Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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T1042NXN7PQB by NXP Semiconductors is a 32-bit microprocessor with integrated cache and a max clock frequency of 133.3 MHz. It is commonly used in applications requiring high-speed processing, such as networking and telecommunications.
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The plastic/epoxy package body material provides excellent durability and protection to the microprocessor, making it a reliable choice for long-term usage.
The integrated cache enhances the microprocessor's performance by providing faster access to frequently used data, allowing for efficient multitasking and quick response times.
The surface mount feature simplifies the installation process of the microprocessor, making it convenient to integrate into various electronic devices.
The maximum supply voltage of 1.03 V ensures optimized power consumption and helps prevent potential damage to the microprocessor, ensuring stable and reliable operation.
The 16-bit address bus width enables the microprocessor to access a large memory space, facilitating efficient data processing and enabling the execution of complex tasks.
The square package shape provides a compact and space-saving design, making it suitable for applications with limited enclosure space.
The 32-bit bit size enables the microprocessor to handle larger amounts of data with higher precision, resulting in faster and more accurate calculations and data processing.
The high number of terminals enables the microprocessor to connect with various external components, allowing for versatile and flexible integration into different systems.
The grid array, fine pitch package style enhances the microprocessor's connectivity and ensures secure and reliable electrical connections, making it suitable for demanding applications.
The minimum supply voltage of 0.97 V enables the microprocessor to operate efficiently even in low-power scenarios, resulting in energy-saving benefits and extended battery life.
The tin silver copper terminal finish offers excellent conductivity and corrosion resistance, ensuring reliable and long-lasting performance of the microprocessor.
The bottom terminal position simplifies the installation and connection process of the microprocessor, allowing for easier integration into electronic devices or printed circuit boards.
The maximum seated height ensures compatibility with slim and compact designs, making it suitable for space-constrained applications.
The width of 23 mm provides a compact form factor, making the microprocessor ideal for small-scale electronic devices or systems.
The presence of boundary scan capability enables efficient testing and debug processes, simplifying the development and troubleshooting of systems integrating the microprocessor.
The 64-bit external data bus width allows for high-speed data transfer between the microprocessor and external memory, enhancing overall system performance and data processing capabilities.
The high maximum clock frequency of 133.3 MHz enables the microprocessor to execute instructions at a rapid rate, resulting in swift and efficient data processing.
The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and reliable connections during the manufacturing process, enhancing the microprocessor's overall quality.
The peak reflow temperature of 250°C ensures the microprocessor can withstand high-temperature soldering processes, contributing to its robustness and reliability.
The length of 23 mm provides a compact size, making the microprocessor suitable for various electronic devices or embedded systems with limited space.
The microprocessor's choice as a peripheral IC enables it to efficiently control and manage peripheral devices, enhancing system reliability and flexibility.
The adoption of CMOS technology allows the microprocessor to achieve a balance between power consumption, performance, and reliability, making it a desirable choice for a wide range of applications.
The ball terminal form enhances the microprocessor's connectivity and ensures secure electrical connections, making it suitable for applications where vibration or shock resistance is crucial.
The nominal supply voltage of 1 V allows for optimal power consumption and compatibility with a wide range of electronic systems, providing versatility and energy efficiency.
The terminal pitch of 0.8 mm enables easy connection and integration of the microprocessor into various electronic devices or circuit boards, simplifying the assembly process.
The fixed-point format enables precise numerical calculations and facilitates efficient data processing, making the microprocessor an excellent choice for applications requiring high computational accuracy.
The moisture sensitivity level of 3 ensures safe handling and durability of the microprocessor during manufacturing and assembly processes, minimizing the risk of moisture-related failures.
The high speed of 1400 rpm allows the microprocessor to handle demanding computational tasks and optimize system performance, making it ideal for applications requiring fast and efficient data processing.
The availability of a low power mode enables energy-efficient operation, reducing power consumption and heat generation, making the microprocessor suitable for battery-powered devices or energy-conscious applications.
Microprocessors T1042NXN7PQB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors
Address Bus Width:
Bit Size:
Boundary Scan:
Maximum Clock Frequency:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
JESD-609 Code:
Length:
Low Power Mode:
Moisture Sensitivity Level (MSL):
No. of Terminals:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Seated Height:
Speed:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
T1042NXN7PQB Peripheral ICs trade compliance attributes, and parameters.
ECCN
3A991.A.1
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
PCN Design/Specification - Mult Dev 25/May/2020
PCN Packaging - All Dev Label Update 15/Dec/2020 Mult Dev Pkg Seal 15/Dec/2020
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
2N2222A
Semiconductor Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BSS138LT3G
Onsemi
BSS138LT3G by Onsemi is a N-CHANNEL FET with a min DS breakdown voltage of 50V. It is used for switching applications and has a max drain current of 0.2A and max drain-source on resistance of 3.5 ohm.
SMBJ18CA
STMicroelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MBRS130LT3G
MBRS130LT3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.445V. It operates b/w -65 to 125°C, has a reverse test voltage of 30V, and is ideal for power applications due to its small outline package style.
M39029/56-351
Itt Cannon
CONNECTOR ACCESSORY; MIL Conformity: YES; Terminal Type: WIRE; IEC Conformity: NO; Alternate Contact Sources: ITT CANNON; Associated Military - Specifications: MIL-C-38999;
SN65HVD230DR
Texas Instruments
SN65HVD230DR by Texas Instruments is a BICMOS technology interface circuit with 1Mbps data rate, suitable for industrial applications. It operates at 3.3V, has 8 terminals in a small outline package, and can withstand temperatures from -40 to 85°C.
Continental Device India
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
2N7002
Supertex
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Maximum Feedback Capacitance (Crss): 5 pF;
Zowie Technology
MBR0520L-T1
Won-top Electronics
MBR0520L-T1 by Won-top Electronics is a Schottky rectifier diode with 20V peak reverse voltage and 0.5A output current. It is a single-config, surface-mount diode in a small outline package, suitable for applications requiring high-speed switching and low forward voltage drop. Operating temperature range from -65°C to 125°C makes it ideal for various electronic circuits.
ESD5Z5.0T1G
ESD5Z5.0T1G by Onsemi is a unidirectional Trans Voltage Suppressor Diode with 5V reverse test voltage and 174W peak power dissipation. It is used for transient suppression in electronic circuits, meeting IEC-61000-4-2, 4-4 standards and UL recognized for reliability.
SS14
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Unisonic Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Body Material: PLASTIC/EPOXY; Package Shape: RECTANGULAR;
BAV99
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Operating Temperature: 200 Cel; Config: SINGLE; Terminal Finish: Tin/Lead (Sn/Pb);
ROHM
LL4148
Taitron Components
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Dionics-usa
NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SPC TECHNOLOGY/ MULTICOMP
STM32MP151CAC3T
MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
MC7448THX1267ND
Freescale Semiconductor
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE;
MC9328MX1CVM15R2
Motorola
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: LFBGA; Package Shape: SQUARE;
CH80566EE014DT/SLGPP
Intel
Intel CH80566EE014DT/SLGPP is a 64-bit microprocessor with 28-bit address bus width and 64-bit external data bus width. It operates at speeds up to 1330 rpm, suitable for industrial applications requiring low power consumption. The processor features integrated cache, boundary scan, and CMOS technology for efficient performance in various electronic devices.
MPC8270ZQMIBA
MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE;
R7S721021VLFP#AA1
Renesas Electronics
Renesas Electronics R7S721021VLFP#AA1 microprocessor features 8-bit data RAM, 26-bit address bus width, and 32-bit external data bus. Ideal for low power applications with a max clock frequency of 13.33 MHz. Suitable for various embedded systems requiring high-speed processing in a compact form factor.
MPC8270VVQLDA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 480; Package Code: LBGA; Package Shape: SQUARE; Technology: CMOS;
STM32MP151CAB3
MCIMX6X1EVO10AB
MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1; Technology: CMOS; Terminal Finish: TIN SILVER COPPER;
AM5706BCBDDEA
The Texas Instruments AM5706BCBDDEA microprocessor features a 32-bit external data bus, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates at a max clock frequency of 38.4 MHz with low power mode support. The package style is grid array with 538 terminals in a square shape.
P2010NXN2KFC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.1 V;
P2020NSE2MHC
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE;
AM3517AZER
AM3517AZER by Texas Instruments is a microprocessor with 16-bit address bus, 8-bit on-chip data RAM width, and integrated cache. It operates at a max clock frequency of 26 MHz and has low power mode for energy efficiency. Ideal for applications requiring high-speed processing in compact devices.
TMS320DM8147SCYE1
TMS320DM8147SCYE1 by Texas Instruments is a 32-bit microprocessor with integrated cache and 16-bit external data bus. It operates at a max clock frequency of 30 MHz, suitable for low power mode applications. With 72 DMA channels, it is ideal for high-speed processing in various electronic devices.
MCIMX6X1AVK08AB
AM3354BZCZ80
AM3354BZCZ80 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 16-bit external data bus width, and max clock frequency of 26 MHz. Ideal for applications requiring low power mode, it features a grid array package style and operates b/w temperatures of 0-90°C.
MIMXRT1024CAG4A
NXP Semiconductors
The NXP Semiconductors MIMXRT1024CAG4A microprocessor features 32-bit architecture, 262144 RAM words, and a max clock frequency of 24 MHz. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.
AM3351BZCE60
AM3351BZCE60 by Texas Instruments is a 32-bit microprocessor with integrated cache and 131072 RAM words. It operates at a max clock frequency of 26 MHz, suitable for low power mode applications. With 64 DMA channels and boundary scan support, it is ideal for embedded systems requiring high-speed data processing.
AM3517AZCNAC
AM3517AZCNAC by Texas Instruments is a 16-bit microprocessor with integrated cache and surface mount capability. It operates at a max clock frequency of 26 MHz and has a wide temperature range, making it suitable for industrial applications.
P3041NXN7PNC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B1295;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
T1042NXE7MQB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER;
T1042NSN7MQB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Boundary Scan: YES;
T1042NSE7MQB
The NXP Semiconductors T1042NSE7MQB microprocessor features a 32-bit architecture with 64-bit external data bus width and integrated cache. With a max clock frequency of 133.3 MHz, it is suitable for high-speed computing applications requiring low power mode operation. The package style is grid array, fine pitch, making it ideal for compact designs in various electronic devices.
T1042ME3PQB
Teledyne E2v (Uk)
MICROPROCESSOR, RISC; Temperature Grade: MILITARY; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;
T1042NSE7PQA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Minimum Supply Voltage: .97 V;
T1040NXN7MQB
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE;
T1042NSE7WQA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Terminal Pitch: .8 mm;
T1042NSE7WQB
T1040NSN7MQB
MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE;
T1040NSN7WQA
T1040NXN7PQB
T1040NXN7MQA
T1042NSE7PQB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
T1040NSN7PQB
T1040NXN7WQA
T1040NSN7WQB
T1040NXN7WQB
T1042NSN7MQA
T1040NXN7PQA
T1042MN7MQA
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