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AM3354BZCZ60

Texas Instruments

AM3354BZCZ60 by Texas Instruments

AM3354BZCZ60 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 16-bit external data bus width, and max clock frequency of 26 MHz. It is ideal for applications requiring low power mode, such as embedded systems and IoT devices.

Median Price

$10.852

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 82,083 parts In-Stock

1+ parts

$11.751

100+ parts

$10.265

1k+ parts

$7.079

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82,083

$11.751

$10.265

$7.079

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DigiKey

USA . 252 parts In-Stock

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$15.380

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$11.367

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$10.265

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252

$15.380

$11.367

$10.265

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Chip1Stop

Japan . 1,512 parts In-Stock

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$9.954

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$9.015

1,512

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$9.954

$9.015

Future Electronics

Canada . 504 parts In-Stock

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$7.050

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504

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$7.050

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Distributors (In-Stock)

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Digiode

USA . 4,541 parts In-Stock

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$11.163

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$11.163

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Nova Conductors

Japan . 100 parts In-Stock

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$12.317

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$12.317

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Vyrian

USA . 21,025 parts In-Stock

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VNN

France . 4,037 parts In-Stock

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Chip Stock

USA . 3,840 parts In-Stock

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NexGen Digital

USA . 57 parts In-Stock

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NAC Semi

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Distributors (Availability)

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Semicontronic

India . 20,955 parts In-Stock

1+ parts

$8.460

100+ parts

$8.248

1k+ parts

$8.206

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20,955

$8.460

$8.248

$8.206

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Ampacity Inc.

Singapore . 20,947 parts In-Stock

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$8.460

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$8.460

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Corphita

USA . 677 parts In-Stock

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$10.576

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677

$10.576

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Continental Prestige Electronics

USA . 5,628 parts In-Stock

1+ parts

$11.291

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$11.065

5,628

$11.291

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$11.065

Netroflash

USA . 100 parts In-Stock

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$12.317

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$12.071

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100

$12.317

$12.071

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Corohmni

South Africa . 86 parts In-Stock

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$61.416

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$61.416

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Parana Technologies

USA . 1,467 parts In-Stock

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$67.732

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1,467

$67.732

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$70.531

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$67.005

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$67.005

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500

$70.531

$67.005

$67.005

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DigiPath Technology Company

USA . 288 parts In-Stock

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$74.581

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288

$74.581

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IDEA Electronic Components Group

UK . 1,541 parts In-Stock

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$76.103

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$72.298

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$68.493

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1,541

$76.103

$72.298

$68.493

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ChromeModa Solutions

Germany . 1,192 parts In-Stock

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$76.103

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$62.404

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Perfect Parts

USA . 39,437 parts In-Stock

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A-Z Elektronik GmbH

Germany . 14,679 parts In-Stock

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Lixinc

USA . 4,411 parts In-Stock

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Argo Parts USA

USA . 4,340 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,119 parts In-Stock

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Futuretech Components

Singapore . 2,600 parts In-Stock

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Kepictronics

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Authorized Procurement Solutions

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Robosynatics

Brazil . 250 parts In-Stock

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Lucentia Tech

USA . 250 parts In-Stock

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250

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Overview

Experience unmatched performance and reliability with the Texas Instruments AM3354BZCZ60 microprocessor. As a leading manufacturer in the industry, Texas Instruments offers cutting-edge technology and top-notch quality. This versatile microprocessor is perfect for a wide range of applications, providing seamless integration and exceptional efficiency. With its integrated cache, low power mode, and high clock frequency, this product delivers incredible value and benefits to customers. Upgrade your system with the AM3354BZCZ60 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this microprocessor lightweight and durable, perfect for portable devices.

Integrated Cache: YES

Having an integrated cache improves the performance of the microprocessor by providing quick access to frequently used data and instructions.

Surface Mount: YES

The surface mount design of this microprocessor allows for easy installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.144 V

The maximum supply voltage of 1.144V ensures that the microprocessor operates efficiently without the risk of damage from excess voltage.

On Chip Data RAM Width: 8

With an on-chip data RAM width of 8, this microprocessor can handle a larger amount of data at faster speeds.

Address Bus Width: 28

A wider address bus width of 28 allows this microprocessor to access a larger memory space, improving overall performance.

Package Shape: SQUARE

The square package shape of this microprocessor makes it easy to fit into compact spaces, ideal for small electronic devices.

Bit Size: 32

A bit size of 32 offers higher processing capabilities, making this microprocessor suitable for complex computing tasks.

Power Supplies (V): 0.95/1.1

The availability of multiple power supply options (0.95V and 1.1V) makes this microprocessor versatile and adaptable to different power requirements.

No. of Terminals: 324

The high number of terminals (324) on this microprocessor allows for efficient connectivity and communication with other components.

Technical Specifications

Microprocessors AM3354BZCZ60 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

64

No. of Terminals:

324

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.95/1.1

Qualification:

Not Qualified

RAM Words:

131072

Maximum Seated Height:

1.4 mm

Speed:

600 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

1.144 V

Minimum Supply Voltage:

1.056 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

AM3354BZCZ60 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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