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AM3352BZCZA30

Texas Instruments

AM3352BZCZA30 by Texas Instruments

AM3352BZCZA30 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words and 16-bit external data bus width. It operates at a max clock frequency of 26 MHz, making it suitable for industrial applications requiring low power mode and fixed-point format processing.

Median Price

$14.320

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,558 parts In-Stock

1+ parts

$10.734

100+ parts

$9.376

1k+ parts

$6.466

10k+ parts

-

1,558

$10.734

$9.376

$6.466

-

DigiKey

USA . 844 parts In-Stock

1+ parts

$14.320

100+ parts

$10.550

1k+ parts

$9.087

10k+ parts

-

844

$14.320

$10.550

$9.087

-

Mouser Electronics

USA . 184 parts In-Stock

1+ parts

$14.320

100+ parts

$9.620

1k+ parts

$9.080

10k+ parts

-

184

$14.320

$9.620

$9.080

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,800 parts In-Stock

1+ parts

$10.197

100+ parts

-

1k+ parts

-

10k+ parts

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1,800

$10.197

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$11.251

100+ parts

-

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-

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100

$11.251

-

-

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VNN

France . 25,333 parts In-Stock

1+ parts

-

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-

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25,333

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-

-

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Vyrian

USA . 856 parts In-Stock

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-

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856

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 998 parts In-Stock

1+ parts

$9.120

100+ parts

-

1k+ parts

-

10k+ parts

-

998

$9.120

-

-

-

Semicontronic

India . 661 parts In-Stock

1+ parts

$9.120

100+ parts

$8.892

1k+ parts

$8.846

10k+ parts

-

661

$9.120

$8.892

$8.846

-

Corphita

USA . 4,535 parts In-Stock

1+ parts

$9.661

100+ parts

-

1k+ parts

-

10k+ parts

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4,535

$9.661

-

-

-

Continental Prestige Electronics

USA . 5,022 parts In-Stock

1+ parts

$10.313

100+ parts

-

1k+ parts

-

10k+ parts

$10.107

5,022

$10.313

-

-

$10.107

Netroflash

USA . 100 parts In-Stock

1+ parts

$11.251

100+ parts

-

1k+ parts

$10.688

10k+ parts

$10.463

100

$11.251

-

$10.688

$10.463

Parana Technologies

USA . 2,016 parts In-Stock

1+ parts

$13.356

100+ parts

-

1k+ parts

$13.873

10k+ parts

-

2,016

$13.356

-

$13.873

-

DigiPath Technology Company

USA . 915 parts In-Stock

1+ parts

$14.707

100+ parts

$13.530

1k+ parts

-

10k+ parts

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915

$14.707

$13.530

-

-

IDEA Electronic Components Group

UK . 1,092 parts In-Stock

1+ parts

$15.007

100+ parts

$14.257

1k+ parts

$13.506

10k+ parts

-

1,092

$15.007

$14.257

$13.506

-

ChromeModa Solutions

Germany . 1,052 parts In-Stock

1+ parts

$15.007

100+ parts

$12.306

1k+ parts

-

10k+ parts

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1,052

$15.007

$12.306

-

-

Corohmni

South Africa . 272 parts In-Stock

1+ parts

$69.847

100+ parts

-

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-

10k+ parts

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272

$69.847

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-

-

Lixinc

USA . 13,852 parts In-Stock

1+ parts

-

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13,852

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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100+ parts

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10,000

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-

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Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

-

100+ parts

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3,000

-

-

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Argo Parts USA

USA . 2,366 parts In-Stock

1+ parts

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2,366

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Perfect Parts

USA . 564 parts In-Stock

1+ parts

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100+ parts

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564

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Overview

Unlock the power of cutting-edge technology with the AM3352BZCZA30 by Texas Instruments. This top-of-the-line microprocessor boasts a combination of quality and reliability that only TI can deliver. Perfect for a wide range of applications, from industrial automation to consumer electronics, this product offers unmatched performance and efficiency. Experience seamless operation and enhanced functionality with the AM3352BZCZA30, your ultimate solution for all your processing needs. Upgrade to the future with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microprocessor, making it resistant to external elements.

Integrated Cache: YES

Having integrated cache improves processing speed and efficiency by reducing the need to access external memory frequently.

Maximum Supply Voltage: 1.144 V

Operating within this voltage range ensures stable performance without risking damage to the microprocessor.

Address Bus Width: 28

Having a wide address bus allows for efficient data transfer within the system, improving overall performance.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, the microprocessor can withstand demanding workloads and environments without overheating.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC-based microprocessor allows for simplified instructions, leading to faster processing speeds and improved performance.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high speed operation, making the microprocessor energy-efficient and reliable.

Technical Specifications

Microprocessors AM3352BZCZA30 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT MIN 0.912 V

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

64

No. of Terminals:

324

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.95/1.1

Qualification:

Not Qualified

RAM Words:

131072

Maximum Seated Height:

1.4 mm

Speed:

300 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

1.144 V

Minimum Supply Voltage:

1.056 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

AM3352BZCZA30 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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