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MPC860SRVR50D4

NXP Semiconductors

MPC860SRVR50D4 by NXP Semiconductors

The NXP Semiconductors MPC860SRVR50D4 microprocessor features a 32-bit address and external data bus width, with a max clock frequency of 50 MHz. It is designed for low power mode applications, with integrated cache and boundary scan capabilities. Ideal for use in RISC-based systems requiring high-speed processing within a compact form factor.

Median Price

$186.170

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 2,859 parts In-Stock

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$72.930

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2,859

$72.930

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Rochester

USA . 1,384 parts In-Stock

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$186.170

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$175.000

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$163.830

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1,384

$186.170

$175.000

$163.830

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DigiKey

USA . 25 parts In-Stock

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$232.710

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25

$232.710

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Distributors (In-Stock)

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Digiode

USA . 3,236 parts In-Stock

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$66.542

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3,236

$66.542

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Nova Conductors

Japan . 32 parts In-Stock

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$104.167

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32

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Vyrian

USA . 1,902 parts In-Stock

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1,902

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Anansix

USA . 1,436 parts In-Stock

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1,436

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ComSIT Distribution GmbH

Germany . 121 parts In-Stock

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ComSIT USA

USA . 121 parts In-Stock

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Infinite Electronics LLP

India . 10 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 6 parts In-Stock

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Distributors (Availability)

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Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$28.489

100+ parts

$28.205

1k+ parts

$27.065

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50

$28.489

$28.205

$27.065

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One Stop Electronics

USA . 2,004 parts In-Stock

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$59.540

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2,004

$59.540

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Ampacity Inc.

Singapore . 1,961 parts In-Stock

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$59.540

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1,961

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Corphita

USA . 1,347 parts In-Stock

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$63.040

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1,347

$63.040

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Vigor

Singapore . 886 parts In-Stock

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$94.000

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Continental Prestige Electronics

USA . 5,854 parts In-Stock

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$104.167

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$102.084

5,854

$104.167

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$102.084

Netroflash

USA . 50 parts In-Stock

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$104.167

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$98.959

10k+ parts

$96.876

50

$104.167

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$98.959

$96.876

Microchip USA

USA . 1,856 parts In-Stock

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$219.960

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1,856

$219.960

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A-Z Elektronik GmbH

Germany . 6,957 parts In-Stock

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6,957

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Argo Parts USA

USA . 4,781 parts In-Stock

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UNI Independent Distributors

Spain . 4,080 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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Futuretech Components

Singapore . 892 parts In-Stock

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Kepictronics

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Perfect Parts

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Speed Components Ltd (Excess)

Israel . 176 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 6 parts In-Stock

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Overview

Experience the unparalleled performance and reliability of the MPC860SRVR50D4 by NXP Semiconductors, a leading manufacturer in the semiconductor industry. This microprocessor is designed to meet the highest standards, offering integrated cache, low power mode, and a 32-bit data bus width for seamless operation. With applications ranging from industrial automation to networking equipment, this product delivers exceptional value and benefits to customers looking for cutting-edge technology. Trust NXP Semiconductors for quality and innovation in every component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the overall package lightweight and durable, ideal for electronic devices that may require portability and ruggedness.

Integrated Cache: YES

Having integrated cache enhances the processor's performance by reducing the average time to access memory, resulting in faster data retrieval and processing.

Maximum Supply Voltage: 3.465 V

With a maximum supply voltage of 3.465 V, this microprocessor can operate efficiently within a range that is suitable for various electronic applications.

Address Bus Width: 32

The 32-bit address bus width allows the processor to access a larger memory space, enabling it to handle more complex computational tasks and data processing.

Package Shape: SQUARE

The square package shape offers easy integration and placement on circuit boards, optimizing space utilization and ensuring a compact design for electronic devices.

Bit Size: 32

A 32-bit processor architecture allows for handling data and instructions in 32-bit chunks, enhancing overall performance and efficiency in processing tasks.

Power Supplies (V): 3.3

Operating at a nominal supply voltage of 3.3 V ensures energy efficiency and compatibility with standard power sources, making it ideal for a wide range of electronic devices.

No. of Terminals: 357

Having 357 terminals provides ample connectivity options, enabling the microprocessor to interface with various components and peripherals for versatile functionality.

Package Style (Meter): GRID ARRAY

The grid array package style offers reliable connections and improved thermal performance, ensuring stable operation and efficient heat dissipation for the microprocessor.

Minimum Supply Voltage: 3.135 V

Operating at a minimum supply voltage of 3.135 V ensures reliable performance even under low power conditions, making it suitable for energy-efficient applications.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connectivity and long-term durability.

Terminal Position: BOTTOM

Having terminals positioned at the bottom facilitates easy installation and maintenance of the microprocessor on circuit boards, ensuring a secure and stable connection.

Maximum Seated Height: 2.52 mm

The maximum seated height of 2.52 mm allows for a slim and compact profile, making it suitable for applications where space constraints are a concern.

Width: 25 mm

With a width of 25 mm, the microprocessor can fit into compact devices without compromising on performance, offering a balance of size and functionality.

Boundary Scan: YES

The presence of boundary scan capability allows for efficient testing and debugging of the microprocessor during manufacturing or troubleshooting, ensuring optimal performance.

External Data Bus Width: 32

The 32-bit external data bus width enables high-speed data transfer between the microprocessor and external components, enhancing overall system performance.

Maximum Clock Frequency: 50 MHz

Operating at a maximum clock frequency of 50 MHz ensures fast data processing and execution of instructions, making it suitable for applications that require real-time performance.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, the microprocessor can undergo soldering processes efficiently without compromising on its reliability.

Peak Reflow Temperature °C: 245

The peak reflow temperature of 245°C allows for reliable soldering of the microprocessor onto circuit boards, ensuring secure connections and stable performance.

Length: 25 mm

The 25 mm length of the microprocessor offers a compact form factor, enabling integration into space-constrained devices without sacrificing performance.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC (Reduced Instruction Set Computing) microprocessor allows for optimized performance and energy efficiency, making it suitable for a wide range of applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high-speed operation, making the microprocessor ideal for energy-efficient and reliable electronic devices.

Terminal Form: BALL

The ball terminal form offers secure and reliable connections for the microprocessor, ensuring stable performance and ease of installation on circuit boards.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 V ensures compatibility with standard power sources and reliable performance for various electronic applications.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, the microprocessor allows for easy soldering and connectivity on circuit boards, facilitating quick and efficient assembly.

Format: FIXED POINT

The fixed-point format enables precise and efficient arithmetic operations, making the microprocessor suitable for applications that require accurate computation.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that the microprocessor is robust and can withstand moderate exposure to moisture during handling and storage.

Speed: 50 rpm

Operating at a speed of 50 rpm ensures efficient data processing and execution of instructions, making the microprocessor suitable for tasks that require fast computational performance.

Low Power Mode: YES

The low power mode feature allows the microprocessor to operate in a power-efficient state when required, conserving energy and extending battery life in portable devices.

Technical Specifications

Microprocessors MPC860SRVR50D4 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B357

JESD-609 Code:

e1

Length:

25 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

357

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA357,19X19,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.52 mm

Speed:

50 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

3.135 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

25 mm

Peripheral IC Type:

Trade Compliance

MPC860SRVR50D4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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