Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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NG80960JA3V33 by Intel is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 33.3 MHz. It features low power mode and boundary scan capabilities, making it suitable for embedded systems requiring efficient processing and peripheral interfacing. The processor's CMOS technology and 3.3 V nominal voltage ensure reliable performance in various applications.
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Plastic/epoxy material provides durability and heat resistance, making the microprocessor less susceptible to damage under varying conditions.
Integrated cache improves the speed and efficiency of the processor by storing frequently accessed data closer to the CPU, reducing latency in data retrieval.
Higher maximum supply voltage allows for better performance and stability under heavy workloads without risking damage to the processor.
A wider address bus allows the processor to access and manage larger amounts of memory, enabling better multitasking and handling of complex applications.
Square package shape allows for more efficient use of space on circuit boards, making it easier to integrate the microprocessor into various device designs.
32-bit processing capability allows the microprocessor to handle data in larger chunks, improving overall performance and efficiency.
Having 132 terminals provides ample connectivity options for interfacing with other components and peripherals, increasing the versatility of the microprocessor.
Flatpack package style offers a compact and slim profile, making it suitable for space-constrained applications while still providing efficient thermal management.
Lower minimum supply voltage helps in reducing power consumption and heat generation, contributing to energy efficiency and longer device battery life.
Quad terminal position simplifies the installation and soldering process, improving the overall reliability and durability of the microprocessor in various electronic devices.
Boundary scan feature allows for easier testing and debugging of the microprocessor during manufacturing and maintenance, ensuring better quality control and faster time-to-market.
Matching the data bus width to the address bus width enables seamless communication between the processor and memory, enhancing data transfer speeds and overall performance.
Higher clock frequency indicates faster processing speed, allowing the microprocessor to execute instructions more quickly and handle demanding tasks efficiently.
RISC architecture enhances the microprocessor's performance by simplifying instruction execution and optimizing processing speed, making it suitable for high-performance computing applications.
CMOS technology offers low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable for long-term operation in various electronic devices.
Gull wing terminal form provides excellent mechanical strength and solder joint reliability, ensuring the integrity of connections between the microprocessor and external components.
Stable nominal supply voltage ensures consistent and reliable operation of the microprocessor, preventing fluctuations that could impact performance or cause system failures.
Fixed point format simplifies arithmetic calculations and improves processing speed in applications that do not require floating-point precision, making the microprocessor suitable for specific tasks.
33 rpm speed indicates the rotational speed of the microprocessor, measuring how quickly it can process data and execute instructions, contributing to overall system performance.
Low power mode feature helps conserve energy and reduce heat generation when the microprocessor is not running at full capacity, extending battery life and improving efficiency in portable devices.
Microprocessors NG80960JA3V33 attributes and parameters. Explore more Microprocessors devices from Intel
Address Bus Width:
Bit Size:
Boundary Scan:
Maximum Clock Frequency:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
Low Power Mode:
No. of Terminals:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Qualification:
Speed:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Terminal Form:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Peripheral IC Type:
NG80960JA3V33 Peripheral ICs trade compliance attributes, and parameters.
ECCN
3A991.A.2
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
1N4148
ROHM
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LL4148
Micronas Semiconductor Holding Ag
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Output Current: .2 A; Maximum Forward Voltage (VF): 1.2 V;
Itt Components
RECTIFIER DIODE; Surface Mount: YES; Maximum Reverse Recovery Time: .005 us; Config: SINGLE; Maximum Operating Temperature: 200 Cel; Maximum Non Repetitive Peak Forward Current: 1 A;
BAV99
Good-ark Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Lite-on Semiconductor
LM555CMX
Texas Instruments
LM555CMX by Texas Instruments is an Analog Waveform Generation IC with 8 terminals. It operates at a nominal voltage of 5V and supports power supplies ranging from 5V to 15V. This versatile IC, housed in a small outline package, is commonly used for pulse and rectangular waveform generation in commercial temperature environments.
SMBJ18CA
Uniohm
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
National Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .5 A;
LM358AN
LM358AN by Texas Instruments is an Operational Amplifier with 2 functions. It has a Max Input Offset Voltage of 5000 uV and Nominal Common Mode Reject Ratio of 85 dB. Widely used in voltage-feedback applications due to its high Min Voltage Gain of 15000 and Unity Gain Bandwidth of 1000 kHz.
USB3320C-EZK-TR
Standard Microsystems
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
Nte Electronics
2N7002
Micro Commercial Components
Small Signal Field-Effect Transistors; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Transistor Application: SWITCHING; Maximum Drain Current (ID): .34 A; Package Style (Meter): SMALL OUTLINE;
2902037
Phoenix Contact
MODULAR TERMINAL BLOCK;
Allegro MicroSystems
RECTIFIER DIODE; Terminal Position: END; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Vishay Intertechnology
Vishay Intertechnology's BAV99 diode features a max forward voltage of 1.3V and a max output current of 0.15A, making it ideal for rectification applications. With a small outline package style and dual terminal position, this series-connected diode is designed for surface mount usage in various electronic circuits with an operating temperature range from -55°C to 150°C.
Rugao Dachang Electronic
261
Micronetics
Other Interface ICs; Temperature Grade: MILITARY; Terminal Form: FLAT; No. of Terminals: 14; Package Code: DFP; Package Shape: SQUARE;
BSS138
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Style (Meter): SMALL OUTLINE; Maximum Operating Temperature: 150 Cel;
Db Lectro
SPC TECHNOLOGY/ MULTICOMP
P3041NXN7PNC
Freescale Semiconductor
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B1295;
MPC885VR133
NXP Semiconductors
The NXP Semiconductors MPC885VR133 microprocessor features 32-bit address and external data bus width, with integrated cache. It operates at a speed of 133 rpm and supports low power mode, making it ideal for applications requiring high performance and energy efficiency. The package style is grid array with 357 terminals, suitable for surface mount assembly.
MCF53281CVM240J
MCF53281CVM240J by Freescale Semiconductor is a 32-bit microprocessor with power supplies of 1.5V, 1.8/3.3V and operates at speeds up to 240rpm. It features a grid array package style with 256 terminals and is ideal for industrial applications requiring high processing power in a compact form factor.
MPC8280CVVUPEA
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 480; Package Code: LBGA; Package Shape: SQUARE;
MPC880ZP80
The NXP Semiconductors MPC880ZP80 microprocessor features 32-bit address and data bus width, with integrated cache and low power mode. It is a RISC-based processor with 357 terminals in a grid array package suitable for various applications requiring high-speed processing capabilities.
30026-13
National Semiconductor's 30026-13 microprocessor features a 32-bit address bus width, integrated cache, and max clock frequency of 33.61 MHz. Ideal for low power applications, this CMOS technology-based processor operates b/w 0 to 85 °C with a supply voltage range of 2.09 V to 2.31 V.
BV80605001911AQ/SLBLD
Intel
Microprocessors;
I5-3470
MICROPROCESSOR; Technology: CMOS;
AM3357ZCZD27
AM3357ZCZD27 by Texas Instruments is a 32-bit microprocessor with integrated cache and 16-bit external data bus. Operating at a max clock frequency of 26 MHz, it features low power mode and boundary scan for efficient performance. Ideal for applications requiring high-speed processing in compact devices.
MPC8270CVVUPEA
NXP Semiconductors' MPC8270CVVUPEA microprocessor features 32-bit address bus, 64-bit external data bus, and integrated cache. Ideal for industrial applications requiring low power mode, with a max operating temperature of 105°C and boundary scan capability.
BV80605001911APSLBLC
Intel BV80605001911APSLBLC is a 64-bit microprocessor with 1156 terminals and CMOS technology. Operating at 0.65/1.4V, it has a max supply current of 110000mA and speed of 2660rpm. This processor is suitable for high-performance computing applications requiring efficient power consumption and advanced processing capabilities.
AM5708BCBDJ
The Texas Instruments AM5708BCBDJ microprocessor features 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for low power applications with a max clock frequency of 38.4 MHz. Suitable for use in various electronic devices requiring high-speed processing capabilities.
UPD70108C8
Nec Electronics America
MICROPROCESSOR; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 40; Package Code: DIP; Package Shape: RECTANGULAR;
AT91SAM9260B-QU
Microchip Technology
Microchip AT91SAM9260B-QU is a 32-bit RISC microprocessor with 26-bit address bus and 32-bit external data bus. It features integrated cache, ADC channels, and PWM channels. Ideal for industrial applications requiring low power consumption and high-speed processing up to 50 MHz.
MPC8347EVRAGDB
NXP Semiconductors' MPC8347EVRAGDB microprocessor features 32-bit address and external data bus width, with a max clock frequency of 66 MHz. It is suitable for applications requiring integrated cache, low power mode, and boundary scan capabilities. The package style is grid array with 620 terminals, making it ideal for high-performance computing systems.
405
Ibm Microelectronics
AT91SAM9G35-CU-999
Atmel
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 217; Package Code: LFBGA; Package Shape: SQUARE;
MPC860SRVR50D4
The NXP Semiconductors MPC860SRVR50D4 microprocessor features a 32-bit address and external data bus width, with a max clock frequency of 50 MHz. It is designed for low power mode applications, with integrated cache and boundary scan capabilities. Ideal for use in RISC-based systems requiring high-speed processing within a compact form factor.
MCF5484CVR200
NXP Semiconductors' MCF5484CVR200 microprocessor features 32-bit architecture, 66.67 MHz clock frequency, and integrated cache. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities. With a package style of grid array and terminal pitch of 1mm, it offers efficient performance in various embedded systems.
MPC5123YVY400B
NXP Semiconductors' MPC5123YVY400B microprocessor features 32-bit address and external data bus width, with a max clock frequency of 35 MHz. Ideal for industrial applications, this CMOS technology-based chip operates at temperatures ranging from -40 to 85 °C, offering low power mode and integrated cache for efficient performance.
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NG80960JD3V66
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: QFP; Package Shape: SQUARE; Package Style (Meter): FLATPACK;
NG80960JS25
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: QFP; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
NG80960JT-75
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: BQFP; Package Shape: SQUARE; Format: FIXED POINT;
NG80960JA-16
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: BQFP; Package Shape: SQUARE; JESD-609 Code: e0;
NG80960JA-25
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: BQFP; Package Shape: SQUARE; Address Bus Width: 32;
NG80960JA-33
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: BQFP; Package Shape: SQUARE; Surface Mount: YES;
NG80960JC-33
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: BQFP; Package Shape: SQUARE; Technology: CMOS;
NG80960JC-40
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: BQFP; Package Shape: SQUARE; Additional Features: OPERATING CASE TEMPERATURE 0 TO 100 C;
NG80960JD-33
NG80960JD-40
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: BQFP; Package Shape: SQUARE; Low Power Mode: YES;
NG80960JD-50
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: BQFP; Package Shape: SQUARE; Maximum Supply Current: 447 mA;
NG80960JD-66
NG80960JF-25
NG80960JF-33
NG80960JA3V16
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: QFP; Package Shape: SQUARE; Bit Size: 32;
NG80960JA3V25
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: QFP; Package Shape: SQUARE; Integrated Cache: YES;
NG80960JF3V25
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: QFP; Package Shape: SQUARE; Minimum Supply Voltage: 3.15 V;
NG80960JF3V33
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: QFP; Package Shape: SQUARE; Nominal Supply Voltage: 3.3 V;
NG80960JC50
NG80960JT100
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: QFP; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
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