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MPC8321EVRAFDCA

NXP Semiconductors

MPC8321EVRAFDCA by NXP Semiconductors

The NXP Semiconductors MPC8321EVRAFDCA is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 66.67 MHz. It features low power mode and boundary scan capabilities, making it suitable for applications requiring high-speed processing in compact devices.

Median Price

$53.940

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

MPC8321EVRAFDCA by NXP Semiconductors
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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 80 parts In-Stock

1+ parts

$53.940

100+ parts

$42.751

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80

$53.940

$42.751

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Flip Electronics (Authorized)

USA . 12 parts In-Stock

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12

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Distributors (In-Stock)

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Digiode

USA . 4,148 parts In-Stock

1+ parts

$35.274

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4,148

$35.274

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Vyrian

USA . 8,728 parts In-Stock

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8,728

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Anansix

USA . 2,849 parts In-Stock

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Nova Conductors

Japan . 94 parts In-Stock

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Flip Electronics

USA . 12 parts In-Stock

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12

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Distributors (Availability)

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Corohmni

South Africa . 6 parts In-Stock

1+ parts

$29.733

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$29.733

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One Stop Electronics

USA . 23 parts In-Stock

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$31.560

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23

$31.560

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Ampacity Inc.

Singapore . 23 parts In-Stock

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$31.560

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Corphita

USA . 1,808 parts In-Stock

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$33.417

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Vigor

Singapore . 140 parts In-Stock

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$54.860

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140

$54.860

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Modulus Dynamics

Lithuania . 3,106 parts In-Stock

1+ parts

$65.912

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$65.912

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$65.912

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3,106

$65.912

$65.912

$65.912

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Microchip USA

USA . 2,802 parts In-Stock

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$94.576

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UNI Independent Distributors

Spain . 7,432 parts In-Stock

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Argo Parts USA

USA . 4,336 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Aranea Global

USA . 2,000 parts In-Stock

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Continental Prestige Electronics

USA . 1,052 parts In-Stock

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Perfect Parts

USA . 806 parts In-Stock

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806

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Overview

Unleash the power of innovation with the MPC8321EVRAFDCA by NXP Semiconductors. Designed with cutting-edge technology and superior quality, this Microprocessor is a game-changer in its category. From seamless integration to high-speed performance, this product offers unparalleled value and benefits to customers across various applications. Elevate your projects with the MPC8321EVRAFDCA and experience the advantages of reliability, efficiency, and advanced functionality that only NXP Semiconductors can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microprocessor, making it a reliable choice for long-term use.

Integrated Cache: YES

Integrated cache improves the processing speed and efficiency of the microprocessor, making it ideal for tasks that require quick data access.

Surface Mount: YES

Surface mount technology allows for easy installation and integration of the microprocessor onto circuit boards, saving time and effort.

Maximum Supply Voltage: 1.05 V

Operating within a specific voltage range ensures optimal performance and longevity of the microprocessor.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space on the circuit board, making it suitable for compact electronic devices.

Bit Size: 32

A 32-bit processor can handle larger chunks of data at a time, improving overall performance and speed of computing tasks.

No. of Terminals: 516

A higher number of terminals allow for more connectivity options and functionality, making the microprocessor versatile for different applications.

Package Style (Meter): GRID ARRAY

The grid array package style provides a high level of connectivity and reliability, ensuring stable performance under various conditions.

Minimum Supply Voltage: 0.95 V

Having a low minimum supply voltage allows for energy-efficient operation and extends the battery life of devices powered by the microprocessor.

Terminal Finish: TIN SILVER

The tin silver finish on terminals enhances conductivity and durability, improving the overall reliability of the microprocessor.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and secure connection to the circuit board, ensuring stable performance and longevity.

Maximum Seated Height: 2.55 mm

The low seated height of the microprocessor enables it to fit into compact electronic devices without compromising on performance.

Width: 27 mm

A moderate width makes the microprocessor suitable for a range of electronic devices without taking up too much space on the circuit board.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the microprocessor, ensuring high quality and reliability in manufacturing.

Maximum Clock Frequency: 66.67 MHz

A high clock frequency enables fast data processing and execution of instructions, making the microprocessor suitable for demanding tasks.

Maximum Time At Peak Reflow Temperature (s): 40

The short time required at peak reflow temperature minimizes thermal stress on the microprocessor during manufacturing, ensuring long-term reliability.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, the microprocessor can withstand the soldering process without damage, ensuring proper assembly onto circuit boards.

Length: 27 mm

A moderate length makes the microprocessor versatile for various electronic devices without compromising on performance or compatibility.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC (Reduced Instruction Set Computing) microprocessor, it offers fast and efficient processing of instructions, ideal for high-performance computing tasks.

Technology: CMOS

CMOS technology provides low power consumption and high speed performance, making the microprocessor energy-efficient and suitable for battery-powered devices.

Terminal Form: BALL

The ball terminal form ensures secure and reliable connections to the circuit board, enhancing the overall stability and performance of the microprocessor.

Nominal Supply Voltage: 1 V

Operating at a nominal supply voltage of 1V ensures compatibility with standard power sources and stable performance in electronic devices.

Terminal Pitch: 1 mm

A 1mm terminal pitch allows for easy and precise soldering onto the circuit board, ensuring accurate connections and reliable performance.

Format: FLOATING POINT

Support for floating-point calculations enables the microprocessor to handle complex mathematical operations with precision and efficiency.

Moisture Sensitivity Level (MSL): 3

With MSL level 3, the microprocessor can withstand moderate exposure to moisture during manufacturing and storage, ensuring product reliability.

Speed: 333 rpm

Operating at a speed of 333 revolutions per minute, the microprocessor can handle tasks quickly and efficiently, ideal for high-performance applications.

Low Power Mode: YES

The low power mode option allows the microprocessor to conserve energy during idle or low-demand periods, improving overall energy efficiency.

Technical Specifications

Microprocessors MPC8321EVRAFDCA attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

66.67 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B516

JESD-609 Code:

e2

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

516

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.55 mm

Speed:

333 rpm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

27 mm

Peripheral IC Type:

Trade Compliance

MPC8321EVRAFDCA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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