Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The NXP Semiconductors T1022NXN7WQB microprocessor features a 32-bit architecture with 64-bit external data bus width and integrated cache. Operating at a max clock frequency of 133.3 MHz, it is suitable for applications requiring high-speed processing such as networking equipment and industrial automation systems. With low power mode enabled, it offers efficient performance in a compact square package measuring 23mm x 23mm.
Median Price
$124.140
Lifecycle Status
Suppliers In-Stock
8
In-Stock Inventory
1k+
Verical
1+ parts
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100+ parts
$132.421
1k+ parts
10k+ parts
Flip Electronics (Authorized)
Rochester
$115.860
$103.670
$97.570
Digiode
$122.303
Vyrian
Anansix
Nova Conductors
Flip Electronics
Corohmni
$86.222
Ampacity Inc.
$109.430
Corphita
$115.866
Microchip USA
$144.100
$140.250
$138.330
$136.410
Lixinc
UNI Independent Distributors
Argo Parts USA
Continental Prestige Electronics
Authorized Procurement Solutions
Aranea Global
PLastic/Epoxy material ensures durability and protection for the microprocessor, making it a reliable choice for long-term use.
Integrated cache allows for faster access to frequently used data, improving the overall performance of the microprocessor.
High maximum clock frequency enables fast processing speeds, making the microprocessor suitable for tasks that require quick data handling.
Large number of terminals provide versatility in connectivity options, allowing the microprocessor to be compatible with a wide range of devices.
CMOS technology offers low power consumption and high noise immunity, making the microprocessor efficient and reliable for various applications.
Microprocessors T1022NXN7WQB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors
Address Bus Width:
Bit Size:
Boundary Scan:
Maximum Clock Frequency:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
Length:
Low Power Mode:
Moisture Sensitivity Level (MSL):
No. of Terminals:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Seated Height:
Speed:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
T1022NXN7WQB Peripheral ICs trade compliance attributes, and parameters.
ECCN
3A991.A.1
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
PCN Packaging - All Dev Label Update 15/Dec/2020 Mult Dev Pkg Seal 15/Dec/2020
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
MBRA340T3G
Onsemi
MBRA340T3G by Onsemi is a Schottky rectifier diode with 40V reverse test voltage and 3A max output current. Ideal for power applications, it operates b/w -55 to 150°C, features matte tin terminal finish, and comes in a small outline package.
FDN306P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Maximum Drain Current (Abs) (ID): 2.6 A; Operating Mode: ENHANCEMENT MODE;
SS14
Leshan Radio
RECTIFIER DIODE; Surface Mount: YES; Config: SINGLE; No. of Phases: 1; No. of Elements: 1; Maximum Forward Voltage (VF): .5 V;
1N4148WT
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Silicon Standard
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Power Dissipation (Abs): .225 W; Maximum Drain-Source On Resistance: 7.5 ohm; Transistor Element Material: SILICON;
LM555CM
Harris Semiconductor
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Minimum DS Breakdown Voltage: 60 V; Package Shape: RECTANGULAR;
BAV99
ROHM
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Frontier Electronics
LM358N
Taejin Technology
OPERATIONAL AMPLIFIER; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LL4148GS08
Temic Semiconductors
LL4148GS08 by Temic Semiconductors is a glass diode with a max reverse recovery time of 0.008 us and max forward voltage of 1 V. It is a rectifier diode with a max output current of 0.15 A, ideal for applications requiring fast switching speeds and low power dissipation in electronic circuits.
NDT2955
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3 W; Package Style (Meter): SMALL OUTLINE; Maximum Drain Current (Abs) (ID): 2.5 A;
BSS138PS,115
Nexperia
N-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 2; No. of Terminals: 6; Minimum DS Breakdown Voltage: 60 V;
DP83848IVVX/NOPB
National Semiconductor
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: QFP; Package Shape: SQUARE;
Forward International Electronics
RECTIFIER DIODE; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; No. of Elements: 1; No. of Phases: 1; Maximum Output Current: 1 A;
M39029/58-360
Amphenol
CONNECTOR ACCESSORY; MIL Conformity: YES; Associated Military - Specifications: MIL-DTL-38999; Contact Gender: MALE; Terminal Type: CRIMP; IEC Conformity: NO;
Rectron
1N4148
NXP Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Weitron Technology
RECTIFIER DIODE; Surface Mount: NO; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; Maximum Output Current: .15 A; Terminal Finish: Tin/Lead (Sn/Pb);
ATSAMA5D27C-CU
Microchip Technology
ATSAMA5D27C-CU by Microchip Technology is a 32-bit microprocessor with integrated cache and 16-bit external data bus. It operates at a max clock frequency of 24 MHz, suitable for industrial applications requiring low power mode. The package style is grid array, low profile, fine pitch, making it ideal for compact designs.
FH8069004541900SRK0Y
Intel
Microprocessors;
SPC5200CVR400B
Freescale Semiconductor
MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 272; Package Code: BGA; Package Shape: SQUARE;
MPC8308CVMAGD
The Freescale Semiconductor MPC8308CVMAGD microprocessor features integrated cache, operates at a max clock frequency of 66.67 MHz, and has a low power mode for energy efficiency. Ideal for industrial applications requiring high-speed processing in a compact form factor with a temperature range from -40 to 105 °C.
MC7455ARX1000LG
Motorola
Motorola MC7455ARX1000LG is a 32-bit microprocessor with integrated cache and 64-bit external data bus. Operating at a max clock frequency of 133 MHz, it features low power mode and boundary scan for efficient performance. Ideal for applications requiring high-speed processing in compact devices due to its small package size and ceramic-metal sealed body material.
SB80C188-12
Rochester Electronics
SB80C188-12 by Rochester Electronics is a 16-bit microprocessor with 20-bit address bus, clocking at 25 MHz. It operates b/w 0-70°C and supports low power mode. Widely used in commercial applications for its CMOS technology and thin profile flatpack package style.
A80960KA25
The Intel A80960KA25 microprocessor features 32-bit address and data bus width, integrated cache, and operates at a max clock frequency of 32 MHz. Ideal for applications requiring high-speed processing such as embedded systems, industrial automation, and telecommunications equipment.
XPC8240LZU200E
NXP Semiconductors XPC8240LZU200E microprocessor features 32-bit address and data bus width, with a clock frequency of 66 MHz. Suitable for low power applications, it has integrated cache memory and supports boundary scan testing.
STM32MP153AAD3
STMicroelectronics
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
AM3352BZCE30
Texas Instruments
AM3352BZCE30 by Texas Instruments is a 32-bit microprocessor with integrated cache and 131072 RAM words. It operates at a max clock frequency of 26 MHz, suitable for low power applications. The package style is grid array, making it ideal for compact designs in various electronic devices.
PT-100
Sk Hynix
MPC5200CVR400B
NXP Semiconductors' MPC5200CVR400B microprocessor features 32-bit external data bus width, 13-bit address bus width, and a max clock frequency of 35 MHz. Ideal for industrial applications requiring low power mode, this CMOS technology-based processor offers integrated cache and boundary scan capabilities.
MCF5208CVM166
The NXP MCF5208CVM166 microprocessor features a 32-bit architecture with integrated cache and operates at a max clock frequency of 40 MHz. Ideal for industrial applications, it has a low power mode and supports boundary scan testing. With a temperature range from -40 to 85°C, this CMOS technology-based chip is suitable for various embedded systems requiring high performance in compact form factors.
AM3357BZCZA80
AM3357BZCZA80 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 64 DMA channels, and 26 MHz clock frequency. Ideal for industrial applications requiring low power mode, it features a max operating temperature of 105°C and boundary scan capability.
STM32MP151CAA3T
MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
AM3351BZCE60R
AM3351BZCE60R by Texas Instruments is a 32-bit microprocessor with 131072 RAM words and 64 DMA channels. It operates at a max clock frequency of 26 MHz, suitable for low power mode applications. With a package style of grid array and boundary scan support, it's ideal for embedded systems requiring high-speed processing in compact form factors.
MCF5233CVM150
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
P2010NXN2MHC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 40;
MPC8321ECVRADDCA
NXP Semiconductors' MPC8321ECVRADDCA is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 66.67 MHz. This CMOS technology chip features low power mode and boundary scan capabilities, making it ideal for applications requiring high-speed processing in compact devices.
FH8065301487717SR3UT
Intel FH8065301487717SR3UT is a 64-bit microprocessor with 1170 terminals, operating at speeds up to 1910 rpm. Suitable for industrial applications, it features integrated cache, CMOS technology, and a rectangular grid array package shape.
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T1023NSE7PQA
The NXP Semiconductors T1023NSE7PQA microprocessor features a 64-bit architecture, 16-bit address bus width, and 32-bit external data bus width. Ideal for applications requiring high-speed processing, it operates b/w 0 to 105°C with low power mode support.
T1023NXE7MQA
MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;
T1023NXE7PQA
T1022NXE7MQB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Width: 23 mm;
T1022NXE7PQB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
T1022NSN7MQB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Maximum Clock Frequency: 133.3 MHz;
T1022NXE7WQB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Technology: CMOS;
T1022NXN7MQA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Integrated Cache: YES;
T1022NSE7MQA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Maximum Seated Height: 2.07 mm;
T1022NSE7PQB
T1022NSN7PQB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Length: 23 mm;
T1022NXE7PQA
T1022NSN7MQA
T1022NXE7WQA
T1022NSE7PQA
T1022NSN7WQA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, FINE PITCH;
T1022NSE7WQA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
T1022NSN7WQB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Address Bus Width: 16;
T1022NSN7PQA
T1022FN7WQA
Teledyne E2v (Uk)
MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;
Supply Digital Components
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12,000 In-Stock
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