generation, leading to better energy efficiency.
The quad terminal position allows for better heat dissipation and can help in improving the overall performance and reliability of the microprocessor.
Having boundary scan capability enables efficient testing and debugging of the microprocessor during manufacturing and maintenance processes.
With a wide external data bus width, this microprocessor can efficiently handle data transfer rates and communication with other devices.
The high maximum clock frequency allows for fast processing speeds, making this microprocessor suitable for real-time applications and high-performance tasks.
Being a RISC-based microprocessor, it offers efficient instruction execution and low power consumption, making it a good choice for embedded systems and IoT devices.
CMOS technology provides low power consumption, high speed, and reliability, making this microprocessor suitable for a wide range of applications.
The gull wing terminal form ensures secure and reliable connections, reducing the risk of signal interference or disconnections in the system.
The nominal supply voltage of 3.3 V is commonly used in many electronic devices, ensuring compatibility and ease of integration with existing systems.
Fixed-point format simplifies the arithmetic operations and data processing tasks, making this microprocessor suitable for applications that do not require high precision floating-point calculations.
With a speed of 66 rpm, this microprocessor can efficiently handle tasks that require quick data processing and response times, making it suitable for real-time applications.
The low power mode feature helps in reducing power consumption during idle or low-load periods, improving overall energy efficiency and prolonging battery life in portable devices.
Microprocessors NG80960JD3V66 attributes and parameters. Explore more Microprocessors devices from Intel
Address Bus Width:
Bit Size:
Boundary Scan:
Maximum Clock Frequency:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
Low Power Mode:
No. of Terminals:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Qualification:
Speed:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Terminal Form:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Peripheral IC Type:
NG80960JD3V66 Peripheral ICs trade compliance attributes, and parameters.
ECCN
3A991.A.2
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
M39029/56351
Esterline Technologies
CONNECTOR ACCESSORY; IEC Conformity: NO; Contact Gender: FEMALE; DIN Conformity: NO; MIL-Connector Accessory Name: CONTACT; Tool Settings: M22520/2-10;
M24308/2-1F
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mounting Option-1: HOLE .115-.125; Mounting Type: CABLE AND PANEL; Mating Contact Finish: NOT SPECIFIED;
LM358AN
NXP Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LM358N
Silicon Group
2N7002
Yangzhou Yangjie Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 1; Terminal Form: GULL WING; Maximum Drain Current (ID): .34 A;
2N2222A
Itt Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
ULN2803ADWR
Texas Instruments
ULN2803ADWR by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates b/w -40 to 85°C, has a max supply voltage of 3V, and is ideal for buffer or inverter-based applications requiring sink current flow direction.
SMBJ18CA
Brightking
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CMX
LM555CMX by Texas Instruments is an Analog Waveform Generation IC with 8 terminals. It operates at a nominal voltage of 5V and supports power supplies ranging from 5V to 15V. This versatile IC, housed in a small outline package, is commonly used for pulse and rectangular waveform generation in commercial temperature environments.
Silicon Standard
OHN3140U
Tt Electronics Plc
OHN3140U by Tt Electronics Plc is a magnetic field sensor with a max supply voltage of 24V and hysteresis of 2mT. It features an output range of 25mA and operates b/w -20 to 85°C. Ideal for applications requiring precise detection and measurement of magnetic fields in various industries.
Loras Industries
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM358D-T
LM358D-T by NXP Semiconductors is a dual operational amplifier with 70dB CMRR, 1000kHz unity gain bandwidth, and 9000uV max input offset voltage. Widely used in commercial applications due to its small outline package and low bias current of 0.5uA.
BAV99
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
KYOCERA AVX
1N4148WS
Tak Cheong Electronics Holdings
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CRGCQ0805F10R
TE Connectivity
TE Connectivity's CRGCQ0805F10R is a 10 ohm fixed resistor with 1% tolerance and 400 ppm/°C temperature coefficient. It is a surface mount thick film resistor in an 0805 package, suitable for applications requiring precise resistance values in compact electronic circuits.
ROHM
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .6 A;
Air Electro
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; MIL Conformity: YES; Additional Features: STANDARD: MIL-DTL-24308;
1N4148
International Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
ATSAMA5D33A-CUR
Microchip Technology
The Microchip Technology ATSAMA5D33A-CUR is a 32-bit microprocessor with integrated cache and a max clock frequency of 48 MHz. It is commonly used in industrial applications due to its low power mode, wide temperature range (-40 to 85 °C), and high number of DMA channels (39).
P2010NXE2MHC
The NXP Semiconductors P2010NXE2MHC microprocessor features a 32-bit architecture with 64-bit external data bus width, operating at a max clock frequency of 100 MHz. It is designed for low power mode applications and utilizes RISC technology, making it suitable for various embedded systems requiring high-speed processing capabilities.
MIMXRT1052DVL6BR
MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3;
MIMXRT1166XVM5A
MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
MCF5485CZP200
The NXP Semiconductors MCF5485CZP200 microprocessor features a 32-bit architecture, integrated cache, and operates at a max clock frequency of 66.67 MHz. Ideal for industrial applications requiring low power consumption, it has a terminal pitch of 1 mm and supports boundary scan technology.
Z84C0008PEG
IXYS Corporation
Z84C0008PEG by IXYS Corp is an 8-bit microprocessor with 16-bit address bus, operating at max 8 MHz clock frequency. Ideal for industrial applications, it has a supply voltage range of 4.5-5.5 V and operates in temperature range -40 to 100 °C.
MPC880ZP80
Motorola
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
FWIXP420BC
Intel
Intel FWIXP420BC is a 32-bit microprocessor with integrated cache, operating at 33.33 MHz. It features a grid array package style and CMOS technology, suitable for commercial-grade applications requiring high-speed processing within a temperature range of 0-70°C.
MIMXRT1061DVL6B
MICROCONTROLLER, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1; Peak Reflow Temperature (C): 260;
MPC5121YVY400B
NXP Semiconductors' MPC5121YVY400B microprocessor features 32-bit architecture, integrated cache, and operates at a speed of 400 rpm. Ideal for industrial applications, it has low power mode capability and supports boundary scan technology.
MCF54417CMJ250
NXP Semiconductors' MCF54417CMJ250 microprocessor features 32-bit architecture, integrated cache, and operates at a max clock frequency of 100 MHz. Ideal for industrial applications requiring low power consumption and high-speed processing in a compact square package with grid array style.
STM32MP153AAA3
STMicroelectronics
MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
MCF5484CVR200
NXP Semiconductors' MCF5484CVR200 microprocessor features 32-bit architecture, 66.67 MHz clock frequency, and integrated cache. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities. With a package style of grid array and terminal pitch of 1mm, it offers efficient performance in various embedded systems.
MCIMX6U8DVM10AB
Freescale Semiconductor
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 2240; Package Code: LFBGA; Package Shape: SQUARE; External Data Bus Width: 64;
MCF5307AI90B
MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
MC68010R10
MC68010R10 by Motorola is a 32-bit microprocessor with 23-bit address bus width, 16-bit external data bus width, and max clock frequency of 10 MHz. It is used in commercial applications for fixed-point processing at up to 70°C temperature range.
AT91SAM9G45-CU-999
Microchip AT91SAM9G45-CU-999 is a 32-bit microprocessor with 8-bit RAM, 26-bit address bus, and 32-bit external data bus. It operates at up to 50 MHz clock frequency and features integrated cache for enhanced performance. Ideal for low power applications due to its min supply voltage of 0.9 V and max seated height of 1.2 mm.
PT-100
Sk Hynix
Microprocessors;
MCF54454CVR200
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE;
MCIMX6X1AVK08AB
MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1; Technology: CMOS; Terminal Finish: TIN SILVER COPPER;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
NG80960JA3V33
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: QFP; Package Shape: SQUARE; Minimum Supply Voltage: 3.15 V;
NG80960JS25
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: QFP; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
NG80960JT-75
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: BQFP; Package Shape: SQUARE; Format: FIXED POINT;
NG80960JA-16
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: BQFP; Package Shape: SQUARE; JESD-609 Code: e0;
NG80960JC-33
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: BQFP; Package Shape: SQUARE; Technology: CMOS;
NG80960JC-40
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: BQFP; Package Shape: SQUARE; Additional Features: OPERATING CASE TEMPERATURE 0 TO 100 C;
NG80960JD-33
NG80960JD-40
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: BQFP; Package Shape: SQUARE; Low Power Mode: YES;
NG80960JD-50
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: BQFP; Package Shape: SQUARE; Maximum Supply Current: 447 mA;
NG80960JD-66
NG80960JF-25
NG80960JF-33
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: BQFP; Package Shape: SQUARE; Address Bus Width: 32;
NG80960JS-16
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: BQFP; Package Shape: SQUARE; Maximum Supply Current: 120 mA;
NG80960JA3V25
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: QFP; Package Shape: SQUARE; Integrated Cache: YES;
NG80960JD3V40
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: QFP; Package Shape: SQUARE; Format: FIXED POINT;
NG80960JF3V25
NG80960JF3V33
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: QFP; Package Shape: SQUARE; Nominal Supply Voltage: 3.3 V;
NG80960JC50
NG80960JC66
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: QFP; Package Shape: SQUARE; Boundary Scan: YES;
NG80960JT100
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: QFP; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
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