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MPC8270CVRMIBA,557

NXP Semiconductors

MPC8270CVRMIBA,557 by NXP Semiconductors

NXP Semiconductors' MPC8270CVRMIBA,557 microprocessor features 32-bit address bus width, 64-bit external data bus width, and a max clock frequency of 266 MHz. Ideal for applications requiring high-speed processing such as networking equipment and industrial automation systems.

Median Price

$1.000

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 550 parts In-Stock

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$1.000

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Digiode

USA . 4,278 parts In-Stock

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Anansix

USA . 1,582 parts In-Stock

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Vyrian

USA . 302 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 69 parts In-Stock

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$0.438

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69

$0.438

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Argo Parts USA

USA . 4,417 parts In-Stock

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Continental Prestige Electronics

USA . 2,403 parts In-Stock

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$0.980

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Netroflash

USA . 50 parts In-Stock

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$1.000

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$0.950

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$0.930

50

$1.000

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$0.930

Semicontronic

India . 1,151 parts In-Stock

1+ parts

$9.000

100+ parts

$8.775

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$8.730

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$8.730

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AZTECH Wire

Italy . 524 parts In-Stock

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$9.113

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One Stop Electronics

USA . 1,554 parts In-Stock

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$12.000

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Ampacity Inc.

Singapore . 634 parts In-Stock

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$21.000

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Microchip USA

USA . 2,960 parts In-Stock

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$57.119

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Vigor

Singapore . 289 parts In-Stock

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$86.490

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UNI Independent Distributors

Spain . 3,161 parts In-Stock

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Corphita

USA . 2,129 parts In-Stock

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Overview

Discover the cutting-edge MPC8270CVRMIBA,557 by NXP Semiconductors, setting the standard in microprocessor technology. With integrated cache and a high clock frequency of 266 MHz, this powerhouse is perfect for a wide range of applications. From automotive to industrial automation, this microprocessor delivers unmatched performance and reliability. Trust in NXP Semiconductors' reputation for quality and innovation, and unlock the full potential of your next project with the MPC8270CVRMIBA,557.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy provides a durable and cost-effective packaging solution for the microprocessor.

Integrated Cache: YES

Integrated cache helps improve processing speed and efficiency by storing frequently accessed data closer to the processor.

Surface Mount: YES

Surface mount feature offers easy and efficient installation on circuit boards.

Maximum Supply Voltage: 1.6 V

Higher maximum supply voltage allows for increased performance without risking damage to the microprocessor.

Address Bus Width: 32

Wider address bus width enables the microprocessor to access larger amounts of memory, enhancing its capabilities.

Package Shape: SQUARE

Square package shape helps in easy and efficient placement on the circuit board.

Bit Size: 32

A 32-bit architecture allows for processing of larger chunks of data at once, increasing overall performance.

No. of Terminals: 516

Higher number of terminals provide more connections for interfacing with other components, expanding the microprocessor's functionality.

Package Style (Meter): GRID ARRAY

Grid array package style offers improved thermal performance and reliability due to better heat dissipation.

Minimum Supply Voltage: 1.45 V

Lower minimum supply voltage helps in reducing power consumption and heat generation, making the microprocessor more energy-efficient.

Terminal Position: BOTTOM

Bottom terminal position makes soldering and connections easier during installation on the circuit board.

Maximum Seated Height: 2.55 mm

Low maximum seated height allows for a compact design and easy integration into space-constrained devices.

Width: 27 mm

Compact width enables efficient placement of the microprocessor on the circuit board, saving space.

Boundary Scan: YES

Boundary scan feature simplifies testing and diagnostics during production and maintenance of the microprocessor.

External Data Bus Width: 64

Wider external data bus width allows for faster data transfer between the microprocessor and external devices, enhancing performance.

Maximum Clock Frequency: 266 MHz

Higher maximum clock frequency enables the microprocessor to process instructions at a faster rate, improving overall performance.

Length: 27 mm

Compact length ensures a smaller footprint, making the microprocessor suitable for compact and portable devices.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC (Reduced Instruction Set Computing) architecture offers simplified instructions that enhance performance and efficiency in processing tasks.

Technology: CMOS

CMOS technology provides low power consumption, high speed, and reliability, making it ideal for a microprocessor.

Terminal Form: BALL

Ball terminal form allows for efficient soldering and connections while ensuring reliable electrical contact.

Nominal Supply Voltage: 1.5 V

Stable nominal supply voltage ensures consistent performance and reliability of the microprocessor.

Terminal Pitch: 1 mm

Narrow terminal pitch enables high-density packaging, allowing for more terminals in a limited space.

Format: FLOATING POINT

Floating-point format allows for efficient and accurate handling of decimal numbers, important for scientific calculations and data processing.

Speed: 66.67 rpm

High speed of 66.67 rpm indicates the microprocessor's ability to process instructions quickly and efficiently, suitable for a range of applications.

Technical Specifications

Microprocessors MPC8270CVRMIBA,557 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

266 MHz

External Data Bus Width:

64

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B516

Length:

27 mm

Low Power Mode:

NO

No. of Terminals:

516

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

2.55 mm

Speed:

66.67 rpm

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1.45 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

MPC8270CVRMIBA,557 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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