Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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Intel NG80960JD3V66 microprocessor features 32-bit address and data bus width, clocked at 33.3 MHz with integrated cache. Suitable for low power applications, it operates at a speed of 66 rpm in fixed point format. With boundary scan support and RISC architecture, this CMOS chip is ideal for embedded systems requiring high performance within a compact footprint.
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This material is cost-effective and provides good protection for the microprocessor, making it a reliable choice for various applications.
Having integrated cache improves the processing speed and efficiency of the microprocessor, making it suitable for tasks that require quick data access.
The higher maximum supply voltage allows for flexibility in power supply options and can support higher performance levels when needed.
With a wider address bus width, this microprocessor can handle larger amounts of memory and data, making it suitable for more complex tasks.
The square package shape allows for easy integration into circuit boards and provides a compact form factor for space-constrained designs.
A 32-bit architecture provides a good balance between performance and cost, making this microprocessor suitable for a wide range of applications.
Having a sufficient number of terminals allows for seamless connectivity and integration with other components in a system, enhancing overall performance.
The flatpack package style is easy to handle and solder, making installation and maintenance of the microprocessor hassle-free.
The lower minimum supply voltage can help in reducing power consumption and heat generation, leading to better energy efficiency.
The quad terminal position allows for better heat dissipation and can help in improving the overall performance and reliability of the microprocessor.
Having boundary scan capability enables efficient testing and debugging of the microprocessor during manufacturing and maintenance processes.
With a wide external data bus width, this microprocessor can efficiently handle data transfer rates and communication with other devices.
The high maximum clock frequency allows for fast processing speeds, making this microprocessor suitable for real-time applications and high-performance tasks.
Being a RISC-based microprocessor, it offers efficient instruction execution and low power consumption, making it a good choice for embedded systems and IoT devices.
CMOS technology provides low power consumption, high speed, and reliability, making this microprocessor suitable for a wide range of applications.
The gull wing terminal form ensures secure and reliable connections, reducing the risk of signal interference or disconnections in the system.
The nominal supply voltage of 3.3 V is commonly used in many electronic devices, ensuring compatibility and ease of integration with existing systems.
Fixed-point format simplifies the arithmetic operations and data processing tasks, making this microprocessor suitable for applications that do not require high precision floating-point calculations.
With a speed of 66 rpm, this microprocessor can efficiently handle tasks that require quick data processing and response times, making it suitable for real-time applications.
The low power mode feature helps in reducing power consumption during idle or low-load periods, improving overall energy efficiency and prolonging battery life in portable devices.
Microprocessors NG80960JD3V66 attributes and parameters. Explore more Microprocessors devices from Intel
Address Bus Width:
Bit Size:
Boundary Scan:
Maximum Clock Frequency:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
Low Power Mode:
No. of Terminals:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Qualification:
Speed:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Terminal Form:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Peripheral IC Type:
NG80960JD3V66 Peripheral ICs trade compliance attributes, and parameters.
ECCN
3A991.A.2
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
1N4148
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Terminal Finish: MATTE TIN; Maximum Operating Temperature: 200 Cel; Maximum Output Current: .15 A; JESD-609 Code: e3;
2N7002
NXP Semiconductors
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; JESD-609 Code: e3; Minimum DS Breakdown Voltage: 60 V;
BAV99
Rfe International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
General Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JEDEC-95 Code: TO-236AB; Qualification: Not Qualified; Package Style (Meter): SMALL OUTLINE;
Onsemi
OPA2277UA/2K5E4
Texas Instruments
OPA2277UA/2K5E4 by Texas Instruments is a dual operational amplifier with low-offset and micropower features. It has a max input offset voltage of 100uV, nominal common mode reject ratio of 140dB, and min slew rate of 0.8V/us. Ideal for industrial applications requiring precise signal amplification in compact designs.
1N4148WS
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Panjit International
MBR0520LT1G
MBR0520LT1G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, has a peak reflow temperature of 260°C, and a repetitive peak reverse voltage of 20V. This diode is ideal for applications requiring high-speed switching in compact electronic devices.
2N2222A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; No. of Terminals: 3;
BSS138
Siemens
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain-Source On Resistance: 3.5 ohm; Terminal Finish: Tin/Lead (Sn/Pb);
EU2B-YS2J03F
Idec
ROTARY SWITCH;
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Reverse Recovery Time: .006 us; Maximum Repetitive Peak Reverse Voltage: 70 V; Maximum Forward Voltage (VF): 1 V; Maximum Operating Temperature: 150 Cel;
OPA2277UA/2K5
OPA2277UA/2K5 by Texas Instruments is a dual operational amplifier with low offset voltage of 100 uV and micropower consumption of 0.004 uA. Ideal for industrial applications, it offers high common mode rejection ratio of 140 dB and unity gain bandwidth of 1 MHz. With a compact rectangular package style, it is suitable for surface mount designs in various electronic systems.
Nexperia
SS14
Frontier Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
OHN3140U
Optek Technology
MAGNETIC FIELD SENSOR,HALL EFFECT; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Output Type: ANALOG CURRENT; Package Shape or Style: RECTANGULAR; Output Range: 25mA;
LM317AEMP/NOPB
LM317AEMP/NOPB by Texas Instruments is an adjustable positive single output standard regulator with a max output voltage of 37V and a max output current of 1.5A. It operates in temperatures ranging from -40°C to 125°C, making it suitable for various applications requiring precise voltage regulation in a compact package.
BSS138NH6327XTSA2
Infineon Technologies
BSS138NH6327XTSA2 by Infineon is a N-CHANNEL FET with 60V DS Breakdown Voltage, ideal for small signal applications. Operating in Enhancement Mode, it has 0.36W Power Dissipation and 3.5 ohm Drain-Source Resistance. With Gull Wing terminals and AEC-Q101 reference standard, it's suitable for automotive electronics due to its high temperature range of -55 to 150 °C.
BSS138K-13
Diodes Incorporated
BSS138K-13 by Diodes Inc. is a N-channel FET with 50V DS breakdown voltage, ideal for switching applications. It features single configuration with built-in diode, operating in enhancement mode. With 3 terminals and 0.31A max drain current, it offers high performance in small outline package style.
P2010NXN2KFC
The NXP Semiconductors P2010NXN2KFC microprocessor features a 64-bit external data bus width, 16-bit address bus width, and operates at a max clock frequency of 100 MHz. It is commonly used in applications requiring low power consumption and high processing speeds, such as embedded systems and IoT devices.
ATSAMA5D34A-CU
Microchip Technology
ATSAMA5D34A-CU by Microchip Technology is a 32-bit microprocessor with 131072 RAM words, 48 MHz clock frequency, and 39 DMA channels. Ideal for industrial applications, it features a low power mode, boundary scan capability, and RISC technology for efficient processing.
MIMXRT1175DVMAA
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40;
STM32MP151CAA3T
STMicroelectronics
MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
MPC8313VRADDC
Freescale Semiconductor
MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE;
MC9328MXLVH15
MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: LFBGA; Package Shape: SQUARE;
P2041NXN7NNC
MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 245; JESD-609 Code: e1; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); Maximum Time At Peak Reflow Temperature (s): 30;
MPC8343CVRAGDB
NXP Semiconductors' MPC8343CVRAGDB microprocessor features 32-bit address and external data bus width, with a max clock frequency of 66 MHz. Suitable for industrial applications, it operates b/w -40 to 105 °C, with low power mode and integrated cache for efficient performance.
MIMXRT1015CAF4BR
MICROPROCESSOR, RISC;
P1013NXE2LFB
P1013NXE2LFB by NXP Semiconductors is a 32-bit microprocessor with integrated cache, operating at a max frequency of 133 MHz. It features low power mode and boundary scan capabilities, making it suitable for automotive applications requiring high-speed processing in a compact package. With a terminal pitch of 1 mm and moisture sensitivity level of 3, this CMOS technology-based processor offers efficient performance in demanding environments.
MIMXRT1165DVM6A
MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40;
MPC8360ECVVAJDGA
The NXP Semiconductors MPC8360ECVVAJDGA is a 32-bit microprocessor with integrated cache and a max clock frequency of 66.67 MHz. It is commonly used in applications requiring low power mode and high-speed processing, such as networking equipment and industrial automation systems.
ATSAMA5D36A-CU
ATSAMA5D36A-CU by Microchip Technology is a 32-bit microprocessor with 131072 RAM words and 48 MHz clock frequency. Ideal for industrial applications, it features 39 DMA channels, low power mode, and boundary scan capability. With a package style of grid array and terminal pitch of 0.8 mm, this processor offers high performance in a compact design.
GG8067402570801SR2M5
Intel
The Intel GG8067402570801SR2M5 microprocessor features 64-bit architecture, 1667 terminals in a grid array package, and operates at speeds up to 1500 rpm. Ideal for industrial applications requiring high processing power and reliability in extreme temperature conditions.
STM32MP157FAD1
MC9S08PT16VLD
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 44; Package Code: QFP; Package Shape: SQUARE;
NHPXA270C5C312
Marvell Technology
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e1;
MCIMX6U5EVM10ACR
MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;
FH8069004541900SRK0Y
Microprocessors;
MC7455ARX867LG
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 483; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
NG80960JA3V33
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: QFP; Package Shape: SQUARE; Minimum Supply Voltage: 3.15 V;
NG80960JS25
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: QFP; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
NG80960JT-75
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: BQFP; Package Shape: SQUARE; Format: FIXED POINT;
NG80960JA-16
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: BQFP; Package Shape: SQUARE; JESD-609 Code: e0;
NG80960JC-33
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: BQFP; Package Shape: SQUARE; Technology: CMOS;
NG80960JC-40
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: BQFP; Package Shape: SQUARE; Additional Features: OPERATING CASE TEMPERATURE 0 TO 100 C;
NG80960JD-33
NG80960JD-40
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: BQFP; Package Shape: SQUARE; Low Power Mode: YES;
NG80960JD-50
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: BQFP; Package Shape: SQUARE; Maximum Supply Current: 447 mA;
NG80960JD-66
NG80960JF-25
NG80960JF-33
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: BQFP; Package Shape: SQUARE; Address Bus Width: 32;
NG80960JS-16
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: BQFP; Package Shape: SQUARE; Maximum Supply Current: 120 mA;
NG80960JA3V25
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: QFP; Package Shape: SQUARE; Integrated Cache: YES;
NG80960JD3V40
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: QFP; Package Shape: SQUARE; Format: FIXED POINT;
NG80960JF3V25
NG80960JF3V33
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: QFP; Package Shape: SQUARE; Nominal Supply Voltage: 3.3 V;
NG80960JC50
NG80960JC66
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: QFP; Package Shape: SQUARE; Boundary Scan: YES;
NG80960JT100
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: QFP; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
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