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AM5706BCBDD

Texas Instruments

AM5706BCBDD by Texas Instruments

The Texas Instruments AM5706BCBDD microprocessor features 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for low power applications with a max clock frequency of 32 MHz. Suitable for use in various electronic devices requiring high-speed processing capabilities.

Median Price

$30.288

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 20 parts In-Stock

1+ parts

$4.561

100+ parts

-

1k+ parts

-

10k+ parts

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20

$4.561

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-

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Chip1Stop

Japan . 20 parts In-Stock

1+ parts

$24.100

100+ parts

-

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-

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20

$24.100

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Texas Instruments

USA . 279 parts In-Stock

1+ parts

$36.475

100+ parts

$32.422

1k+ parts

$23.840

10k+ parts

-

279

$36.475

$32.422

$23.840

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Mouser Electronics

USA . 2 parts In-Stock

1+ parts

$54.070

100+ parts

$38.930

1k+ parts

-

10k+ parts

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2

$54.070

$38.930

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Verical

USA . 20 parts In-Stock

1+ parts

-

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-

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20

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Distributors (In-Stock)

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Digiode

USA . 4,570 parts In-Stock

1+ parts

$4.333

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-

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4,570

$4.333

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$29.958

100+ parts

-

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100

$29.958

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Vyrian

USA . 5,861 parts In-Stock

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-

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5,861

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VNN

France . 2,001 parts In-Stock

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-

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2,001

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 42 parts In-Stock

1+ parts

$3.880

100+ parts

-

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-

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42

$3.880

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-

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Corphita

USA . 3,606 parts In-Stock

1+ parts

$4.105

100+ parts

-

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3,606

$4.105

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AZTECH Wire

Italy . 624 parts In-Stock

1+ parts

$11.590

100+ parts

-

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624

$11.590

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Continental Prestige Electronics

USA . 571 parts In-Stock

1+ parts

$29.958

100+ parts

-

1k+ parts

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10k+ parts

$29.358

571

$29.958

-

-

$29.358

Netroflash

USA . 100 parts In-Stock

1+ parts

$29.958

100+ parts

-

1k+ parts

$28.460

10k+ parts

$27.860

100

$29.958

-

$28.460

$27.860

Parana Technologies

USA . 68 parts In-Stock

1+ parts

$68.782

100+ parts

-

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68

$68.782

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ChromeModa Solutions

Germany . 1,576 parts In-Stock

1+ parts

$77.283

100+ parts

$63.372

1k+ parts

-

10k+ parts

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1,576

$77.283

$63.372

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IDEA Electronic Components Group

UK . 1,406 parts In-Stock

1+ parts

$77.283

100+ parts

$73.419

1k+ parts

$69.555

10k+ parts

-

1,406

$77.283

$73.419

$69.555

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Argo Parts USA

USA . 4,977 parts In-Stock

1+ parts

-

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4,977

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DigiPath Technology Company

USA . 1,426 parts In-Stock

1+ parts

-

100+ parts

$69.678

1k+ parts

-

10k+ parts

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1,426

-

$69.678

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Overview

Experience unparalleled performance and reliability with the AM5706BCBDD by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microprocessors that are perfect for a wide range of applications. From enhancing the efficiency of your system to improving overall speed and performance, this product offers unmatched value and benefits to customers. Upgrade your technology with the AM5706BCBDD and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microprocessor easy to handle and resistant to damage.

Integrated Cache: YES

Having an integrated cache improves the performance of the microprocessor by reducing access times to frequently used data.

Maximum Supply Voltage: 1.2 V

Operating at a low maximum supply voltage helps in reducing power consumption and heat generation.

Address Bus Width: 16

A wider address bus allows for larger memory addressing capabilities, enabling faster data access and processing.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style allows for a compact design, reducing the overall footprint of the microprocessor on a circuit board.

Technology: CMOS

CMOS technology is known for low power consumption, which is essential for energy-efficient devices.

Maximum Clock Frequency: 32 MHz

Operating at a high clock frequency allows for faster data processing and better performance in demanding tasks.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor, it is optimized for efficient instruction execution, leading to improved overall performance.

Technical Specifications

Microprocessors AM5706BCBDD attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Additional Features:

OPERATES AT 0.85V NOMINAL SUPPLY AFTER AVS ENABLE

Address Bus Width:

16

Boundary Scan:

YES

Maximum Clock Frequency:

32 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B538

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

538

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.298 mm

Speed:

500 rpm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.1 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

AM5706BCBDD Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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