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T1042NSE7PQB

NXP Semiconductors

T1042NSE7PQB by NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

Median Price

$161.738

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4 parts In-Stock

1+ parts

$134.950

100+ parts

$126.850

1k+ parts

$118.760

10k+ parts

-

4

$134.950

$126.850

$118.760

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Arrow

USA . 60 parts In-Stock

1+ parts

$162.300

100+ parts

$152.080

1k+ parts

$151.480

10k+ parts

-

60

$162.300

$152.080

$151.480

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DigiKey

USA . 60 parts In-Stock

1+ parts

$209.100

100+ parts

$164.957

1k+ parts

-

10k+ parts

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60

$209.100

$164.957

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-

Verical

USA . 9,960 parts In-Stock

1+ parts

-

100+ parts

$161.176

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-

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9,960

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$161.176

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Flip Electronics (Authorized)

USA . 57 parts In-Stock

1+ parts

-

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57

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,324 parts In-Stock

1+ parts

$111.644

100+ parts

-

1k+ parts

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2,324

$111.644

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Vyrian

USA . 8,282 parts In-Stock

1+ parts

-

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8,282

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Anansix

USA . 2,767 parts In-Stock

1+ parts

-

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2,767

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Flip Electronics

USA . 94 parts In-Stock

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-

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94

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 951 parts In-Stock

1+ parts

$105.768

100+ parts

-

1k+ parts

-

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951

$105.768

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Microchip USA

USA . 2,720 parts In-Stock

1+ parts

$252.030

100+ parts

-

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2,720

$252.030

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UNI Independent Distributors

Spain . 5,175 parts In-Stock

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5,175

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Technical Specifications

Microprocessors T1042NSE7PQB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

16

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

133.3 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B780

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

780

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.07 mm

Speed:

1400 rpm

Maximum Supply Voltage:

1.03 V

Minimum Supply Voltage:

.97 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

T1042NSE7PQB Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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