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T1042NXN7PQB

NXP Semiconductors

T1042NXN7PQB by NXP Semiconductors

T1042NXN7PQB by NXP Semiconductors is a 32-bit microprocessor with integrated cache and a max clock frequency of 133.3 MHz. It is commonly used in applications requiring high-speed processing, such as networking and telecommunications.

Median Price

$182.250

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 68 parts In-Stock

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$167.880

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Arrow

USA . 240 parts In-Stock

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$182.250

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$182.250

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Verical

USA . 240 parts In-Stock

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$182.250

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240

$182.250

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Mouser Electronics

USA . 42 parts In-Stock

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$241.650

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$189.840

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42

$241.650

$189.840

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Flip Electronics (Authorized)

USA . 65 parts In-Stock

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Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

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$159.212

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50

$159.212

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Digiode

USA . 2,297 parts In-Stock

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$159.486

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2,297

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Vyrian

USA . 3,710 parts In-Stock

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3,710

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Anansix

USA . 1,770 parts In-Stock

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1,770

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Component Sense

UK . 574 parts In-Stock

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Chip Stock

USA . 334 parts In-Stock

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Flip Electronics

USA . 36 parts In-Stock

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TME

Poland . 20 parts In-Stock

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$208.720

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Distributors (Availability)

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AZTECH Wire

Italy . 361 parts In-Stock

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$8.034

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361

$8.034

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Ampacity Inc.

Singapore . 58 parts In-Stock

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$140.390

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Corphita

USA . 1,328 parts In-Stock

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$151.092

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$151.092

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Continental Prestige Electronics

USA . 5,399 parts In-Stock

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$159.212

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$156.028

5,399

$159.212

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$156.028

Microchip USA

USA . 1,352 parts In-Stock

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$227.122

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Authorized Procurement Solutions

USA . 28,800 parts In-Stock

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Lixinc

USA . 7,178 parts In-Stock

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UNI Independent Distributors

Spain . 4,218 parts In-Stock

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Argo Parts USA

USA . 4,136 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$156.028

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$151.252

10k+ parts

$148.067

500

-

$156.028

$151.252

$148.067

Overview

Discover a world of possibilities with the T1042NXN7PQB microprocessor by NXP Semiconductors. Designed with impeccable quality and backed by a trusted manufacturer, this powerful chip offers unrivaled performance for a wide range of applications. Whether you're in need of fast processing speeds, efficient power consumption, or advanced connectivity options, this cutting-edge microprocessor delivers it all. With its integrated cache and 32-bit architecture, it's perfect for demanding tasks and ensures smooth operation every time. Say hello to a new level of productivity and innovation with the T1042NXN7PQB microprocessor.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides excellent durability and protection to the microprocessor, making it a reliable choice for long-term usage.

Integrated Cache: YES

The integrated cache enhances the microprocessor's performance by providing faster access to frequently used data, allowing for efficient multitasking and quick response times.

Surface Mount: YES

The surface mount feature simplifies the installation process of the microprocessor, making it convenient to integrate into various electronic devices.

Maximum Supply Voltage: 1.03 V

The maximum supply voltage of 1.03 V ensures optimized power consumption and helps prevent potential damage to the microprocessor, ensuring stable and reliable operation.

Address Bus Width: 16

The 16-bit address bus width enables the microprocessor to access a large memory space, facilitating efficient data processing and enabling the execution of complex tasks.

Package Shape: SQUARE

The square package shape provides a compact and space-saving design, making it suitable for applications with limited enclosure space.

Bit Size: 32

The 32-bit bit size enables the microprocessor to handle larger amounts of data with higher precision, resulting in faster and more accurate calculations and data processing.

No. of Terminals: 780

The high number of terminals enables the microprocessor to connect with various external components, allowing for versatile and flexible integration into different systems.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array, fine pitch package style enhances the microprocessor's connectivity and ensures secure and reliable electrical connections, making it suitable for demanding applications.

Minimum Supply Voltage: 0.97 V

The minimum supply voltage of 0.97 V enables the microprocessor to operate efficiently even in low-power scenarios, resulting in energy-saving benefits and extended battery life.

Terminal Finish: TIN SILVER COPPER

The tin silver copper terminal finish offers excellent conductivity and corrosion resistance, ensuring reliable and long-lasting performance of the microprocessor.

Terminal Position: BOTTOM

The bottom terminal position simplifies the installation and connection process of the microprocessor, allowing for easier integration into electronic devices or printed circuit boards.

Maximum Seated Height: 2.07 mm

The maximum seated height ensures compatibility with slim and compact designs, making it suitable for space-constrained applications.

Width: 23 mm

The width of 23 mm provides a compact form factor, making the microprocessor ideal for small-scale electronic devices or systems.

Boundary Scan: YES

The presence of boundary scan capability enables efficient testing and debug processes, simplifying the development and troubleshooting of systems integrating the microprocessor.

External Data Bus Width: 64

The 64-bit external data bus width allows for high-speed data transfer between the microprocessor and external memory, enhancing overall system performance and data processing capabilities.

Maximum Clock Frequency: 133.3 MHz

The high maximum clock frequency of 133.3 MHz enables the microprocessor to execute instructions at a rapid rate, resulting in swift and efficient data processing.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and reliable connections during the manufacturing process, enhancing the microprocessor's overall quality.

Peak Reflow Temperature °C: 250

The peak reflow temperature of 250°C ensures the microprocessor can withstand high-temperature soldering processes, contributing to its robustness and reliability.

Length: 23 mm

The length of 23 mm provides a compact size, making the microprocessor suitable for various electronic devices or embedded systems with limited space.

Peripheral IC Type: MICROPROCESSOR, RISC

The microprocessor's choice as a peripheral IC enables it to efficiently control and manage peripheral devices, enhancing system reliability and flexibility.

Technology: CMOS

The adoption of CMOS technology allows the microprocessor to achieve a balance between power consumption, performance, and reliability, making it a desirable choice for a wide range of applications.

Terminal Form: BALL

The ball terminal form enhances the microprocessor's connectivity and ensures secure electrical connections, making it suitable for applications where vibration or shock resistance is crucial.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1 V allows for optimal power consumption and compatibility with a wide range of electronic systems, providing versatility and energy efficiency.

Terminal Pitch: 0.8 mm

The terminal pitch of 0.8 mm enables easy connection and integration of the microprocessor into various electronic devices or circuit boards, simplifying the assembly process.

Format: FIXED POINT

The fixed-point format enables precise numerical calculations and facilitates efficient data processing, making the microprocessor an excellent choice for applications requiring high computational accuracy.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 ensures safe handling and durability of the microprocessor during manufacturing and assembly processes, minimizing the risk of moisture-related failures.

Speed: 1400 rpm

The high speed of 1400 rpm allows the microprocessor to handle demanding computational tasks and optimize system performance, making it ideal for applications requiring fast and efficient data processing.

Low Power Mode: YES

The availability of a low power mode enables energy-efficient operation, reducing power consumption and heat generation, making the microprocessor suitable for battery-powered devices or energy-conscious applications.

Technical Specifications

Microprocessors T1042NXN7PQB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

16

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

133.3 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B780

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

780

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.07 mm

Speed:

1400 rpm

Maximum Supply Voltage:

1.03 V

Minimum Supply Voltage:

.97 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

T1042NXN7PQB Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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