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T1023NSE7PQA

NXP Semiconductors

T1023NSE7PQA by NXP Semiconductors

The NXP Semiconductors T1023NSE7PQA microprocessor features a 64-bit architecture, 16-bit address bus width, and 32-bit external data bus width. Ideal for applications requiring high-speed processing, it operates b/w 0 to 105°C with low power mode support.

Median Price

$121.264

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

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Flip Electronics (Authorized)

USA . 1,344 parts In-Stock

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Rochester

USA . 89 parts In-Stock

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$107.790

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$96.440

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$90.770

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$90.770

DigiKey

USA . 89 parts In-Stock

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89

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Verical

USA . 84 parts In-Stock

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$134.738

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$120.550

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$113.463

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$134.738

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$113.463

Distributors (In-Stock)

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Digiode

USA . 4,907 parts In-Stock

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$83.340

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Nova Conductors

Japan . 650 parts In-Stock

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$105.965

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Vyrian

USA . 8,161 parts In-Stock

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Anansix

USA . 1,256 parts In-Stock

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Flip Electronics

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Sensible Micro Corp

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DigiKey Marketplace

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Distributors (Availability)

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Advanced Electronics

New Zealand . 1,500 parts In-Stock

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$15.533

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$15.378

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$14.757

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$15.533

$15.378

$14.757

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Aztec Data Supply Inc.

USA . 2,803 parts In-Stock

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$39.640

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Corohmni

South Africa . 103 parts In-Stock

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$69.348

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Ampacity Inc.

Singapore . 310 parts In-Stock

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$74.570

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Semicontronic

India . 85 parts In-Stock

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$74.570

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$72.706

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$72.333

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Corphita

USA . 700 parts In-Stock

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$78.953

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Aranea Global

USA . 1,000 parts In-Stock

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$103.845

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$99.691

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Continental Prestige Electronics

USA . 5,826 parts In-Stock

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$105.965

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$103.845

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Microchip USA

USA . 1,792 parts In-Stock

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$201.735

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Argo Parts USA

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Lixinc

USA . 3,413 parts In-Stock

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iodParts Technologies Inc.

India . 3,400 parts In-Stock

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Authorized Procurement Solutions

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UNI Independent Distributors

Spain . 1,548 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 37 parts In-Stock

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Overview

Enhance your electronic devices with the T1023NSE7PQA microprocessor by NXP Semiconductors. As a leader in semiconductor manufacturing, NXP guarantees top-notch quality and reliability. This cutting-edge microprocessor boasts integrated cache, low power mode, and a wide range of applications in various industries. With a 64-bit size and 32 external data bus width, this product offers unparalleled performance and efficiency. Discover the value and benefits that the T1023NSE7PQA can bring to your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes the product lightweight and durable, ideal for portable devices.

Integrated Cache: YES

The integrated cache improves performance by reducing memory latency, making it a faster and more efficient processor.

Surface Mount: YES

With surface mount technology, the processor is easier to install and takes up less space on the PCB, saving valuable real estate.

Maximum Supply Voltage: 1.03 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making it energy-efficient.

Address Bus Width: 16

A wider address bus width allows for faster data transfer and processing capabilities, enhancing overall performance.

Package Shape: SQUARE

The square package shape is space-efficient and allows for easier integration into various electronic devices.

Bit Size: 64

A 64-bit bit size enables the processor to handle large amounts of data at once, improving multitasking and overall speed.

No. of Terminals: 525

The high number of terminals provides more connectivity options and flexibility for different applications.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array, fine pitch package style offers high density and reliability for advanced electronic designs.

Minimum Supply Voltage: 0.97 V

The low minimum supply voltage ensures stable performance even in low-power scenarios, extending battery life.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature allows the processor to perform reliably in harsh environments without overheating.

No. of External Interrupts: 6

The multiple external interrupts enable the processor to quickly respond to external events, improving real-time responsiveness.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the processor can function in a wide range of environments, from freezing cold to extreme heat.

Terminal Finish: TIN SILVER COPPER

The tin, silver, copper terminal finish provides excellent conductivity and corrosion resistance for long-lasting performance.

Terminal Position: BOTTOM

The terminals positioned at the bottom facilitate easier PCB layout and soldering, simplifying the manufacturing process.

Maximum Seated Height: 2.07 mm

The low maximum seated height allows for a slim profile, ideal for compact electronic devices with limited space.

Width: 19 mm

The 19mm width provides compatibility with standard board sizes and allows for versatile installation options in various applications.

Boundary Scan: YES

The boundary scan feature enables efficient testing and debugging of the processor during the manufacturing process, ensuring quality control.

External Data Bus Width: 32

A wide external data bus width of 32 bits allows for faster data transfer between the processor and external components, enhancing performance.

Maximum Time At Peak Reflow Temperature (s): 40

The short maximum time at peak reflow temperature ensures reliable soldering and prevents thermal damage during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures the processor can withstand the soldering process without damage, enhancing durability.

Length: 19 mm

The 19mm length offers a compact form factor, making the processor suitable for space-constrained applications.

Peripheral IC Type: MICROPROCESSOR

The peripheral IC type of microprocessor indicates that the product is designed for handling a wide range of input and output devices, enhancing connectivity options.

Technology: CMOS

The CMOS technology used in the processor offers low power consumption and high noise immunity, making it suitable for battery-powered devices.

Terminal Form: BALL

The ball terminal form facilitates easy soldering and reliable connections, ensuring a stable electrical interface.

Maximum Supply Current: 5 mA

The low maximum supply current consumption makes the processor energy-efficient and ideal for battery-operated devices.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1V provides stable and efficient power delivery, ensuring consistent performance.

No. of DMA Channels: 2

The two DMA channels offer efficient data transfer capabilities, reducing CPU usage and enhancing overall system performance.

No. of Serial I/Os: 5

The five serial I/Os provide versatile connectivity options for external devices, expanding the functionality of the processor.

Terminal Pitch: 0.8 mm

The 0.8mm terminal pitch offers precise and secure connections, improving reliability in high-speed data transfer applications.

Format: FIXED POINT

The fixed-point format allows for fast and accurate arithmetic operations, making the processor suitable for real-time computation tasks.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that the processor has moderate moisture sensitivity, suitable for standard manufacturing and storage conditions.

Speed: 1400 rpm

The 1400 rpm speed provides high performance for demanding applications, ensuring smooth operation and responsiveness.

Low Power Mode: YES

The low power mode feature allows the processor to conserve energy when idle or under low processing load, maximizing efficiency.

Technical Specifications

Microprocessors T1023NSE7PQA attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

16

Bit Size:

64

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B525

JESD-609 Code:

e1

Length:

19 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

2

No. of External Interrupts:

6

No. of Serial I/Os:

5

No. of Terminals:

525

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA525,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.07 mm

Speed:

1400 rpm

Maximum Supply Current:

5 mA

Maximum Supply Voltage:

1.03 V

Minimum Supply Voltage:

.97 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

19 mm

Peripheral IC Type:

Trade Compliance

T1023NSE7PQA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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